JPWO2023153021A1 - - Google Patents
Info
- Publication number
- JPWO2023153021A1 JPWO2023153021A1 JP2023503422A JP2023503422A JPWO2023153021A1 JP WO2023153021 A1 JPWO2023153021 A1 JP WO2023153021A1 JP 2023503422 A JP2023503422 A JP 2023503422A JP 2023503422 A JP2023503422 A JP 2023503422A JP WO2023153021 A1 JPWO2023153021 A1 JP WO2023153021A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P50/00—Etching of wafers, substrates or parts of devices
- H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
- H10P50/24—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials
- H10P50/242—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials of Group IV materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
Landscapes
- Drying Of Semiconductors (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Physical Vapour Deposition (AREA)
- Chemical Vapour Deposition (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022018429 | 2022-02-09 | ||
| JP2022018429 | 2022-02-09 | ||
| PCT/JP2022/037638 WO2023153021A1 (ja) | 2022-02-09 | 2022-10-07 | 半導体製造装置用部材 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2023153021A1 true JPWO2023153021A1 (https=) | 2023-08-17 |
| JPWO2023153021A5 JPWO2023153021A5 (https=) | 2024-01-16 |
| JP7483121B2 JP7483121B2 (ja) | 2024-05-14 |
Family
ID=87564010
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023503422A Active JP7483121B2 (ja) | 2022-02-09 | 2022-10-07 | 半導体製造装置用部材 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP7483121B2 (https=) |
| WO (1) | WO2023153021A1 (https=) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2025134287A1 (ja) * | 2023-12-20 | 2025-06-26 | 日本碍子株式会社 | 半導体製造装置用部材 |
| WO2025134288A1 (ja) * | 2023-12-20 | 2025-06-26 | 日本碍子株式会社 | 半導体製造装置用部材 |
| JP7713116B1 (ja) * | 2023-12-20 | 2025-07-24 | 日本碍子株式会社 | 半導体製造装置用部材 |
| WO2025177564A1 (ja) * | 2024-02-22 | 2025-08-28 | 日本碍子株式会社 | 半導体製造装置用部材 |
| WO2025220065A1 (ja) * | 2024-04-15 | 2025-10-23 | 日本碍子株式会社 | ウエハ載置台 |
| JP2026036959A (ja) * | 2024-08-21 | 2026-03-06 | 住友大阪セメント株式会社 | 静電チャック部材、および静電チャック装置 |
| JP2026036969A (ja) * | 2024-08-21 | 2026-03-06 | 住友大阪セメント株式会社 | 静電チャック部材、および静電チャック装置 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006344766A (ja) * | 2005-06-09 | 2006-12-21 | Matsushita Electric Ind Co Ltd | プラズマ処理装置 |
| JP2016513947A (ja) * | 2013-03-15 | 2016-05-16 | アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ | 静電チャックの修理および改修のための方法および装置 |
| JP2019149422A (ja) * | 2018-02-26 | 2019-09-05 | 東京エレクトロン株式会社 | プラズマ処理装置及び載置台の製造方法 |
| JP2020150071A (ja) * | 2019-03-12 | 2020-09-17 | 新光電気工業株式会社 | 基板固定装置 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011061040A (ja) * | 2009-09-10 | 2011-03-24 | Tokyo Electron Ltd | 載置台構造及び処理装置 |
| JP6280012B2 (ja) * | 2014-09-29 | 2018-02-14 | 京セラ株式会社 | 試料保持具 |
| JP7130359B2 (ja) * | 2016-12-05 | 2022-09-05 | 東京エレクトロン株式会社 | プラズマ処理装置 |
| JP7149739B2 (ja) * | 2018-06-19 | 2022-10-07 | 東京エレクトロン株式会社 | 載置台及び基板処理装置 |
| WO2020106521A1 (en) * | 2018-11-19 | 2020-05-28 | Entegris, Inc. | Electrostatic chuck with charge dissipation coating |
| JP2021141277A (ja) * | 2020-03-09 | 2021-09-16 | 東京エレクトロン株式会社 | 載置台及びプラズマ処理装置 |
| WO2021241645A1 (ja) * | 2020-05-28 | 2021-12-02 | 京セラ株式会社 | 通気性プラグ、基板支持アセンブリおよびシャワープレート |
-
2022
- 2022-10-07 JP JP2023503422A patent/JP7483121B2/ja active Active
- 2022-10-07 WO PCT/JP2022/037638 patent/WO2023153021A1/ja not_active Ceased
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006344766A (ja) * | 2005-06-09 | 2006-12-21 | Matsushita Electric Ind Co Ltd | プラズマ処理装置 |
| JP2016513947A (ja) * | 2013-03-15 | 2016-05-16 | アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ | 静電チャックの修理および改修のための方法および装置 |
| JP2019149422A (ja) * | 2018-02-26 | 2019-09-05 | 東京エレクトロン株式会社 | プラズマ処理装置及び載置台の製造方法 |
| JP2020150071A (ja) * | 2019-03-12 | 2020-09-17 | 新光電気工業株式会社 | 基板固定装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP7483121B2 (ja) | 2024-05-14 |
| WO2023153021A1 (ja) | 2023-08-17 |
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