JPWO2023132262A5 - - Google Patents

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Publication number
JPWO2023132262A5
JPWO2023132262A5 JP2023572429A JP2023572429A JPWO2023132262A5 JP WO2023132262 A5 JPWO2023132262 A5 JP WO2023132262A5 JP 2023572429 A JP2023572429 A JP 2023572429A JP 2023572429 A JP2023572429 A JP 2023572429A JP WO2023132262 A5 JPWO2023132262 A5 JP WO2023132262A5
Authority
JP
Japan
Prior art keywords
coil
printed wiring
main surface
thickness
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023572429A
Other languages
English (en)
Japanese (ja)
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JPWO2023132262A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2022/047444 external-priority patent/WO2023132262A1/ja
Publication of JPWO2023132262A1 publication Critical patent/JPWO2023132262A1/ja
Publication of JPWO2023132262A5 publication Critical patent/JPWO2023132262A5/ja
Pending legal-status Critical Current

Links

JP2023572429A 2022-01-05 2022-12-22 Pending JPWO2023132262A1 (https=)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022000510 2022-01-05
JP2022020718 2022-02-14
PCT/JP2022/047444 WO2023132262A1 (ja) 2022-01-05 2022-12-22 コイル装置及びプリント配線板

Publications (2)

Publication Number Publication Date
JPWO2023132262A1 JPWO2023132262A1 (https=) 2023-07-13
JPWO2023132262A5 true JPWO2023132262A5 (https=) 2024-09-17

Family

ID=87073582

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023572429A Pending JPWO2023132262A1 (https=) 2022-01-05 2022-12-22

Country Status (4)

Country Link
US (1) US20250062061A1 (https=)
JP (1) JPWO2023132262A1 (https=)
TW (1) TW202344154A (https=)
WO (1) WO2023132262A1 (https=)

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8513535B2 (en) * 2009-10-30 2013-08-20 Kyocera Corporation Circuit board and structure using the same
JP2011151367A (ja) * 2009-12-25 2011-08-04 Sony Corp 回路基板積層モジュール及び電子機器
US9287034B2 (en) * 2012-02-27 2016-03-15 Ibiden Co., Ltd. Printed wiring board, inductor component, and method for manufacturing inductor component
JP2014007339A (ja) * 2012-06-26 2014-01-16 Ibiden Co Ltd インダクタ部品、その製造方法及びプリント配線板
JP2014032978A (ja) * 2012-07-31 2014-02-20 Ibiden Co Ltd インダクタ部品、インダクタ部品の製造方法及び配線板
JP6170790B2 (ja) * 2013-09-13 2017-07-26 新光電気工業株式会社 配線基板及びその製造方法
JP6536751B2 (ja) * 2016-08-18 2019-07-03 株式会社村田製作所 積層コイルおよびその製造方法
US11521785B2 (en) * 2016-11-18 2022-12-06 Hutchinson Technology Incorporated High density coil design and process
CN113474853B (zh) * 2019-02-27 2023-04-04 住友电工印刷电路株式会社 印刷配线板及印刷配线板的制造方法
WO2023149352A1 (ja) * 2022-02-07 2023-08-10 株式会社村田製作所 コイル、インダクタ部品およびインダクタアレイ

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