JPWO2023189800A1 - - Google Patents
Info
- Publication number
- JPWO2023189800A1 JPWO2023189800A1 JP2024511866A JP2024511866A JPWO2023189800A1 JP WO2023189800 A1 JPWO2023189800 A1 JP WO2023189800A1 JP 2024511866 A JP2024511866 A JP 2024511866A JP 2024511866 A JP2024511866 A JP 2024511866A JP WO2023189800 A1 JPWO2023189800 A1 JP WO2023189800A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J13/00—Colloid chemistry, e.g. the production of colloidal materials or their solutions, not otherwise provided for; Making microcapsules or microballoons
- B01J13/02—Making microcapsules or microballoons
- B01J13/06—Making microcapsules or microballoons by phase separation
- B01J13/14—Polymerisation; cross-linking
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J13/00—Colloid chemistry, e.g. the production of colloidal materials or their solutions, not otherwise provided for; Making microcapsules or microballoons
- B01J13/02—Making microcapsules or microballoons
- B01J13/20—After-treatment of capsule walls, e.g. hardening
- B01J13/203—Exchange of core-forming material by diffusion through the capsule wall
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- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/113—Silicon oxides; Hydrates thereof
- C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
- C01B33/18—Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F130/00—Homopolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal
- C08F130/04—Homopolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal containing a metal
- C08F130/08—Homopolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal containing a metal containing silicon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/12—Polymerisation in non-solvents
- C08F2/16—Aqueous medium
- C08F2/18—Suspension polymerisation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F212/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
- C08F212/02—Monomers containing only one unsaturated aliphatic radical
- C08F212/04—Monomers containing only one unsaturated aliphatic radical containing one ring
- C08F212/06—Hydrocarbons
- C08F212/12—Monomers containing a branched unsaturated aliphatic radical or a ring substituted by an alkyl radical
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F212/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
- C08F212/34—Monomers containing two or more unsaturated aliphatic radicals
- C08F212/36—Divinylbenzene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
- C08F222/10—Esters
- C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
- C08F222/102—Esters of polyhydric alcohols or polyhydric phenols of dialcohols, e.g. ethylene glycol di(meth)acrylate or 1,4-butanediol dimethacrylate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
- C08F222/10—Esters
- C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
- C08F222/104—Esters of polyhydric alcohols or polyhydric phenols of tetraalcohols, e.g. pentaerythritol tetra(meth)acrylate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F292/00—Macromolecular compounds obtained by polymerising monomers on to inorganic materials
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F30/00—Homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal
- C08F30/04—Homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal containing a metal
- C08F30/08—Homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal containing a metal containing silicon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
- C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/003—Additives being defined by their diameter
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Dispersion Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Materials Engineering (AREA)
- Engineering & Computer Science (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Polymerisation Methods In General (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Manufacturing Of Micro-Capsules (AREA)
