JPWO2023095697A5 - - Google Patents
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- Publication number
- JPWO2023095697A5 JPWO2023095697A5 JP2023563644A JP2023563644A JPWO2023095697A5 JP WO2023095697 A5 JPWO2023095697 A5 JP WO2023095697A5 JP 2023563644 A JP2023563644 A JP 2023563644A JP 2023563644 A JP2023563644 A JP 2023563644A JP WO2023095697 A5 JPWO2023095697 A5 JP WO2023095697A5
- Authority
- JP
- Japan
- Prior art keywords
- protective layer
- electronic device
- protective
- protective sheet
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011241 protective layer Substances 0.000 claims description 61
- 230000001681 protective effect Effects 0.000 claims description 29
- 238000000034 method Methods 0.000 claims description 10
- 239000010410 layer Substances 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 239000003795 chemical substances by application Substances 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 229920001187 thermosetting polymer Polymers 0.000 claims description 2
- 239000000945 filler Substances 0.000 claims 6
- 239000000758 substrate Substances 0.000 claims 2
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 239000003985 ceramic capacitor Substances 0.000 claims 1
- 230000009477 glass transition Effects 0.000 claims 1
- 229920005749 polyurethane resin Polymers 0.000 claims 1
- 238000003825 pressing Methods 0.000 claims 1
- 239000000523 sample Substances 0.000 claims 1
- 239000000203 mixture Substances 0.000 description 37
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 16
- 150000001875 compounds Chemical class 0.000 description 10
- 239000004593 Epoxy Substances 0.000 description 9
- 239000005011 phenolic resin Substances 0.000 description 9
- 239000000377 silicon dioxide Substances 0.000 description 8
- ODIGIKRIUKFKHP-UHFFFAOYSA-N (n-propan-2-yloxycarbonylanilino) acetate Chemical compound CC(C)OC(=O)N(OC(C)=O)C1=CC=CC=C1 ODIGIKRIUKFKHP-UHFFFAOYSA-N 0.000 description 6
- 239000001913 cellulose Substances 0.000 description 6
- 229920002678 cellulose Polymers 0.000 description 6
- -1 glycidyl ester Chemical class 0.000 description 6
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 3
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 3
- 239000007983 Tris buffer Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 235000014113 dietary fatty acids Nutrition 0.000 description 3
- 239000000194 fatty acid Substances 0.000 description 3
- 229930195729 fatty acid Natural products 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 125000004069 aziridinyl group Chemical group 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- 150000004665 fatty acids Chemical class 0.000 description 2
- 229910052623 talc Inorganic materials 0.000 description 2
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 1
- AQYCJIBMNCSKNS-VAMGGRTRSA-N 2,2-bis[[(2r)-3-(aziridin-1-yl)-2-methylpropanoyl]oxymethyl]butyl (2r)-3-(aziridin-1-yl)-2-methylpropanoate Chemical compound C([C@@H](C)C(=O)OCC(CC)(COC(=O)[C@H](C)CN1CC1)COC(=O)[C@H](C)CN1CC1)N1CC1 AQYCJIBMNCSKNS-VAMGGRTRSA-N 0.000 description 1
- DVESGYVZVZLNRS-UHFFFAOYSA-N 3-(aziridin-1-yl)butanoic acid 2-ethyl-2-(hydroxymethyl)propane-1,3-diol Chemical compound CCC(CO)(CO)CO.CC(CC(O)=O)N1CC1.CC(CC(O)=O)N1CC1.CC(CC(O)=O)N1CC1 DVESGYVZVZLNRS-UHFFFAOYSA-N 0.000 description 1
- NOWKCMXCCJGMRR-UHFFFAOYSA-N Aziridine Chemical compound C1CN1 NOWKCMXCCJGMRR-UHFFFAOYSA-N 0.000 description 1
- 239000013032 Hydrocarbon resin Substances 0.000 description 1
- FYAMXEPQQLNQDM-UHFFFAOYSA-N Tris(1-aziridinyl)phosphine oxide Chemical compound C1CN1P(N1CC1)(=O)N1CC1 FYAMXEPQQLNQDM-UHFFFAOYSA-N 0.000 description 1
- 235000010724 Wisteria floribunda Nutrition 0.000 description 1
- XBGFZVIXZMWTAV-UHFFFAOYSA-N [3-[3-(aziridin-1-yl)propanoyloxy]-2,2-bis[3-(aziridin-1-yl)propanoyloxymethyl]propyl] 3-(aziridin-1-yl)propanoate Chemical compound C1CN1CCC(=O)OCC(COC(=O)CCN1CC1)(COC(=O)CCN1CC1)COC(=O)CCN1CC1 XBGFZVIXZMWTAV-UHFFFAOYSA-N 0.000 description 1
- YKTSYUJCYHOUJP-UHFFFAOYSA-N [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] Chemical compound [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] YKTSYUJCYHOUJP-UHFFFAOYSA-N 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 238000007611 bar coating method Methods 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- OHJMTUPIZMNBFR-UHFFFAOYSA-N biuret Chemical group NC(=O)NC(N)=O OHJMTUPIZMNBFR-UHFFFAOYSA-N 0.000 description 1
