JPWO2023058408A5 - - Google Patents

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Publication number
JPWO2023058408A5
JPWO2023058408A5 JP2023552767A JP2023552767A JPWO2023058408A5 JP WO2023058408 A5 JPWO2023058408 A5 JP WO2023058408A5 JP 2023552767 A JP2023552767 A JP 2023552767A JP 2023552767 A JP2023552767 A JP 2023552767A JP WO2023058408 A5 JPWO2023058408 A5 JP WO2023058408A5
Authority
JP
Japan
Prior art keywords
protective film
heat
resistant polymer
auxiliary tape
peeling auxiliary
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023552767A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023058408A1 (https=
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2022/033910 external-priority patent/WO2023058408A1/ja
Publication of JPWO2023058408A1 publication Critical patent/JPWO2023058408A1/ja
Publication of JPWO2023058408A5 publication Critical patent/JPWO2023058408A5/ja
Pending legal-status Critical Current

Links

JP2023552767A 2021-10-08 2022-09-09 Pending JPWO2023058408A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021165880 2021-10-08
PCT/JP2022/033910 WO2023058408A1 (ja) 2021-10-08 2022-09-09 保護フィルム剥離補助テープ付き積層体

Publications (2)

Publication Number Publication Date
JPWO2023058408A1 JPWO2023058408A1 (https=) 2023-04-13
JPWO2023058408A5 true JPWO2023058408A5 (https=) 2024-05-28

Family

ID=85804159

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023552767A Pending JPWO2023058408A1 (https=) 2021-10-08 2022-09-09

Country Status (5)

Country Link
JP (1) JPWO2023058408A1 (https=)
KR (1) KR20240087804A (https=)
CN (1) CN118076482A (https=)
TW (1) TW202315745A (https=)
WO (1) WO2023058408A1 (https=)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5152104U (https=) 1974-10-17 1976-04-20
JPS5699606U (https=) 1979-12-27 1981-08-06
JP2002018997A (ja) * 2000-07-11 2002-01-22 Nitto Denko Corp 光学部材の表面を保護する保護フィルム
TW558743B (en) * 2001-08-22 2003-10-21 Semiconductor Energy Lab Peeling method and method of manufacturing semiconductor device
TWI645967B (zh) * 2012-03-26 2019-01-01 日東電工股份有限公司 Surface protection film
JP5938313B2 (ja) * 2012-09-14 2016-06-22 ホシデン株式会社 剥離テープ及びそれを備えた液晶パネル、液晶モジュール
JP7167693B2 (ja) * 2018-12-20 2022-11-09 東洋紡株式会社 積層フィルム、積層体、及び、積層体の製造方法
JP7319815B2 (ja) * 2019-04-24 2023-08-02 日東電工株式会社 表面保護フィルムおよび光学部品

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