JPWO2023112380A1 - - Google Patents

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Publication number
JPWO2023112380A1
JPWO2023112380A1 JP2023567532A JP2023567532A JPWO2023112380A1 JP WO2023112380 A1 JPWO2023112380 A1 JP WO2023112380A1 JP 2023567532 A JP2023567532 A JP 2023567532A JP 2023567532 A JP2023567532 A JP 2023567532A JP WO2023112380 A1 JPWO2023112380 A1 JP WO2023112380A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023567532A
Other languages
Japanese (ja)
Other versions
JPWO2023112380A5 (https=
JP7708213B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed filed Critical
Publication of JPWO2023112380A1 publication Critical patent/JPWO2023112380A1/ja
Publication of JPWO2023112380A5 publication Critical patent/JPWO2023112380A5/ja
Application granted granted Critical
Publication of JP7708213B2 publication Critical patent/JP7708213B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02Details
    • H03H9/05Holders or supports
    • H03H9/0595Holders or supports the holder support and resonator being formed in one body
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02Details
    • H03H9/05Holders or supports
    • H03H9/10Mounting in enclosures
    • H03H9/1007Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/1035Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by two sealing substrates sandwiching the piezoelectric layer of the BAW device
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/15Constructional features of resonators consisting of piezoelectric or electrostrictive material
    • H03H9/21Crystal tuning forks
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/15Constructional features of resonators consisting of piezoelectric or electrostrictive material
    • H03H9/21Crystal tuning forks
    • H03H9/215Crystal tuning forks consisting of quartz
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/24Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
JP2023567532A 2021-12-15 2022-08-08 共振子及び共振装置 Active JP7708213B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021203493 2021-12-15
JP2021203493 2021-12-15
PCT/JP2022/030297 WO2023112380A1 (ja) 2021-12-15 2022-08-08 共振子及び共振装置

Publications (3)

Publication Number Publication Date
JPWO2023112380A1 true JPWO2023112380A1 (https=) 2023-06-22
JPWO2023112380A5 JPWO2023112380A5 (https=) 2024-08-23
JP7708213B2 JP7708213B2 (ja) 2025-07-15

Family

ID=86774220

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023567532A Active JP7708213B2 (ja) 2021-12-15 2022-08-08 共振子及び共振装置

Country Status (4)

Country Link
US (1) US20240333249A1 (https=)
JP (1) JP7708213B2 (https=)
CN (1) CN118402181A (https=)
WO (1) WO2023112380A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024002471A (ja) * 2022-06-24 2024-01-11 セイコーエプソン株式会社 振動デバイス

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015041152A1 (ja) * 2013-09-20 2015-03-26 株式会社村田製作所 振動装置及びその製造方法
WO2016174789A1 (ja) * 2015-04-27 2016-11-03 株式会社村田製作所 共振子及び共振装置
WO2017110126A1 (ja) * 2015-12-21 2017-06-29 株式会社村田製作所 共振子及び共振装置
WO2018123118A1 (ja) * 2016-12-27 2018-07-05 株式会社村田製作所 共振装置
WO2019155663A1 (ja) * 2018-02-09 2019-08-15 株式会社村田製作所 Memsデバイス
WO2020067484A1 (ja) * 2018-09-28 2020-04-02 株式会社村田製作所 共振子及び共振装置
WO2020261630A1 (ja) * 2019-06-26 2020-12-30 株式会社村田製作所 共振装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015041152A1 (ja) * 2013-09-20 2015-03-26 株式会社村田製作所 振動装置及びその製造方法
WO2016174789A1 (ja) * 2015-04-27 2016-11-03 株式会社村田製作所 共振子及び共振装置
WO2017110126A1 (ja) * 2015-12-21 2017-06-29 株式会社村田製作所 共振子及び共振装置
WO2018123118A1 (ja) * 2016-12-27 2018-07-05 株式会社村田製作所 共振装置
WO2019155663A1 (ja) * 2018-02-09 2019-08-15 株式会社村田製作所 Memsデバイス
WO2020067484A1 (ja) * 2018-09-28 2020-04-02 株式会社村田製作所 共振子及び共振装置
WO2020261630A1 (ja) * 2019-06-26 2020-12-30 株式会社村田製作所 共振装置

Also Published As

Publication number Publication date
CN118402181A (zh) 2024-07-26
WO2023112380A1 (ja) 2023-06-22
JP7708213B2 (ja) 2025-07-15
US20240333249A1 (en) 2024-10-03

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