JPWO2023022065A5 - - Google Patents

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Publication number
JPWO2023022065A5
JPWO2023022065A5 JP2023515811A JP2023515811A JPWO2023022065A5 JP WO2023022065 A5 JPWO2023022065 A5 JP WO2023022065A5 JP 2023515811 A JP2023515811 A JP 2023515811A JP 2023515811 A JP2023515811 A JP 2023515811A JP WO2023022065 A5 JPWO2023022065 A5 JP WO2023022065A5
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JP
Japan
Prior art keywords
metal film
lid
electrode
rfid module
opening
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023515811A
Other languages
English (en)
Japanese (ja)
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JP7364118B2 (ja
JPWO2023022065A1 (https=
Filing date
Publication date
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Priority claimed from PCT/JP2022/030391 external-priority patent/WO2023022065A1/ja
Publication of JPWO2023022065A1 publication Critical patent/JPWO2023022065A1/ja
Publication of JPWO2023022065A5 publication Critical patent/JPWO2023022065A5/ja
Application granted granted Critical
Publication of JP7364118B2 publication Critical patent/JP7364118B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2023515811A 2021-08-19 2022-08-09 容器 Active JP7364118B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021134368 2021-08-19
JP2021134368 2021-08-19
PCT/JP2022/030391 WO2023022065A1 (ja) 2021-08-19 2022-08-09 容器

Publications (3)

Publication Number Publication Date
JPWO2023022065A1 JPWO2023022065A1 (https=) 2023-02-23
JPWO2023022065A5 true JPWO2023022065A5 (https=) 2023-07-26
JP7364118B2 JP7364118B2 (ja) 2023-10-18

Family

ID=85240731

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023515811A Active JP7364118B2 (ja) 2021-08-19 2022-08-09 容器

Country Status (2)

Country Link
JP (1) JP7364118B2 (https=)
WO (1) WO2023022065A1 (https=)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8120492B2 (en) * 2005-02-25 2012-02-21 Tom Ahlkvist Scharfeld Blister package with integrated electronic tag and method of manufacture
JP4787572B2 (ja) * 2005-08-25 2011-10-05 株式会社日立製作所 無線icタグ、及び無線icタグの製造方法
JP6065464B2 (ja) 2012-08-29 2017-01-25 株式会社リコー Rfidタグ付きタブレットパッケージ
WO2015020042A1 (ja) 2013-08-09 2015-02-12 株式会社リコー 無線icタグ付き包装体および無線icタグ付き包装体の製造方法
JP7268304B2 (ja) 2018-08-28 2023-05-08 大日本印刷株式会社 Icチップ付き包装体
CN211264349U (zh) 2020-04-08 2020-08-14 杭州科洪网络科技有限公司 一种瓶盖用rfid标签及带有该rfid标签的瓶盖
JP7581743B2 (ja) 2020-09-29 2024-11-13 大日本印刷株式会社 Rfタグ付き包装容器
WO2022097422A1 (ja) 2020-11-09 2022-05-12 株式会社村田製作所 Rfidモジュールを備えた容器

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