JPWO2023210449A5 - - Google Patents

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Publication number
JPWO2023210449A5
JPWO2023210449A5 JP2024517227A JP2024517227A JPWO2023210449A5 JP WO2023210449 A5 JPWO2023210449 A5 JP WO2023210449A5 JP 2024517227 A JP2024517227 A JP 2024517227A JP 2024517227 A JP2024517227 A JP 2024517227A JP WO2023210449 A5 JPWO2023210449 A5 JP WO2023210449A5
Authority
JP
Japan
Prior art keywords
temperature change
change rate
heating step
copper powder
joined
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024517227A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023210449A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/015511 external-priority patent/WO2023210449A1/ja
Publication of JPWO2023210449A1 publication Critical patent/JPWO2023210449A1/ja
Publication of JPWO2023210449A5 publication Critical patent/JPWO2023210449A5/ja
Pending legal-status Critical Current

Links

JP2024517227A 2022-04-28 2023-04-18 Pending JPWO2023210449A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022075061 2022-04-28
PCT/JP2023/015511 WO2023210449A1 (ja) 2022-04-28 2023-04-18 接合用銅ペースト、被接合体の接合方法、接合体の製造方法及び接合用銅ペーストの製造方法

Publications (2)

Publication Number Publication Date
JPWO2023210449A1 JPWO2023210449A1 (https=) 2023-11-02
JPWO2023210449A5 true JPWO2023210449A5 (https=) 2026-02-06

Family

ID=88518632

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024517227A Pending JPWO2023210449A1 (https=) 2022-04-28 2023-04-18

Country Status (7)

Country Link
US (1) US20250219005A1 (https=)
EP (1) EP4516429A4 (https=)
JP (1) JPWO2023210449A1 (https=)
KR (1) KR20250005995A (https=)
CN (1) CN118973743A (https=)
TW (1) TW202348334A (https=)
WO (1) WO2023210449A1 (https=)

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6199048B2 (ja) * 2013-02-28 2017-09-20 国立大学法人大阪大学 接合材
JP6337909B2 (ja) * 2014-02-04 2018-06-06 株式会社村田製作所 電子部品モジュールの製造方法
EP3348338B1 (en) 2015-09-07 2020-06-10 Hitachi Chemical Company, Ltd. Copper paste for joining, method for producing joined body, and method for producing semiconductor device
JP6842836B2 (ja) * 2016-02-29 2021-03-17 三井金属鉱業株式会社 銅ペースト及び銅の焼結体の製造方法
JP6955377B2 (ja) * 2017-06-16 2021-10-27 三井金属鉱業株式会社 銅粒子
JPWO2019188511A1 (ja) * 2018-03-29 2020-12-03 ハリマ化成株式会社 銅ペースト、接合方法および接合体の製造方法
KR102699895B1 (ko) * 2018-08-08 2024-08-29 미쓰이금속광업주식회사 도전체의 접합 구조의 제조 방법, 도전체의 접합 방법 및 접합용 조성물
CN112771628B (zh) * 2018-09-28 2022-09-13 纳美仕有限公司 导电性糊剂
JP7170968B2 (ja) * 2019-02-22 2022-11-15 株式会社大阪ソーダ 導電性接着剤を用いる接合方法
JP2020053404A (ja) * 2019-12-11 2020-04-02 三井金属鉱業株式会社 銅ペースト及び銅の焼結体の製造方法

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