KR20240045237A - 웨이퍼 온도 제어 장치, 웨이퍼 온도 제어 장치용 제어 방법, 및 웨이퍼 온도 제어 장치용 프로그램 - Google Patents

웨이퍼 온도 제어 장치, 웨이퍼 온도 제어 장치용 제어 방법, 및 웨이퍼 온도 제어 장치용 프로그램 Download PDF

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Publication number
KR20240045237A
KR20240045237A KR1020247005982A KR20247005982A KR20240045237A KR 20240045237 A KR20240045237 A KR 20240045237A KR 1020247005982 A KR1020247005982 A KR 1020247005982A KR 20247005982 A KR20247005982 A KR 20247005982A KR 20240045237 A KR20240045237 A KR 20240045237A
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KR
South Korea
Prior art keywords
temperature
wafer
nearby
control device
cooler
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020247005982A
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English (en)
Korean (ko)
Inventor
고타로 다키지리
다이스케 하야시
Original Assignee
가부시키가이샤 호리바 에스텍
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 호리바 에스텍 filed Critical 가부시키가이샤 호리바 에스텍
Publication of KR20240045237A publication Critical patent/KR20240045237A/ko
Pending legal-status Critical Current

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    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • G05D23/19—Control of temperature characterised by the use of electric means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0602—Temperature monitoring
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B11/00—Automatic controllers
    • G05B11/01—Automatic controllers electric
    • G05B11/32—Automatic controllers electric with inputs from more than one sensing element; with outputs to more than one correcting element
    • H01L21/02—
    • H01L21/324—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/90—Thermal treatments, e.g. annealing or sintering

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Automation & Control Theory (AREA)
  • Control Of Temperature (AREA)
KR1020247005982A 2021-08-06 2022-08-02 웨이퍼 온도 제어 장치, 웨이퍼 온도 제어 장치용 제어 방법, 및 웨이퍼 온도 제어 장치용 프로그램 Pending KR20240045237A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2021-130031 2021-08-06
JP2021130031 2021-08-06
PCT/JP2022/029650 WO2023013637A1 (ja) 2021-08-06 2022-08-02 ウエハ温度制御装置、ウエハ温度制御装置用制御方法、及び、ウエハ温度制御装置用プログラム

Publications (1)

Publication Number Publication Date
KR20240045237A true KR20240045237A (ko) 2024-04-05

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020247005982A Pending KR20240045237A (ko) 2021-08-06 2022-08-02 웨이퍼 온도 제어 장치, 웨이퍼 온도 제어 장치용 제어 방법, 및 웨이퍼 온도 제어 장치용 프로그램

Country Status (6)

Country Link
US (1) US20250372417A1 (https=)
JP (1) JPWO2023013637A1 (https=)
KR (1) KR20240045237A (https=)
CN (1) CN117730292A (https=)
TW (1) TW202314429A (https=)
WO (1) WO2023013637A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117311184B (zh) * 2023-10-31 2025-01-07 深圳市华翌科技有限公司 一种基于物联网的智能家居调控系统
CN120937120A (zh) * 2024-03-11 2025-11-11 株式会社日立高新技术 等离子处理装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021019066A (ja) 2019-07-19 2021-02-15 東京エレクトロン株式会社 温度制御装置、温度制御方法、および検査装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001318720A (ja) * 2000-05-08 2001-11-16 Komatsu Ltd 温度制御方法及び装置
JP2004119630A (ja) * 2002-09-25 2004-04-15 Komatsu Ltd ウェハ温調装置
JP6047411B2 (ja) * 2012-09-28 2016-12-21 東京エレクトロン株式会社 温度測定機構及び温度測定方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021019066A (ja) 2019-07-19 2021-02-15 東京エレクトロン株式会社 温度制御装置、温度制御方法、および検査装置

Also Published As

Publication number Publication date
JPWO2023013637A1 (https=) 2023-02-09
CN117730292A (zh) 2024-03-19
TW202314429A (zh) 2023-04-01
US20250372417A1 (en) 2025-12-04
WO2023013637A1 (ja) 2023-02-09

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