- Processes Of Treating Macromolecular Substances (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022054931 | 2022-03-30 | ||
| PCT/JP2023/010816 WO2023189800A1 (ja) | 2022-03-30 | 2023-03-20 | 中空粒子及びその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023189800A1 true JPWO2023189800A1 (https=) | 2023-10-05 |
| JPWO2023189800A5 JPWO2023189800A5 (https=) | 2026-01-29 |
Family
ID=88201089
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024511866A Pending JPWO2023189800A1 (https=) | 2022-03-30 | 2023-03-20 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20250197599A1 (https=) |
| EP (1) | EP4501973A1 (https=) |
| JP (1) | JPWO2023189800A1 (https=) |
| KR (1) | KR20240164882A (https=) |
| CN (1) | CN118829661A (https=) |
| TW (1) | TW202344302A (https=) |
| WO (1) | WO2023189800A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2025115628A1 (ja) * | 2023-11-29 | 2025-06-05 | 日本ゼオン株式会社 | 伝送損失を改善するシリカ |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3031272B2 (ja) * | 1996-12-05 | 2000-04-10 | 日本電気株式会社 | 樹脂組成物及びその成形体表面への導体形成方法 |
| JP3985633B2 (ja) * | 2002-08-26 | 2007-10-03 | 株式会社日立製作所 | 低誘電正接絶縁材料を用いた高周波用電子部品 |
| JP4171489B2 (ja) | 2003-01-28 | 2008-10-22 | 松下電工株式会社 | 中空粒子を含有する樹脂組成物、同組成物を含むプリプレグおよび積層板 |
| JP4955960B2 (ja) * | 2005-08-10 | 2012-06-20 | 積水化学工業株式会社 | 低誘電材料、低誘電板及び低誘電基板 |
| JP5199569B2 (ja) * | 2006-06-27 | 2013-05-15 | パナソニック株式会社 | 低誘電樹脂組成物、プリプレグ、金属張積層板、プリント配線板 |
| US8932705B2 (en) * | 2008-12-24 | 2015-01-13 | Samsung Electro-Mechanics Co., Ltd. | Thermosetting resin composition and board using the same |
| JP2010155909A (ja) * | 2008-12-26 | 2010-07-15 | Pilot Corporation | 中空樹脂粒子の製造方法および中空樹脂粒子 |
| JP5654268B2 (ja) * | 2010-06-24 | 2015-01-14 | 株式会社パイロットコーポレーション | 中空樹脂粒子の製造方法および中空樹脂粒子 |
| JP5513364B2 (ja) | 2010-12-24 | 2014-06-04 | 花王株式会社 | 中空シリカ粒子 |
| CN103962074B (zh) * | 2014-02-28 | 2016-02-24 | 中国科学院化学研究所 | 一种中空亚微米球、其制备方法与应用 |
| JP5992598B1 (ja) | 2015-09-29 | 2016-09-14 | 積水化成品工業株式会社 | 中空粒子及びその用途 |
| KR102202909B1 (ko) * | 2016-11-21 | 2021-01-14 | 주식회사 엘지화학 | 3d 프린팅용 조성물 |
| EP3778749A4 (en) * | 2018-03-30 | 2021-06-02 | JGC Catalysts and Chemicals Ltd. | ORGANIC-INORGANIC COMPOSITE PARTS, MANUFACTURING METHODS FOR THEM AND COSMETIC |
| WO2020066705A1 (ja) * | 2018-09-28 | 2020-04-02 | 日本ゼオン株式会社 | 樹脂組成物及びその成形体 |
| JP7524552B2 (ja) * | 2020-02-26 | 2024-07-30 | 住友ベークライト株式会社 | 樹脂組成物、樹脂シートおよび樹脂組成物の製造方法 |
| EP4112551A4 (en) | 2020-02-27 | 2024-08-28 | Agc Inc. | HOLLOW SILICA PARTICLES AND METHOD FOR MANUFACTURING HOLLOW SILICA PARTICLES |
| WO2022025123A1 (ja) * | 2020-07-29 | 2022-02-03 | 昭和電工マテリアルズ株式会社 | 樹脂組成物、硬化物、シート、積層体及びフレキシブルプリント配線板 |
| US20230357558A1 (en) * | 2020-09-18 | 2023-11-09 | Panasonic Intellectual Property Management Co., Ltd. | Resin composition, prepreg using same, film provided with resin, metal foil provided with resin, metal-clad laminate, and wiring board |
-
2023
- 2023-03-20 JP JP2024511866A patent/JPWO2023189800A1/ja active Pending
- 2023-03-20 WO PCT/JP2023/010816 patent/WO2023189800A1/ja not_active Ceased
- 2023-03-20 KR KR1020247028991A patent/KR20240164882A/ko active Pending
- 2023-03-20 EP EP23779816.0A patent/EP4501973A1/en active Pending
- 2023-03-20 US US18/845,532 patent/US20250197599A1/en active Pending
- 2023-03-20 CN CN202380025729.1A patent/CN118829661A/zh active Pending
- 2023-03-22 TW TW112110562A patent/TW202344302A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| EP4501973A1 (en) | 2025-02-05 |
| US20250197599A1 (en) | 2025-06-19 |
| WO2023189800A1 (ja) | 2023-10-05 |
| TW202344302A (zh) | 2023-11-16 |
| CN118829661A (zh) | 2024-10-22 |
| KR20240164882A (ko) | 2024-11-21 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20260121 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20260121 |