JP2025182074A5 - - Google Patents
Info
- Publication number
- JP2025182074A5 JP2025182074A5 JP2025168488A JP2025168488A JP2025182074A5 JP 2025182074 A5 JP2025182074 A5 JP 2025182074A5 JP 2025168488 A JP2025168488 A JP 2025168488A JP 2025168488 A JP2025168488 A JP 2025168488A JP 2025182074 A5 JP2025182074 A5 JP 2025182074A5
- Authority
- JP
- Japan
- Prior art keywords
- opening
- electrode substrate
- substrate according
- resin layer
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2025168488A JP2025182074A (ja) | 2019-12-26 | 2025-10-06 | 貫通電極基板 |
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019236195A JP6992797B2 (ja) | 2019-12-26 | 2019-12-26 | 貫通電極基板 |
| JP2021199203A JP7294394B2 (ja) | 2019-12-26 | 2021-12-08 | 貫通電極基板 |
| JP2023093944A JP7798084B2 (ja) | 2019-12-26 | 2023-06-07 | 貫通電極基板 |
| JP2025168488A JP2025182074A (ja) | 2019-12-26 | 2025-10-06 | 貫通電極基板 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023093944A Division JP7798084B2 (ja) | 2019-12-26 | 2023-06-07 | 貫通電極基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2025182074A JP2025182074A (ja) | 2025-12-11 |
| JP2025182074A5 true JP2025182074A5 (cg-RX-API-DMAC7.html) | 2026-05-22 |
Family
ID=70610276
Family Applications (4)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019236195A Active JP6992797B2 (ja) | 2019-12-26 | 2019-12-26 | 貫通電極基板 |
| JP2021199203A Active JP7294394B2 (ja) | 2019-12-26 | 2021-12-08 | 貫通電極基板 |
| JP2023093944A Active JP7798084B2 (ja) | 2019-12-26 | 2023-06-07 | 貫通電極基板 |
| JP2025168488A Pending JP2025182074A (ja) | 2019-12-26 | 2025-10-06 | 貫通電極基板 |
Family Applications Before (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019236195A Active JP6992797B2 (ja) | 2019-12-26 | 2019-12-26 | 貫通電極基板 |
| JP2021199203A Active JP7294394B2 (ja) | 2019-12-26 | 2021-12-08 | 貫通電極基板 |
| JP2023093944A Active JP7798084B2 (ja) | 2019-12-26 | 2023-06-07 | 貫通電極基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (4) | JP6992797B2 (cg-RX-API-DMAC7.html) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6992797B2 (ja) * | 2019-12-26 | 2022-01-13 | 大日本印刷株式会社 | 貫通電極基板 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04154187A (ja) * | 1990-10-18 | 1992-05-27 | Mitsubishi Materials Corp | スルーホール配線板の構造及びその製造方法 |
| JP2002232101A (ja) | 2001-01-31 | 2002-08-16 | Ngk Spark Plug Co Ltd | 配線基板 |
| JP2003197811A (ja) | 2001-12-27 | 2003-07-11 | Hitachi Ltd | ガラス基板及びその製造方法、並びに配線基板、半導体モジュール |
| JP3998984B2 (ja) | 2002-01-18 | 2007-10-31 | 富士通株式会社 | 回路基板及びその製造方法 |
| JP4287133B2 (ja) | 2002-12-11 | 2009-07-01 | 大日本印刷株式会社 | スルーホール配線基板の製造方法 |
| JP2008124398A (ja) | 2006-11-15 | 2008-05-29 | Shinko Electric Ind Co Ltd | 半導体パッケージおよびその製造方法 |
| CA2692595A1 (en) | 2007-07-05 | 2009-01-08 | Peter Nilsson | Low resistance through-wafer via |
| JP4722904B2 (ja) * | 2007-12-17 | 2011-07-13 | イビデン株式会社 | 多層プリント基板の製造法 |
| JP5471268B2 (ja) | 2008-12-26 | 2014-04-16 | 大日本印刷株式会社 | 貫通電極基板及びその製造方法 |
| JP5423020B2 (ja) | 2009-02-03 | 2014-02-19 | セイコーエプソン株式会社 | 半導体装置、半導体装置の製造方法、及び電子機器 |
| US8925192B2 (en) * | 2009-06-09 | 2015-01-06 | Ibiden Co., Ltd. | Printed wiring board and method for manufacturing the same |
| US20110048775A1 (en) | 2009-08-31 | 2011-03-03 | Ibiden Co., Ltd. | Printed wiring board and method for manufacturing the same |
| JP5560834B2 (ja) | 2010-03-29 | 2014-07-30 | 住友ベークライト株式会社 | 絶縁基板、絶縁基板の製造方法、プリント配線基板および半導体装置 |
| US20120229990A1 (en) | 2011-03-08 | 2012-09-13 | Ibiden Co., Ltd. | Multilayer printed wiring board and method for manufacturing multilayer printed wiring board |
| JP2013229421A (ja) * | 2012-04-25 | 2013-11-07 | Kyocer Slc Technologies Corp | 配線基板 |
| JP6992797B2 (ja) * | 2019-12-26 | 2022-01-13 | 大日本印刷株式会社 | 貫通電極基板 |
-
2019
- 2019-12-26 JP JP2019236195A patent/JP6992797B2/ja active Active
-
2021
- 2021-12-08 JP JP2021199203A patent/JP7294394B2/ja active Active
-
2023
- 2023-06-07 JP JP2023093944A patent/JP7798084B2/ja active Active
-
2025
- 2025-10-06 JP JP2025168488A patent/JP2025182074A/ja active Pending