CN117730292A - 晶圆温度控制装置、晶圆温度控制装置用控制方法及晶圆温度控制装置用程序 - Google Patents

晶圆温度控制装置、晶圆温度控制装置用控制方法及晶圆温度控制装置用程序 Download PDF

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Publication number
CN117730292A
CN117730292A CN202280052970.9A CN202280052970A CN117730292A CN 117730292 A CN117730292 A CN 117730292A CN 202280052970 A CN202280052970 A CN 202280052970A CN 117730292 A CN117730292 A CN 117730292A
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CN
China
Prior art keywords
temperature
wafer
vicinity
cooler
operation amount
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280052970.9A
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English (en)
Chinese (zh)
Inventor
瀧尻兴太郎
林大介
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Horiba Stec Co Ltd
Original Assignee
Horiba Stec Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Horiba Stec Co Ltd filed Critical Horiba Stec Co Ltd
Publication of CN117730292A publication Critical patent/CN117730292A/zh
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • G05D23/19—Control of temperature characterised by the use of electric means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0602—Temperature monitoring
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B11/00—Automatic controllers
    • G05B11/01—Automatic controllers electric
    • G05B11/32—Automatic controllers electric with inputs from more than one sensing element; with outputs to more than one correcting element
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/90—Thermal treatments, e.g. annealing or sintering

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Automation & Control Theory (AREA)
  • Control Of Temperature (AREA)
CN202280052970.9A 2021-08-06 2022-08-02 晶圆温度控制装置、晶圆温度控制装置用控制方法及晶圆温度控制装置用程序 Pending CN117730292A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021130031 2021-08-06
JP2021-130031 2021-08-06
PCT/JP2022/029650 WO2023013637A1 (ja) 2021-08-06 2022-08-02 ウエハ温度制御装置、ウエハ温度制御装置用制御方法、及び、ウエハ温度制御装置用プログラム

Publications (1)

Publication Number Publication Date
CN117730292A true CN117730292A (zh) 2024-03-19

Family

ID=85155628

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280052970.9A Pending CN117730292A (zh) 2021-08-06 2022-08-02 晶圆温度控制装置、晶圆温度控制装置用控制方法及晶圆温度控制装置用程序

Country Status (6)

Country Link
US (1) US20250372417A1 (https=)
JP (1) JPWO2023013637A1 (https=)
KR (1) KR20240045237A (https=)
CN (1) CN117730292A (https=)
TW (1) TW202314429A (https=)
WO (1) WO2023013637A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117311184B (zh) * 2023-10-31 2025-01-07 深圳市华翌科技有限公司 一种基于物联网的智能家居调控系统
CN120937120A (zh) * 2024-03-11 2025-11-11 株式会社日立高新技术 等离子处理装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001318720A (ja) * 2000-05-08 2001-11-16 Komatsu Ltd 温度制御方法及び装置
JP2004119630A (ja) * 2002-09-25 2004-04-15 Komatsu Ltd ウェハ温調装置
JP6047411B2 (ja) * 2012-09-28 2016-12-21 東京エレクトロン株式会社 温度測定機構及び温度測定方法
JP7266481B2 (ja) 2019-07-19 2023-04-28 東京エレクトロン株式会社 温度制御装置、温度制御方法、および検査装置

Also Published As

Publication number Publication date
KR20240045237A (ko) 2024-04-05
JPWO2023013637A1 (https=) 2023-02-09
TW202314429A (zh) 2023-04-01
US20250372417A1 (en) 2025-12-04
WO2023013637A1 (ja) 2023-02-09

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