JPWO2022255036A5 - - Google Patents

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Publication number
JPWO2022255036A5
JPWO2022255036A5 JP2023525681A JP2023525681A JPWO2022255036A5 JP WO2022255036 A5 JPWO2022255036 A5 JP WO2022255036A5 JP 2023525681 A JP2023525681 A JP 2023525681A JP 2023525681 A JP2023525681 A JP 2023525681A JP WO2022255036 A5 JPWO2022255036 A5 JP WO2022255036A5
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JP
Japan
Prior art keywords
semiconductor substrate
conductor layer
layer
electrode
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2023525681A
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English (en)
Japanese (ja)
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JPWO2022255036A1 (https=
JP7529155B2 (ja
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Publication date
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Priority claimed from PCT/JP2022/019748 external-priority patent/WO2022255036A1/ja
Publication of JPWO2022255036A1 publication Critical patent/JPWO2022255036A1/ja
Publication of JPWO2022255036A5 publication Critical patent/JPWO2022255036A5/ja
Application granted granted Critical
Publication of JP7529155B2 publication Critical patent/JP7529155B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2023525681A 2021-05-31 2022-05-10 電子部品 Active JP7529155B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021090991 2021-05-31
JP2021090991 2021-05-31
PCT/JP2022/019748 WO2022255036A1 (ja) 2021-05-31 2022-05-10 電子部品

Publications (3)

Publication Number Publication Date
JPWO2022255036A1 JPWO2022255036A1 (https=) 2022-12-08
JPWO2022255036A5 true JPWO2022255036A5 (https=) 2024-02-29
JP7529155B2 JP7529155B2 (ja) 2024-08-06

Family

ID=84324213

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023525681A Active JP7529155B2 (ja) 2021-05-31 2022-05-10 電子部品

Country Status (4)

Country Link
US (1) US20240087809A1 (https=)
JP (1) JP7529155B2 (https=)
CN (1) CN117378021A (https=)
WO (1) WO2022255036A1 (https=)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3579000B2 (ja) * 2001-04-05 2004-10-20 シャープ株式会社 半導体装置
JP2009076483A (ja) * 2007-09-18 2009-04-09 Fuji Electric Device Technology Co Ltd マイクロトランスの製造方法
JPWO2010052839A1 (ja) * 2008-11-06 2012-03-29 パナソニック株式会社 半導体装置
JP6461603B2 (ja) * 2012-11-02 2019-01-30 ローム株式会社 チップコンデンサ、回路アセンブリ、および電子機器

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