JPWO2023026331A1 - - Google Patents
Info
- Publication number
- JPWO2023026331A1 JPWO2023026331A1 JP2022551293A JP2022551293A JPWO2023026331A1 JP WO2023026331 A1 JPWO2023026331 A1 JP WO2023026331A1 JP 2022551293 A JP2022551293 A JP 2022551293A JP 2022551293 A JP2022551293 A JP 2022551293A JP WO2023026331 A1 JPWO2023026331 A1 JP WO2023026331A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
- H01J37/32853—Hygiene
- H01J37/32862—In situ cleaning of vessels and/or internal parts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32458—Vessel
- H01J37/32477—Vessel characterised by the means for protecting vessels or internal parts, e.g. coatings
- H01J37/32495—Means for protecting the vessel against plasma
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P50/00—Etching of wafers, substrates or parts of devices
- H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
- H10P50/24—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials
- H10P50/242—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials of Group IV materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/30—Electron or ion beam tubes for processing objects
- H01J2237/31—Processing objects on a macro-scale
- H01J2237/3151—Etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/32—Processing objects by plasma generation
- H01J2237/33—Processing objects by plasma generation characterised by the type of processing
- H01J2237/334—Etching
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Drying Of Semiconductors (AREA)
- Chemical Vapour Deposition (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2021/030850 WO2023026331A1 (ja) | 2021-08-23 | 2021-08-23 | プラズマ処理装置用保護皮膜の洗浄方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2023026331A1 true JPWO2023026331A1 (https=) | 2023-03-02 |
| JPWO2023026331A5 JPWO2023026331A5 (https=) | 2023-08-02 |
| JP7358655B2 JP7358655B2 (ja) | 2023-10-10 |
Family
ID=85321630
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022551293A Active JP7358655B2 (ja) | 2021-08-23 | 2021-08-23 | プラズマ処理装置用保護皮膜の洗浄方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US12437978B2 (https=) |
| JP (1) | JP7358655B2 (https=) |
| KR (1) | KR102709625B1 (https=) |
| CN (1) | CN116018669B (https=) |
| TW (1) | TWI849469B (https=) |
| WO (1) | WO2023026331A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102914217B1 (ko) | 2024-07-11 | 2026-01-20 | (주)위지트 | 플라즈마 보호 피막 세정 방법 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007007782A1 (ja) * | 2005-07-14 | 2007-01-18 | Tohoku University | 多層構造体及びその洗浄方法 |
| JP2009174000A (ja) * | 2008-01-24 | 2009-08-06 | Shin Etsu Chem Co Ltd | セラミックス溶射部材及びその製造方法ならびにセラミックス溶射部材用研磨メディア |
| JP2017031457A (ja) * | 2015-07-31 | 2017-02-09 | 信越化学工業株式会社 | イットリウム系溶射皮膜、及びその製造方法 |
| JP2019519091A (ja) * | 2016-04-01 | 2019-07-04 | アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ | オキシフッ化物を沈殿させるクリーニングプロセス |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009176787A (ja) | 2008-01-22 | 2009-08-06 | Hitachi High-Technologies Corp | エッチング処理装置及びエッチング処理室用部材 |
| JP5530794B2 (ja) * | 2010-04-28 | 2014-06-25 | 株式会社日立ハイテクノロジーズ | 真空処理装置及びプラズマ処理方法 |
| JP2012222225A (ja) * | 2011-04-12 | 2012-11-12 | Hitachi High-Technologies Corp | プラズマ処理装置 |
| JP5750496B2 (ja) * | 2013-12-11 | 2015-07-22 | 株式会社日立ハイテクノロジーズ | プラズマ処理方法 |
| TWI721216B (zh) | 2016-10-13 | 2021-03-11 | 美商應用材料股份有限公司 | 用於電漿處理裝置中的腔室部件、包含其之裝置及製造其之方法 |
| JP7122854B2 (ja) * | 2018-04-20 | 2022-08-22 | 株式会社日立ハイテク | プラズマ処理装置およびプラズマ処理装置用部材、またはプラズマ処理装置の製造方法およびプラズマ処理装置用部材の製造方法 |
| US11276579B2 (en) * | 2018-11-14 | 2022-03-15 | Hitachi High-Tech Corporation | Substrate processing method and plasma processing apparatus |
| WO2021049208A1 (ja) | 2019-09-09 | 2021-03-18 | 富士フイルム株式会社 | 処理液、キット、処理液の製造方法、基板の洗浄方法、基板の処理方法 |
-
2021
- 2021-08-23 JP JP2022551293A patent/JP7358655B2/ja active Active
- 2021-08-23 CN CN202180017270.1A patent/CN116018669B/zh active Active
- 2021-08-23 US US17/802,639 patent/US12437978B2/en active Active
- 2021-08-23 KR KR1020227029775A patent/KR102709625B1/ko active Active
- 2021-08-23 WO PCT/JP2021/030850 patent/WO2023026331A1/ja not_active Ceased
-
2022
- 2022-08-05 TW TW111129529A patent/TWI849469B/zh active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007007782A1 (ja) * | 2005-07-14 | 2007-01-18 | Tohoku University | 多層構造体及びその洗浄方法 |
| JP2009174000A (ja) * | 2008-01-24 | 2009-08-06 | Shin Etsu Chem Co Ltd | セラミックス溶射部材及びその製造方法ならびにセラミックス溶射部材用研磨メディア |
| JP2017031457A (ja) * | 2015-07-31 | 2017-02-09 | 信越化学工業株式会社 | イットリウム系溶射皮膜、及びその製造方法 |
| JP2019519091A (ja) * | 2016-04-01 | 2019-07-04 | アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ | オキシフッ化物を沈殿させるクリーニングプロセス |
Also Published As
| Publication number | Publication date |
|---|---|
| US20240203708A1 (en) | 2024-06-20 |
| CN116018669A (zh) | 2023-04-25 |
| US12437978B2 (en) | 2025-10-07 |
| WO2023026331A1 (ja) | 2023-03-02 |
| JP7358655B2 (ja) | 2023-10-10 |
| KR20230031187A (ko) | 2023-03-07 |
| TWI849469B (zh) | 2024-07-21 |
| KR102709625B1 (ko) | 2024-09-26 |
| CN116018669B (zh) | 2025-09-19 |
| TW202309976A (zh) | 2023-03-01 |
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