JPWO2023189188A5 - - Google Patents

Info

Publication number
JPWO2023189188A5
JPWO2023189188A5 JP2024511551A JP2024511551A JPWO2023189188A5 JP WO2023189188 A5 JPWO2023189188 A5 JP WO2023189188A5 JP 2024511551 A JP2024511551 A JP 2024511551A JP 2024511551 A JP2024511551 A JP 2024511551A JP WO2023189188 A5 JPWO2023189188 A5 JP WO2023189188A5
Authority
JP
Japan
Prior art keywords
solvent component
bonding layer
mass
thermoplastic resin
bonded body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024511551A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023189188A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/007911 external-priority patent/WO2023189188A1/ja
Publication of JPWO2023189188A1 publication Critical patent/JPWO2023189188A1/ja
Publication of JPWO2023189188A5 publication Critical patent/JPWO2023189188A5/ja
Pending legal-status Critical Current

Links

JP2024511551A 2022-03-31 2023-03-02 Pending JPWO2023189188A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022061261 2022-03-31
PCT/JP2023/007911 WO2023189188A1 (ja) 2022-03-31 2023-03-02 接合体及びその製造方法

Publications (2)

Publication Number Publication Date
JPWO2023189188A1 JPWO2023189188A1 (https=) 2023-10-05
JPWO2023189188A5 true JPWO2023189188A5 (https=) 2026-02-06

Family

ID=88201179

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024511551A Pending JPWO2023189188A1 (https=) 2022-03-31 2023-03-02

Country Status (5)

Country Link
US (1) US20250187304A1 (https=)
EP (1) EP4501628A1 (https=)
JP (1) JPWO2023189188A1 (https=)
CN (1) CN118434566A (https=)
WO (1) WO2023189188A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025197861A1 (ja) * 2024-03-19 2025-09-25 日本ゼオン株式会社 接合体及びその製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10286911A (ja) * 1997-04-14 1998-10-27 Nippon Zeon Co Ltd 積層体
JP3882706B2 (ja) * 2002-07-26 2007-02-21 Ｊｓｒ株式会社 環状オレフィン系付加重合体を含むコーティング材で被覆された基材、および積層材
JP4021391B2 (ja) * 2003-09-09 2007-12-12 住友ベークライト株式会社 マイクロチップ基板の接合方法及びマイクロチップ
US20090221750A1 (en) * 2005-03-22 2009-09-03 Zeon Corporation Thermoplastic Resin, Method for Producing Same and Molding Material
WO2009131070A1 (ja) * 2008-04-22 2009-10-29 アルプス電気株式会社 接合部材及びその製造方法
JP5561271B2 (ja) 2009-03-26 2014-07-30 日本ゼオン株式会社 樹脂組成物、樹脂膜及び電子部品
JP6123596B2 (ja) 2013-09-11 2017-05-10 日本ゼオン株式会社 結晶性樹脂組成物
JP6776553B2 (ja) * 2016-03-02 2020-10-28 コニカミノルタ株式会社 偏光板保護フィルム
WO2017199980A1 (ja) 2016-05-16 2017-11-23 日本ゼオン株式会社 水素化重合体、成形材料および樹脂成形体

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