JPWO2023013637A1 - - Google Patents
Info
- Publication number
- JPWO2023013637A1 JPWO2023013637A1 JP2023540362A JP2023540362A JPWO2023013637A1 JP WO2023013637 A1 JPWO2023013637 A1 JP WO2023013637A1 JP 2023540362 A JP2023540362 A JP 2023540362A JP 2023540362 A JP2023540362 A JP 2023540362A JP WO2023013637 A1 JPWO2023013637 A1 JP WO2023013637A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/19—Control of temperature characterised by the use of electric means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
- H10P72/0602—Temperature monitoring
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B11/00—Automatic controllers
- G05B11/01—Automatic controllers electric
- G05B11/32—Automatic controllers electric with inputs from more than one sensing element; with outputs to more than one correcting element
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0431—Apparatus for thermal treatment
- H10P72/0434—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
- H10P95/90—Thermal treatments, e.g. annealing or sintering
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Automation & Control Theory (AREA)
- Control Of Temperature (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021130031 | 2021-08-06 | ||
| PCT/JP2022/029650 WO2023013637A1 (ja) | 2021-08-06 | 2022-08-02 | ウエハ温度制御装置、ウエハ温度制御装置用制御方法、及び、ウエハ温度制御装置用プログラム |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023013637A1 true JPWO2023013637A1 (https=) | 2023-02-09 |
| JPWO2023013637A5 JPWO2023013637A5 (https=) | 2025-03-06 |
Family
ID=85155628
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023540362A Pending JPWO2023013637A1 (https=) | 2021-08-06 | 2022-08-02 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20250372417A1 (https=) |
| JP (1) | JPWO2023013637A1 (https=) |
| KR (1) | KR20240045237A (https=) |
| CN (1) | CN117730292A (https=) |
| TW (1) | TW202314429A (https=) |
| WO (1) | WO2023013637A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117311184B (zh) * | 2023-10-31 | 2025-01-07 | 深圳市华翌科技有限公司 | 一种基于物联网的智能家居调控系统 |
| CN120937120A (zh) * | 2024-03-11 | 2025-11-11 | 株式会社日立高新技术 | 等离子处理装置 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001318720A (ja) * | 2000-05-08 | 2001-11-16 | Komatsu Ltd | 温度制御方法及び装置 |
| JP2004119630A (ja) * | 2002-09-25 | 2004-04-15 | Komatsu Ltd | ウェハ温調装置 |
| JP2014081350A (ja) * | 2012-09-28 | 2014-05-08 | Tokyo Electron Ltd | 温度測定機構及び温度測定方法 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7266481B2 (ja) | 2019-07-19 | 2023-04-28 | 東京エレクトロン株式会社 | 温度制御装置、温度制御方法、および検査装置 |
-
2022
- 2022-08-02 KR KR1020247005982A patent/KR20240045237A/ko active Pending
- 2022-08-02 US US18/681,369 patent/US20250372417A1/en active Pending
- 2022-08-02 WO PCT/JP2022/029650 patent/WO2023013637A1/ja not_active Ceased
- 2022-08-02 CN CN202280052970.9A patent/CN117730292A/zh active Pending
- 2022-08-02 JP JP2023540362A patent/JPWO2023013637A1/ja active Pending
- 2022-08-04 TW TW111129413A patent/TW202314429A/zh unknown
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001318720A (ja) * | 2000-05-08 | 2001-11-16 | Komatsu Ltd | 温度制御方法及び装置 |
| JP2004119630A (ja) * | 2002-09-25 | 2004-04-15 | Komatsu Ltd | ウェハ温調装置 |
| JP2014081350A (ja) * | 2012-09-28 | 2014-05-08 | Tokyo Electron Ltd | 温度測定機構及び温度測定方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20240045237A (ko) | 2024-04-05 |
| CN117730292A (zh) | 2024-03-19 |
| TW202314429A (zh) | 2023-04-01 |
| US20250372417A1 (en) | 2025-12-04 |
| WO2023013637A1 (ja) | 2023-02-09 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20241220 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20250226 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20260303 |