JPWO2023047782A5 - - Google Patents
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- Publication number
- JPWO2023047782A5 JPWO2023047782A5 JP2023501346A JP2023501346A JPWO2023047782A5 JP WO2023047782 A5 JPWO2023047782 A5 JP WO2023047782A5 JP 2023501346 A JP2023501346 A JP 2023501346A JP 2023501346 A JP2023501346 A JP 2023501346A JP WO2023047782 A5 JPWO2023047782 A5 JP WO2023047782A5
- Authority
- JP
- Japan
- Prior art keywords
- group
- compound
- resin composition
- mass
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 150000001875 compounds Chemical class 0.000 claims 41
- 239000011342 resin composition Substances 0.000 claims 35
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims 17
- 125000000217 alkyl group Chemical group 0.000 claims 15
- 125000004432 carbon atom Chemical group C* 0.000 claims 15
- 239000011347 resin Substances 0.000 claims 12
- 229920005989 resin Polymers 0.000 claims 12
- 229920000642 polymer Polymers 0.000 claims 10
- 239000007787 solid Substances 0.000 claims 10
- 229920001187 thermosetting polymer Polymers 0.000 claims 10
- 125000003118 aryl group Chemical group 0.000 claims 8
- 125000000962 organic group Chemical group 0.000 claims 8
- -1 aromatic vinyl compound Chemical class 0.000 claims 7
- CREMABGTGYGIQB-UHFFFAOYSA-N carbon carbon Chemical compound C.C CREMABGTGYGIQB-UHFFFAOYSA-N 0.000 claims 6
- 239000011203 carbon fibre reinforced carbon Substances 0.000 claims 6
- 229920001955 polyphenylene ether Polymers 0.000 claims 6
- 125000003342 alkenyl group Chemical group 0.000 claims 4
- 125000000304 alkynyl group Chemical group 0.000 claims 4
- 125000001033 ether group Chemical group 0.000 claims 4
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims 3
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 claims 2
- 239000004593 Epoxy Substances 0.000 claims 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims 2
- 125000002723 alicyclic group Chemical group 0.000 claims 2
- 125000003545 alkoxy group Chemical group 0.000 claims 2
- 125000004414 alkyl thio group Chemical group 0.000 claims 2
- 125000005110 aryl thio group Chemical group 0.000 claims 2
- 125000004104 aryloxy group Chemical group 0.000 claims 2
- 150000005130 benzoxazines Chemical class 0.000 claims 2
- 150000001735 carboxylic acids Chemical class 0.000 claims 2
- 239000004643 cyanate ester Substances 0.000 claims 2
- 239000000945 filler Substances 0.000 claims 2
- 239000011888 foil Substances 0.000 claims 2
- 125000005843 halogen group Chemical group 0.000 claims 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 2
- 125000005395 methacrylic acid group Chemical group 0.000 claims 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims 2
- AHHWIHXENZJRFG-UHFFFAOYSA-N oxetane Chemical compound C1COC1 AHHWIHXENZJRFG-UHFFFAOYSA-N 0.000 claims 2
- 239000003505 polymerization initiator Substances 0.000 claims 2
- 125000003396 thiol group Chemical group [H]S* 0.000 claims 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims 2
- 229920002554 vinyl polymer Polymers 0.000 claims 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims 1
- 238000009835 boiling Methods 0.000 claims 1
- 150000001244 carboxylic acid anhydrides Chemical class 0.000 claims 1
- 239000000805 composite resin Substances 0.000 claims 1
- 239000004020 conductor Substances 0.000 claims 1
