JPWO2023214500A1 - - Google Patents

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Publication number
JPWO2023214500A1
JPWO2023214500A1 JP2024519184A JP2024519184A JPWO2023214500A1 JP WO2023214500 A1 JPWO2023214500 A1 JP WO2023214500A1 JP 2024519184 A JP2024519184 A JP 2024519184A JP 2024519184 A JP2024519184 A JP 2024519184A JP WO2023214500 A1 JPWO2023214500 A1 JP WO2023214500A1
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2024519184A
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Japanese (ja)
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JPWO2023214500A5 (https=
JP7820505B2 (ja
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Publication of JPWO2023214500A1 publication Critical patent/JPWO2023214500A1/ja
Publication of JPWO2023214500A5 publication Critical patent/JPWO2023214500A5/ja
Priority to JP2025053922A priority Critical patent/JP7799880B2/ja
Priority to JP2025102667A priority patent/JP7725758B1/ja
Priority to JP2025131436A priority patent/JP2025163208A/ja
Application granted granted Critical
Publication of JP7820505B2 publication Critical patent/JP7820505B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D80/00—Assemblies of multiple devices comprising at least one device covered by this subclass
    • H10D80/20—Assemblies of multiple devices comprising at least one device covered by this subclass the at least one device being covered by groups H10D1/00 - H10D48/00, e.g. assemblies comprising capacitors, power FETs or Schottky diodes
    • H10D80/251—FETs covered by H10D30/00, e.g. power FETs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D80/00—Assemblies of multiple devices comprising at least one device covered by this subclass
    • H10D80/20—Assemblies of multiple devices comprising at least one device covered by this subclass the at least one device being covered by groups H10D1/00 - H10D48/00, e.g. assemblies comprising capacitors, power FETs or Schottky diodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/411—Chip-supporting parts, e.g. die pads
    • H10W70/413—Insulating or insulated substrates serving as die pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/464—Additional interconnections in combination with leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/464—Additional interconnections in combination with leadframes
    • H10W70/468—Circuit boards
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H10W70/658—Shapes or dispositions of interconnections for devices provided for in groups H10D8/00 - H10D48/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/10—Configurations of laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/761—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors
    • H10W90/763—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/464—Additional interconnections in combination with leadframes
    • H10W70/467—Multilayered additional interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/853—On the same surface
    • H10W72/871—Bond wires and strap connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/886—Die-attach connectors and strap connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/761—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors
    • H10W90/764—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/811—Multiple chips on leadframes
JP2024519184A 2022-05-02 2023-04-13 半導体装置 Active JP7820505B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2025053922A JP7799880B2 (ja) 2022-05-02 2025-03-27 半導体装置、および半導体装置の製造方法
JP2025102667A JP7725758B1 (ja) 2022-05-02 2025-06-18 半導体装置、および半導体装置の製造方法
JP2025131436A JP2025163208A (ja) 2022-05-02 2025-08-06 半導体装置、および半導体装置の製造方法

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2022075921 2022-05-02
JP2022075921 2022-05-02
JP2022127149 2022-08-09
JP2022127149 2022-08-09
PCT/JP2023/015070 WO2023214500A1 (ja) 2022-05-02 2023-04-13 半導体装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2025053922A Division JP7799880B2 (ja) 2022-05-02 2025-03-27 半導体装置、および半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JPWO2023214500A1 true JPWO2023214500A1 (https=) 2023-11-09
JPWO2023214500A5 JPWO2023214500A5 (https=) 2025-02-03
JP7820505B2 JP7820505B2 (ja) 2026-02-25

Family

ID=88646429

Family Applications (4)

Application Number Title Priority Date Filing Date
JP2024519184A Active JP7820505B2 (ja) 2022-05-02 2023-04-13 半導体装置
JP2025053922A Active JP7799880B2 (ja) 2022-05-02 2025-03-27 半導体装置、および半導体装置の製造方法
JP2025102667A Active JP7725758B1 (ja) 2022-05-02 2025-06-18 半導体装置、および半導体装置の製造方法
JP2025131436A Pending JP2025163208A (ja) 2022-05-02 2025-08-06 半導体装置、および半導体装置の製造方法

Family Applications After (3)

Application Number Title Priority Date Filing Date
JP2025053922A Active JP7799880B2 (ja) 2022-05-02 2025-03-27 半導体装置、および半導体装置の製造方法
JP2025102667A Active JP7725758B1 (ja) 2022-05-02 2025-06-18 半導体装置、および半導体装置の製造方法
JP2025131436A Pending JP2025163208A (ja) 2022-05-02 2025-08-06 半導体装置、および半導体装置の製造方法

Country Status (6)

