JPWO2023074342A5 - - Google Patents

Download PDF

Info

Publication number
JPWO2023074342A5
JPWO2023074342A5 JP2023556280A JP2023556280A JPWO2023074342A5 JP WO2023074342 A5 JPWO2023074342 A5 JP WO2023074342A5 JP 2023556280 A JP2023556280 A JP 2023556280A JP 2023556280 A JP2023556280 A JP 2023556280A JP WO2023074342 A5 JPWO2023074342 A5 JP WO2023074342A5
Authority
JP
Japan
Prior art keywords
electronic
base
electronic device
mounting
mounting area
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023556280A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023074342A1 (https=
JP7753380B2 (ja
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2022/037801 external-priority patent/WO2023074342A1/ja
Publication of JPWO2023074342A1 publication Critical patent/JPWO2023074342A1/ja
Publication of JPWO2023074342A5 publication Critical patent/JPWO2023074342A5/ja
Application granted granted Critical
Publication of JP7753380B2 publication Critical patent/JP7753380B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2023556280A 2021-10-25 2022-10-11 電子素子実装用基板、電子装置、および電子モジュール Active JP7753380B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021174038 2021-10-25
JP2021174038 2021-10-25
PCT/JP2022/037801 WO2023074342A1 (ja) 2021-10-25 2022-10-11 電子素子実装用基板、電子装置、および電子モジュール

Publications (3)

Publication Number Publication Date
JPWO2023074342A1 JPWO2023074342A1 (https=) 2023-05-04
JPWO2023074342A5 true JPWO2023074342A5 (https=) 2024-07-10
JP7753380B2 JP7753380B2 (ja) 2025-10-14

Family

ID=86159291

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023556280A Active JP7753380B2 (ja) 2021-10-25 2022-10-11 電子素子実装用基板、電子装置、および電子モジュール

Country Status (4)

Country Link
EP (1) EP4425546A1 (https=)
JP (1) JP7753380B2 (https=)
CN (1) CN118251763A (https=)
WO (1) WO2023074342A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2025099093A (ja) * 2023-12-21 2025-07-03 Hoya株式会社 光源装置、電子内視鏡システム

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002344008A (ja) * 2001-05-17 2002-11-29 Fuji Xerox Co Ltd 光素子モジュール
JP2005101366A (ja) * 2003-09-25 2005-04-14 Kyocera Corp 高周波モジュール
JP6034158B2 (ja) * 2012-11-29 2016-11-30 京セラ株式会社 配線基板およびそれを用いた実装構造体
US9496247B2 (en) * 2013-08-26 2016-11-15 Optiz, Inc. Integrated camera module and method of making same
JP2017198950A (ja) * 2016-04-28 2017-11-02 APRESIA Systems株式会社 光通信モジュール
EP3499559B1 (en) * 2016-08-10 2023-11-22 Kyocera Corporation Package for mounting electrical element, array package and electrical device
JP2020155622A (ja) 2019-03-20 2020-09-24 富士ゼロックス株式会社 発光装置、光学装置および情報処理装置
JP7411350B2 (ja) * 2019-08-20 2024-01-11 ソニーセミコンダクタソリューションズ株式会社 測距装置、電子機器、および、測距装置の製造方法
JP7432387B2 (ja) * 2020-02-18 2024-02-16 株式会社Lixil 給水装置

Similar Documents

Publication Publication Date Title
JP3147087B2 (ja) 積層型半導体装置放熱構造
US8737073B2 (en) Systems and methods providing thermal spreading for an LED module
KR101841836B1 (ko) 다면 방열구조를 갖는 pcb 모듈, 및 이 모듈에 사용되는 방열 플레이트, 다층 pcb 어셈블리, 및 모듈 케이스
US20110292624A1 (en) Electronic control unit
CN214256936U (zh) 模块
US10465894B2 (en) Optical module
WO2016162991A1 (ja) 半導体装置および半導体装置の製造方法
KR20180016844A (ko) 다면 방열구조를 갖는 pcb 모듈 및 이 모듈에 사용되는 다층 pcb 어셈블리
KR102282209B1 (ko) 장착 조립체 및 조명 디바이스
KR102543495B1 (ko) 다면 방열구조를 갖는 pcb 모듈, 및 이 모듈에 사용되는 방열 플레이트, 다층 pcb 어셈블리, 및 모듈 케이스
US5500555A (en) Multi-layer semiconductor package substrate with thermally-conductive prepeg layer
US20160014879A1 (en) A printed circuit board (pcb) structure
CN2634572Y (zh) 具有模块化发光二极管的电路板结构
US20080156520A1 (en) Complex printed circuit board structure
JP2009147258A (ja) Ledパッケージおよび発光モジュール
JPWO2023074342A5 (https=)
JP2017130618A (ja) 電子部品放熱構造
JP2006221912A (ja) 半導体装置
JP2022070956A5 (https=)
JP2020047690A (ja) 電子回路装置
KR102592659B1 (ko) 다면 방열구조를 갖는 pcb 모듈 및 이 모듈에 사용되는 다층 pcb 어셈블리
JPWO2022249310A5 (ja) アンテナ装置
US20100149805A1 (en) Led lighting laminate with integrated cooling
KR20150002127A (ko) 인쇄회로기판
JP2014229804A (ja) 電子制御装置