TW202314429A - 晶圓溫度控制裝置、晶圓溫度控制裝置用控制方法及記錄有晶圓溫度控制裝置用程式的程式記錄媒體 - Google Patents

晶圓溫度控制裝置、晶圓溫度控制裝置用控制方法及記錄有晶圓溫度控制裝置用程式的程式記錄媒體 Download PDF

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Publication number
TW202314429A
TW202314429A TW111129413A TW111129413A TW202314429A TW 202314429 A TW202314429 A TW 202314429A TW 111129413 A TW111129413 A TW 111129413A TW 111129413 A TW111129413 A TW 111129413A TW 202314429 A TW202314429 A TW 202314429A
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TW
Taiwan
Prior art keywords
temperature
wafer
control device
cooler
cooling
Prior art date
Application number
TW111129413A
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English (en)
Chinese (zh)
Inventor
瀧尻興太郎
林大介
Original Assignee
日商堀場Ｓｔｅｃ股份有限公司
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Publication date
Application filed by 日商堀場Ｓｔｅｃ股份有限公司 filed Critical 日商堀場Ｓｔｅｃ股份有限公司
Publication of TW202314429A publication Critical patent/TW202314429A/zh

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    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • G05D23/19—Control of temperature characterised by the use of electric means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0602—Temperature monitoring
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B11/00—Automatic controllers
    • G05B11/01—Automatic controllers electric
    • G05B11/32—Automatic controllers electric with inputs from more than one sensing element; with outputs to more than one correcting element
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/90—Thermal treatments, e.g. annealing or sintering

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Automation & Control Theory (AREA)
  • Control Of Temperature (AREA)
TW111129413A 2021-08-06 2022-08-04 晶圓溫度控制裝置、晶圓溫度控制裝置用控制方法及記錄有晶圓溫度控制裝置用程式的程式記錄媒體 TW202314429A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021130031 2021-08-06
JP2021-130031 2021-08-06

Publications (1)

Publication Number Publication Date
TW202314429A true TW202314429A (zh) 2023-04-01

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ID=85155628

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111129413A TW202314429A (zh) 2021-08-06 2022-08-04 晶圓溫度控制裝置、晶圓溫度控制裝置用控制方法及記錄有晶圓溫度控制裝置用程式的程式記錄媒體

Country Status (6)

Country Link
US (1) US20250372417A1 (https=)
JP (1) JPWO2023013637A1 (https=)
KR (1) KR20240045237A (https=)
CN (1) CN117730292A (https=)
TW (1) TW202314429A (https=)
WO (1) WO2023013637A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI919866B (zh) 2024-04-26 2026-03-21 南韓商Ｈｓ高科技股份有限公司 發光二極體（ｌｅｄ）加熱器系統以及配備所述加熱器系統的半導體晶圓處理裝置

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117311184B (zh) * 2023-10-31 2025-01-07 深圳市华翌科技有限公司 一种基于物联网的智能家居调控系统
CN120937120A (zh) * 2024-03-11 2025-11-11 株式会社日立高新技术 等离子处理装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001318720A (ja) * 2000-05-08 2001-11-16 Komatsu Ltd 温度制御方法及び装置
JP2004119630A (ja) * 2002-09-25 2004-04-15 Komatsu Ltd ウェハ温調装置
JP6047411B2 (ja) * 2012-09-28 2016-12-21 東京エレクトロン株式会社 温度測定機構及び温度測定方法
JP7266481B2 (ja) 2019-07-19 2023-04-28 東京エレクトロン株式会社 温度制御装置、温度制御方法、および検査装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI919866B (zh) 2024-04-26 2026-03-21 南韓商Ｈｓ高科技股份有限公司 發光二極體（ｌｅｄ）加熱器系統以及配備所述加熱器系統的半導體晶圓處理裝置

Also Published As

Publication number Publication date
KR20240045237A (ko) 2024-04-05
JPWO2023013637A1 (https=) 2023-02-09
CN117730292A (zh) 2024-03-19
US20250372417A1 (en) 2025-12-04
WO2023013637A1 (ja) 2023-02-09

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