- 150000002148 esters Chemical class 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023179632A JP2024003007A (ja) | 2021-09-27 | 2023-10-18 | 樹脂組成物、プリプレグ、金属箔張積層板、樹脂複合シート、プリント配線板、および、半導体装置 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021157023 | 2021-09-27 | ||
| JP2021157023 | 2021-09-27 | ||
| PCT/JP2022/028443 WO2023047782A1 (ja) | 2021-09-27 | 2022-07-22 | 樹脂組成物、プリプレグ、金属箔張積層板、樹脂複合シート、プリント配線板、および、半導体装置 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023179632A Division JP2024003007A (ja) | 2021-09-27 | 2023-10-18 | 樹脂組成物、プリプレグ、金属箔張積層板、樹脂複合シート、プリント配線板、および、半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2023047782A1 JPWO2023047782A1 (https=) | 2023-03-30 |
| JPWO2023047782A5 true JPWO2023047782A5 (https=) | 2023-08-29 |
| JP7380943B2 JP7380943B2 (ja) | 2023-11-15 |
Family
ID=85720483
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023501346A Active JP7380943B2 (ja) | 2021-09-27 | 2022-07-22 | 樹脂組成物、プリプレグ、金属箔張積層板、樹脂複合シート、プリント配線板、および、半導体装置 |
| JP2023179632A Pending JP2024003007A (ja) | 2021-09-27 | 2023-10-18 | 樹脂組成物、プリプレグ、金属箔張積層板、樹脂複合シート、プリント配線板、および、半導体装置 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023179632A Pending JP2024003007A (ja) | 2021-09-27 | 2023-10-18 | 樹脂組成物、プリプレグ、金属箔張積層板、樹脂複合シート、プリント配線板、および、半導体装置 |
Country Status (5)
| Country | Link |
|---|---|
| JP (2) | JP7380943B2 (https=) |
| KR (1) | KR20240088944A (https=) |
| CN (1) | CN118019799A (https=) |
| TW (1) | TW202323426A (https=) |
| WO (1) | WO2023047782A1 (https=) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI835402B (zh) | 2022-11-11 | 2024-03-11 | 南亞塑膠工業股份有限公司 | 樹脂組成物 |
| JPWO2025142301A1 (https=) * | 2023-12-26 | 2025-07-03 | ||
| WO2025173457A1 (ja) * | 2024-02-16 | 2025-08-21 | パナソニックＩｐマネジメント株式会社 | 難燃剤、樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板、及び配線板 |
| WO2025192017A1 (ja) * | 2024-03-15 | 2025-09-18 | パナソニックＩｐマネジメント株式会社 | 難燃剤、樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板、及び配線板 |
| WO2025204033A1 (ja) * | 2024-03-26 | 2025-10-02 | パナソニックＩｐマネジメント株式会社 | 難燃剤、樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板、及び配線板 |
| TWI884749B (zh) * | 2024-03-28 | 2025-05-21 | 台光電子材料股份有限公司 | 樹脂組合物及使用其製成之物品 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006274169A (ja) * | 2005-03-30 | 2006-10-12 | Nippon Steel Chem Co Ltd | 硬化性樹脂組成物 |
| JP2007262191A (ja) * | 2006-03-28 | 2007-10-11 | Nippon Steel Chem Co Ltd | 難燃硬化性樹脂組成物 |
| JP2008248001A (ja) * | 2007-03-29 | 2008-10-16 | Nippon Steel Chem Co Ltd | 硬化性樹脂組成物 |
| JP6833723B2 (ja) | 2015-12-28 | 2021-02-24 | 日鉄ケミカル＆マテリアル株式会社 | 可溶性多官能ビニル芳香族共重合体、その製造方法及び硬化性組成物 |
| CN109385021A (zh) * | 2017-08-04 | 2019-02-26 | 广东生益科技股份有限公司 | 一种热固性树脂组合物及使用其制作的半固化片与覆金属箔层压板 |
| JP2019178233A (ja) * | 2018-03-30 | 2019-10-17 | 日鉄ケミカル＆マテリアル株式会社 | リン含有ビニル樹脂を含む低誘電難燃性組成物 |
| JP2020105352A (ja) * | 2018-12-27 | 2020-07-09 | 日鉄ケミカル＆マテリアル株式会社 | 硬化性樹脂組成物、プリプレグ、金属張積層板、及びプリント配線板 |
| TWI905094B (zh) * | 2019-02-28 | 2025-11-21 | 日商三菱瓦斯化學股份有限公司 | 樹脂組成物、預浸體、覆金屬箔疊層板、樹脂複合片、及印刷配線板 |
| TWI882987B (zh) * | 2019-02-28 | 2025-05-11 | 日商三菱瓦斯化學股份有限公司 | 樹脂組成物、預浸體、覆金屬箔疊層板、樹脂複合片、及印刷配線板 |
-
2022
- 2022-07-22 KR KR1020247012992A patent/KR20240088944A/ko active Pending
- 2022-07-22 CN CN202280064980.4A patent/CN118019799A/zh active Pending
- 2022-07-22 JP JP2023501346A patent/JP7380943B2/ja active Active
- 2022-07-22 WO PCT/JP2022/028443 patent/WO2023047782A1/ja not_active Ceased
- 2022-09-15 TW TW111134827A patent/TW202323426A/zh unknown
-
2023
- 2023-10-18 JP JP2023179632A patent/JP2024003007A/ja active Pending
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