JP7483121B2 - 半導体製造装置用部材 - Google Patents

半導体製造装置用部材 Download PDF

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Publication number
JP7483121B2
JP7483121B2 JP2023503422A JP2023503422A JP7483121B2 JP 7483121 B2 JP7483121 B2 JP 7483121B2 JP 2023503422 A JP2023503422 A JP 2023503422A JP 2023503422 A JP2023503422 A JP 2023503422A JP 7483121 B2 JP7483121 B2 JP 7483121B2
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JP
Japan
Prior art keywords
wafer
conductive
plug
ceramic plate
conductive plug
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
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JP2023503422A
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English (en)
Japanese (ja)
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JPWO2023153021A5 (https=
JPWO2023153021A1 (https=
Inventor
靖也 井上
達也 久野
央史 竹林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NGK Insulators Ltd
Original Assignee
NGK Insulators Ltd
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Publication date
Application filed by NGK Insulators Ltd filed Critical NGK Insulators Ltd
Publication of JPWO2023153021A1 publication Critical patent/JPWO2023153021A1/ja
Publication of JPWO2023153021A5 publication Critical patent/JPWO2023153021A5/ja
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Publication of JP7483121B2 publication Critical patent/JP7483121B2/ja
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Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
    • H10P50/24—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials
    • H10P50/242—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials of Group IV materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping

Landscapes

  • Drying Of Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Vapour Deposition (AREA)
  • Chemical Vapour Deposition (AREA)
JP2023503422A 2022-02-09 2022-10-07 半導体製造装置用部材 Active JP7483121B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022018429 2022-02-09
JP2022018429 2022-02-09
PCT/JP2022/037638 WO2023153021A1 (ja) 2022-02-09 2022-10-07 半導体製造装置用部材

Publications (3)

Publication Number Publication Date
JPWO2023153021A1 JPWO2023153021A1 (https=) 2023-08-17
JPWO2023153021A5 JPWO2023153021A5 (https=) 2024-01-16
JP7483121B2 true JP7483121B2 (ja) 2024-05-14

Family

ID=87564010

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023503422A Active JP7483121B2 (ja) 2022-02-09 2022-10-07 半導体製造装置用部材

Country Status (2)

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JP (1) JP7483121B2 (https=)
WO (1) WO2023153021A1 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025134287A1 (ja) * 2023-12-20 2025-06-26 日本碍子株式会社 半導体製造装置用部材
WO2025134288A1 (ja) * 2023-12-20 2025-06-26 日本碍子株式会社 半導体製造装置用部材
JP7713116B1 (ja) * 2023-12-20 2025-07-24 日本碍子株式会社 半導体製造装置用部材
WO2025177564A1 (ja) * 2024-02-22 2025-08-28 日本碍子株式会社 半導体製造装置用部材
WO2025220065A1 (ja) * 2024-04-15 2025-10-23 日本碍子株式会社 ウエハ載置台
JP2026036959A (ja) * 2024-08-21 2026-03-06 住友大阪セメント株式会社 静電チャック部材、および静電チャック装置
JP2026036969A (ja) * 2024-08-21 2026-03-06 住友大阪セメント株式会社 静電チャック部材、および静電チャック装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006344766A (ja) 2005-06-09 2006-12-21 Matsushita Electric Ind Co Ltd プラズマ処理装置
JP2016513947A (ja) 2013-03-15 2016-05-16 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 静電チャックの修理および改修のための方法および装置
JP2019149422A (ja) 2018-02-26 2019-09-05 東京エレクトロン株式会社 プラズマ処理装置及び載置台の製造方法
JP2020150071A (ja) 2019-03-12 2020-09-17 新光電気工業株式会社 基板固定装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011061040A (ja) * 2009-09-10 2011-03-24 Tokyo Electron Ltd 載置台構造及び処理装置
JP6280012B2 (ja) * 2014-09-29 2018-02-14 京セラ株式会社 試料保持具
JP7130359B2 (ja) * 2016-12-05 2022-09-05 東京エレクトロン株式会社 プラズマ処理装置
JP7149739B2 (ja) * 2018-06-19 2022-10-07 東京エレクトロン株式会社 載置台及び基板処理装置
WO2020106521A1 (en) * 2018-11-19 2020-05-28 Entegris, Inc. Electrostatic chuck with charge dissipation coating
JP2021141277A (ja) * 2020-03-09 2021-09-16 東京エレクトロン株式会社 載置台及びプラズマ処理装置
WO2021241645A1 (ja) * 2020-05-28 2021-12-02 京セラ株式会社 通気性プラグ、基板支持アセンブリおよびシャワープレート

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006344766A (ja) 2005-06-09 2006-12-21 Matsushita Electric Ind Co Ltd プラズマ処理装置
JP2016513947A (ja) 2013-03-15 2016-05-16 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 静電チャックの修理および改修のための方法および装置
JP2019149422A (ja) 2018-02-26 2019-09-05 東京エレクトロン株式会社 プラズマ処理装置及び載置台の製造方法
JP2020150071A (ja) 2019-03-12 2020-09-17 新光電気工業株式会社 基板固定装置

Also Published As

Publication number Publication date
WO2023153021A1 (ja) 2023-08-17
JPWO2023153021A1 (https=) 2023-08-17

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