JPWO2023190822A5 - - Google Patents
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- Publication number
- JPWO2023190822A5 JPWO2023190822A5 JP2024512768A JP2024512768A JPWO2023190822A5 JP WO2023190822 A5 JPWO2023190822 A5 JP WO2023190822A5 JP 2024512768 A JP2024512768 A JP 2024512768A JP 2024512768 A JP2024512768 A JP 2024512768A JP WO2023190822 A5 JPWO2023190822 A5 JP WO2023190822A5
- Authority
- JP
- Japan
- Prior art keywords
- hole
- hole conductor
- conductor
- wiring board
- board according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022056483 | 2022-03-30 | ||
| PCT/JP2023/013074 WO2023190822A1 (ja) | 2022-03-30 | 2023-03-30 | 配線基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023190822A1 JPWO2023190822A1 (cg-RX-API-DMAC7.html) | 2023-10-05 |
| JPWO2023190822A5 true JPWO2023190822A5 (cg-RX-API-DMAC7.html) | 2024-12-04 |
Family
ID=88202753
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024512768A Pending JPWO2023190822A1 (cg-RX-API-DMAC7.html) | 2022-03-30 | 2023-03-30 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20250240876A1 (cg-RX-API-DMAC7.html) |
| EP (1) | EP4503872A1 (cg-RX-API-DMAC7.html) |
| JP (1) | JPWO2023190822A1 (cg-RX-API-DMAC7.html) |
| KR (1) | KR20240151849A (cg-RX-API-DMAC7.html) |
| CN (1) | CN118975416A (cg-RX-API-DMAC7.html) |
| TW (1) | TWI859795B (cg-RX-API-DMAC7.html) |
| WO (1) | WO2023190822A1 (cg-RX-API-DMAC7.html) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI911024B (zh) * | 2025-01-22 | 2026-01-01 | 大陸商宏啟勝精密電子（秦皇島）有限公司 | 電路板及其製造方法 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI310670B (en) * | 2003-08-28 | 2009-06-01 | Ibm | Printed wiring board manufacturing method and printed wiring board |
| US8925192B2 (en) * | 2009-06-09 | 2015-01-06 | Ibiden Co., Ltd. | Printed wiring board and method for manufacturing the same |
| JP5763962B2 (ja) * | 2011-04-19 | 2015-08-12 | 日本特殊陶業株式会社 | セラミック配線基板、多数個取りセラミック配線基板、およびその製造方法 |
| JP2014110293A (ja) * | 2012-11-30 | 2014-06-12 | Ibiden Co Ltd | 半導体素子搭載用プリント配線板およびその製造方法 |
| SG11201608609UA (en) * | 2014-02-21 | 2016-11-29 | Mitsui Mining & Smelting Co | Copper clad laminate provided with protective layer and multilayered printed wiring board |
| JP2019016733A (ja) * | 2017-07-10 | 2019-01-31 | 大日本印刷株式会社 | 貫通電極基板、貫通電極基板の製造方法及び貫通電極基板を用いた半導体装置 |
| JP2021027167A (ja) | 2019-08-05 | 2021-02-22 | イビデン株式会社 | 配線基板 |
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2023
- 2023-03-30 CN CN202380029526.XA patent/CN118975416A/zh not_active Withdrawn
- 2023-03-30 TW TW112112311A patent/TWI859795B/zh active
- 2023-03-30 KR KR1020247031993A patent/KR20240151849A/ko not_active Withdrawn
- 2023-03-30 US US18/852,719 patent/US20250240876A1/en active Pending
- 2023-03-30 WO PCT/JP2023/013074 patent/WO2023190822A1/ja not_active Ceased
- 2023-03-30 EP EP23780830.8A patent/EP4503872A1/en not_active Withdrawn
- 2023-03-30 JP JP2024512768A patent/JPWO2023190822A1/ja active Pending