Country Link
US (2) US20250046664A1 (https=)
EP (3) EP4517823A4 (https=)
JP (4) JP7820505B2 (https=)
CN (2) CN119110995A (https=)
DE (1) DE112023001614T5 (https=)
WO (1) WO2023214500A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12417954B2 (en) * 2020-04-27 2025-09-16 Rohm Co., Ltd. Semiconductor device
JP7471526B2 (ja) * 2021-07-28 2024-04-19 三菱電機株式会社 回路接続装置、回転電機装置、及び回路接続装置の製造方法
WO2025154475A1 (ja) * 2024-01-18 2025-07-24 ローム株式会社 半導体装置および半導体装置の製造方法
TW202531523A (zh) * 2024-01-30 2025-08-01 朋程科技股份有限公司 半導體模組及其製作方法
DE102025101191B3 (de) 2025-01-14 2026-03-26 Volkswagen Aktiengesellschaft Vorrichtung für einen Stromwandler, Stromwandler und Fahrzeug

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04127996U (ja) * 1991-05-16 1992-11-20 ナイルス部品株式会社 モジユールにおける端子の接続構造
JP2010182879A (ja) * 2009-02-05 2010-08-19 Mitsubishi Electric Corp 電力用半導体装置とその製造方法
JP2011077280A (ja) * 2009-09-30 2011-04-14 Mitsubishi Electric Corp 電力用半導体装置およびその製造方法
JP2011165836A (ja) * 2010-02-09 2011-08-25 Mitsubishi Electric Corp 電力用半導体装置
JP2012089681A (ja) * 2010-10-20 2012-05-10 Mitsubishi Electric Corp パワー半導体装置
US20150103498A1 (en) * 2013-10-15 2015-04-16 Fairchild Korea Semiconductor Ltd. Power module package and method of manufacturing the same
WO2022080063A1 (ja) * 2020-10-14 2022-04-21 ローム株式会社 半導体モジュール

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10324139B4 (de) * 2003-05-26 2005-07-21 Infineon Technologies Ag Mikroelektromechanisches Bauteil und Verfahren zu seiner Herstellung
JP4569473B2 (ja) * 2006-01-04 2010-10-27 株式会社日立製作所 樹脂封止型パワー半導体モジュール
JP5261851B2 (ja) * 2010-04-08 2013-08-14 三菱電機株式会社 半導体装置の製造方法
EP2597675B1 (en) * 2011-04-05 2015-10-21 Panasonic Intellectual Property Management Co., Ltd. Encapsulated semiconductor device and method for producing same
JP6016611B2 (ja) * 2012-12-20 2016-10-26 三菱電機株式会社 半導体モジュール、その製造方法およびその接続方法
KR20150060036A (ko) * 2013-11-25 2015-06-03 삼성전기주식회사 전력 반도체 모듈 및 그 제조 방법
US10319659B2 (en) * 2017-10-13 2019-06-11 Semiconductor Components Industries, Llc Semiconductor package and related methods
JP2021040065A (ja) * 2019-09-04 2021-03-11 ローム株式会社 半導体装置の実装構造
US20230048878A1 (en) * 2020-01-30 2023-02-16 Hitachi Energy Switzerland Ag Power Semiconductor Module with Accessible Metal Clips
JP2021190505A (ja) 2020-05-27 2021-12-13 ローム株式会社 半導体装置
CN112271165A (zh) * 2020-09-28 2021-01-26 华为技术有限公司 半导体封装结构及其制造方法和半导体器件
JP7723678B2 (ja) * 2020-10-14 2025-08-14 ローム株式会社 半導体モジュール

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04127996U (ja) * 1991-05-16 1992-11-20 ナイルス部品株式会社 モジユールにおける端子の接続構造
JP2010182879A (ja) * 2009-02-05 2010-08-19 Mitsubishi Electric Corp 電力用半導体装置とその製造方法
JP2011077280A (ja) * 2009-09-30 2011-04-14 Mitsubishi Electric Corp 電力用半導体装置およびその製造方法
JP2011165836A (ja) * 2010-02-09 2011-08-25 Mitsubishi Electric Corp 電力用半導体装置
JP2012089681A (ja) * 2010-10-20 2012-05-10 Mitsubishi Electric Corp パワー半導体装置
US20150103498A1 (en) * 2013-10-15 2015-04-16 Fairchild Korea Semiconductor Ltd. Power module package and method of manufacturing the same
WO2022080063A1 (ja) * 2020-10-14 2022-04-21 ローム株式会社 半導体モジュール

Also Published As

Publication number Publication date
JP2025094258A (ja) 2025-06-24
JP7725758B1 (ja) 2025-08-19
CN121712087A (zh) 2026-03-20
EP4517823A4 (en) 2026-04-15
JP2025131877A (ja) 2025-09-09
JP7799880B2 (ja) 2026-01-15
EP4629292A3 (en) 2026-04-15
EP4707924A2 (en) 2026-03-11
US20250046664A1 (en) 2025-02-06
EP4629292A2 (en) 2025-10-08
WO2023214500A1 (ja) 2023-11-09
DE112023001614T5 (de) 2025-01-16
JP2025163208A (ja) 2025-10-28
EP4517823A1 (en) 2025-03-05
JP7820505B2 (ja) 2026-02-25
EP4707924A3 (en) 2026-04-22
CN120751756A (zh) 2025-10-03
CN119110995A (zh) 2024-12-10
US20250379111A1 (en) 2025-12-11

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