JPWO2023053836A1 - - Google Patents

Info

Publication number
JPWO2023053836A1
JPWO2023053836A1 JP2023550487A JP2023550487A JPWO2023053836A1 JP WO2023053836 A1 JPWO2023053836 A1 JP WO2023053836A1 JP 2023550487 A JP2023550487 A JP 2023550487A JP 2023550487 A JP2023550487 A JP 2023550487A JP WO2023053836 A1 JPWO2023053836 A1 JP WO2023053836A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023550487A
Other languages
Japanese (ja)
Other versions
JP7747051B2 (ja
JPWO2023053836A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023053836A1 publication Critical patent/JPWO2023053836A1/ja
Publication of JPWO2023053836A5 publication Critical patent/JPWO2023053836A5/ja
Application granted granted Critical
Publication of JP7747051B2 publication Critical patent/JP7747051B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
    • H03H9/0542—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a lateral arrangement
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03B—GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
    • H03B5/00—Generation of oscillations using amplifier with regenerative feedback from output to input
    • H03B5/30—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator
    • H03B5/32—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
    • H03H9/0547—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
    • H03H9/0547—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement
    • H03H9/0552—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement the device and the other elements being mounted on opposite sides of a common substrate
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
    • H03H9/1021—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being of the cantilever type
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
    • H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
    • H03H9/19—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Oscillators With Electromechanical Resonators (AREA)
  • Vibration Prevention Devices (AREA)
  • Apparatuses For Generation Of Mechanical Vibrations (AREA)
JP2023550487A 2021-09-30 2022-08-31 圧電振動デバイス Active JP7747051B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021161145 2021-09-30
JP2021161145 2021-09-30
PCT/JP2022/032821 WO2023053836A1 (ja) 2021-09-30 2022-08-31 圧電振動デバイス

Publications (3)

Publication Number Publication Date
JPWO2023053836A1 true JPWO2023053836A1 (https=) 2023-04-06
JPWO2023053836A5 JPWO2023053836A5 (https=) 2024-06-11
JP7747051B2 JP7747051B2 (ja) 2025-10-01

Family

ID=85780613

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023550487A Active JP7747051B2 (ja) 2021-09-30 2022-08-31 圧電振動デバイス

Country Status (5)

Country Link
US (1) US20240396521A1 (https=)
JP (1) JP7747051B2 (https=)
CN (1) CN117546406A (https=)
TW (1) TWI824717B (https=)
WO (1) WO2023053836A1 (https=)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003229512A (ja) * 2002-02-01 2003-08-15 Nec Toppan Circuit Solutions Toyama Inc 半導体チップ搭載用基板およびその製造方法と半導体装置およびその製造方法
JP2008277927A (ja) * 2007-04-26 2008-11-13 Nippon Dempa Kogyo Co Ltd 表面実装用の圧電発振器
JP2013176032A (ja) * 2012-01-27 2013-09-05 Daishinku Corp 表面実装型圧電発振器
JP2017200175A (ja) * 2016-04-01 2017-11-02 スカイワークスフィルターソリューションズジャパン株式会社 樹脂により画定された空洞を含む電子パッケージとその形成方法
JP2018014705A (ja) * 2016-07-07 2018-01-25 日本電波工業株式会社 恒温槽型水晶発振器

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4222147B2 (ja) * 2002-10-23 2009-02-12 セイコーエプソン株式会社 圧電発振器及び圧電発振器を利用した携帯電話装置および圧電発振器を利用した電子機器
JP3918794B2 (ja) * 2002-12-10 2007-05-23 セイコーエプソン株式会社 圧電発振器およびその製造方法並びに電子機器
JP4811232B2 (ja) * 2005-11-02 2011-11-09 パナソニック株式会社 電子部品パッケージ
WO2009057699A1 (ja) * 2007-10-30 2009-05-07 Kyocera Corporation 弾性波装置
CN109716646A (zh) * 2016-11-24 2019-05-03 株式会社大真空 压电振动器件以及具备其的sip模块
JP6780718B2 (ja) * 2019-02-28 2020-11-04 株式会社大真空 圧電振動デバイス

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003229512A (ja) * 2002-02-01 2003-08-15 Nec Toppan Circuit Solutions Toyama Inc 半導体チップ搭載用基板およびその製造方法と半導体装置およびその製造方法
JP2008277927A (ja) * 2007-04-26 2008-11-13 Nippon Dempa Kogyo Co Ltd 表面実装用の圧電発振器
JP2013176032A (ja) * 2012-01-27 2013-09-05 Daishinku Corp 表面実装型圧電発振器
JP2017200175A (ja) * 2016-04-01 2017-11-02 スカイワークスフィルターソリューションズジャパン株式会社 樹脂により画定された空洞を含む電子パッケージとその形成方法
JP2018014705A (ja) * 2016-07-07 2018-01-25 日本電波工業株式会社 恒温槽型水晶発振器

Also Published As

Publication number Publication date
TWI824717B (zh) 2023-12-01
JP7747051B2 (ja) 2025-10-01
US20240396521A1 (en) 2024-11-28
TW202322426A (zh) 2023-06-01
WO2023053836A1 (ja) 2023-04-06
CN117546406A (zh) 2024-02-09

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