JPWO2023181803A5 - - Google Patents

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Publication number
JPWO2023181803A5
JPWO2023181803A5 JP2024509886A JP2024509886A JPWO2023181803A5 JP WO2023181803 A5 JPWO2023181803 A5 JP WO2023181803A5 JP 2024509886 A JP2024509886 A JP 2024509886A JP 2024509886 A JP2024509886 A JP 2024509886A JP WO2023181803 A5 JPWO2023181803 A5 JP WO2023181803A5
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JP
Japan
Prior art keywords
semiconductor substrate
electronic component
region
electrode
component according
Prior art date
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Application number
JP2024509886A
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English (en)
Japanese (ja)
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JP7747177B2 (ja
JPWO2023181803A1 (https=
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Priority claimed from PCT/JP2023/007305 external-priority patent/WO2023181803A1/ja
Publication of JPWO2023181803A1 publication Critical patent/JPWO2023181803A1/ja
Publication of JPWO2023181803A5 publication Critical patent/JPWO2023181803A5/ja
Application granted granted Critical
Publication of JP7747177B2 publication Critical patent/JP7747177B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2024509886A 2022-03-23 2023-02-28 電子部品及び回路装置 Active JP7747177B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022046259 2022-03-23
JP2022046259 2022-03-23
PCT/JP2023/007305 WO2023181803A1 (ja) 2022-03-23 2023-02-28 電子部品及び回路装置

Publications (3)

Publication Number Publication Date
JPWO2023181803A1 JPWO2023181803A1 (https=) 2023-09-28
JPWO2023181803A5 true JPWO2023181803A5 (https=) 2024-11-28
JP7747177B2 JP7747177B2 (ja) 2025-10-01

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ID=88100559

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024509886A Active JP7747177B2 (ja) 2022-03-23 2023-02-28 電子部品及び回路装置

Country Status (4)

Country Link
US (1) US20250015001A1 (https=)
JP (1) JP7747177B2 (https=)
CN (1) CN118872056A (https=)
WO (1) WO2023181803A1 (https=)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6236101B1 (en) * 1997-11-05 2001-05-22 Texas Instruments Incorporated Metallization outside protective overcoat for improved capacitors and inductors
JP4835082B2 (ja) * 2005-09-28 2011-12-14 株式会社デンソー 半導体装置及びその製造方法
US7839622B2 (en) * 2005-11-08 2010-11-23 Ipdia Trench capacitor device suitable for decoupling applications in high-frequency operation
WO2009104132A1 (en) * 2008-02-20 2009-08-27 Nxp B.V. Ultra high density capacity comprising pillar-shaped capacitors formed on both sides of a substrate
DE102014200869B4 (de) * 2013-11-22 2018-09-20 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Integrierter Kondensator und Verfahren zum Herstellen desselben und dessen Verwendung

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