- 239000002981 blocking agent Substances 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 238000007607 die coating method Methods 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- 125000005442 diisocyanate group Chemical group 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 150000002191 fatty alcohols Chemical class 0.000 description 1
- 238000007756 gravure coating Methods 0.000 description 1
- 229920006270 hydrocarbon resin Polymers 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical group OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 1
- 238000007759 kiss coating Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- 229920003217 poly(methylsilsesquioxane) Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000000344 soap Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 238000010345 tape casting Methods 0.000 description 1
- 239000013638 trimer Substances 0.000 description 1
- AAAQKTZKLRYKHR-UHFFFAOYSA-N triphenylmethane Chemical compound C1=CC=CC=C1C(C=1C=CC=CC=1)C1=CC=CC=C1 AAAQKTZKLRYKHR-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 125000006839 xylylene group Chemical group 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2024220911A JP2025041717A (ja) | 2021-11-29 | 2024-12-17 | 保護シート、電子デバイスパッケージ及びその製造方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021193194 | 2021-11-29 | ||
| JP2021193194 | 2021-11-29 | ||
| PCT/JP2022/042570 WO2023095697A1 (ja) | 2021-11-29 | 2022-11-16 | 保護シート、電子デバイスパッケージ及びその製造方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024220911A Division JP2025041717A (ja) | 2021-11-29 | 2024-12-17 | 保護シート、電子デバイスパッケージ及びその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2023095697A1 JPWO2023095697A1 (https=) | 2023-06-01 |
| JPWO2023095697A5 true JPWO2023095697A5 (https=) | 2024-08-09 |
| JP7609301B2 JP7609301B2 (ja) | 2025-01-07 |
Family
ID=86539662
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023563644A Active JP7609301B2 (ja) | 2021-11-29 | 2022-11-16 | 保護シート、電子デバイスパッケージ及びその製造方法 |
| JP2024220911A Pending JP2025041717A (ja) | 2021-11-29 | 2024-12-17 | 保護シート、電子デバイスパッケージ及びその製造方法 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024220911A Pending JP2025041717A (ja) | 2021-11-29 | 2024-12-17 | 保護シート、電子デバイスパッケージ及びその製造方法 |
Country Status (5)
| Country | Link |
|---|---|
| JP (2) | JP7609301B2 (https=) |
| KR (1) | KR20240113761A (https=) |
| CN (1) | CN118266274A (https=) |
| TW (1) | TWI903125B (https=) |
| WO (1) | WO2023095697A1 (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2025062977A1 (ja) * | 2023-09-21 | 2025-03-27 | 日本発條株式会社 | 積層体製造用器具、及び積層体の製造方法 |
| JP7460013B1 (ja) * | 2023-11-30 | 2024-04-02 | ａｒｔｉｅｎｃｅ株式会社 | 電子部品搭載基板及び電子機器 |
| JP7783968B1 (ja) * | 2024-12-18 | 2025-12-10 | ａｒｔｉｅｎｃｅ株式会社 | 研磨パッド固定用粘着シート、剥離シート付きの研磨パッド固定用粘着シート、粘着層ａ付きの研磨パッド、剥離シートおよび粘着層ａ付きの研磨パッド、および研磨パッドを定盤に固定する方法 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7445968B2 (en) | 2005-12-16 | 2008-11-04 | Sige Semiconductor (U.S.), Corp. | Methods for integrated circuit module packaging and integrated circuit module packages |
| JP5349432B2 (ja) * | 2010-09-06 | 2013-11-20 | 日東電工株式会社 | 電子部品装置の製法およびそれに用いる電子部品封止用樹脂組成物シート |
| JP5893917B2 (ja) | 2011-12-28 | 2016-03-23 | 日東電工株式会社 | 電子部品用樹脂シート、電子部品用樹脂シートの製造方法、及び、半導体装置の製造方法 |
| JP6623513B2 (ja) | 2013-12-03 | 2019-12-25 | 東洋インキＳｃホールディングス株式会社 | 電子素子およびシート材 |
| US9683138B2 (en) * | 2015-06-26 | 2017-06-20 | Nitto Denko Corporation | Pressure-sensitive adhesive sheet and magnetic disk drive |
| CN207638990U (zh) | 2015-07-13 | 2018-07-20 | 株式会社村田制作所 | 树脂基板以及搭载有部件的树脂基板 |
| JP2020069720A (ja) | 2018-10-31 | 2020-05-07 | 京セラ株式会社 | 封止用シート及びそれを用いた電子部品の製造方法 |
| US20220124911A1 (en) | 2019-03-11 | 2022-04-21 | Sekisui Chemical Co., Ltd. | Coating agent and method for manufacturing module using the coating agent |
-
2022
- 2022-11-16 WO PCT/JP2022/042570 patent/WO2023095697A1/ja not_active Ceased
- 2022-11-16 KR KR1020247015303A patent/KR20240113761A/ko active Pending
- 2022-11-16 CN CN202280076985.9A patent/CN118266274A/zh active Pending
- 2022-11-16 JP JP2023563644A patent/JP7609301B2/ja active Active
- 2022-11-16 TW TW111143663A patent/TWI903125B/zh active
-
2024
- 2024-12-17 JP JP2024220911A patent/JP2025041717A/ja active Pending
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