JPWO2022230598A1 - - Google Patents

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Publication number
JPWO2022230598A1
JPWO2022230598A1 JP2023517213A JP2023517213A JPWO2022230598A1 JP WO2022230598 A1 JPWO2022230598 A1 JP WO2022230598A1 JP 2023517213 A JP2023517213 A JP 2023517213A JP 2023517213 A JP2023517213 A JP 2023517213A JP WO2022230598 A1 JPWO2022230598 A1 JP WO2022230598A1
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023517213A
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Filing date
Publication date
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Publication of JPWO2022230598A1 publication Critical patent/JPWO2022230598A1/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H—ELECTRICITY
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    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49503—Lead-frames or other flat leads characterised by the die pad
    • H01L23/49513—Lead-frames or other flat leads characterised by the die pad having bonding material between chip and die pad
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    • H01L23/495—Lead-frames or other flat leads
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    • H01L23/49562—Geometry of the lead-frame for devices being provided for in H01L29/00
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    • H01L23/4334—Auxiliary members in encapsulations
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    • H01L2924/1304—Transistor
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    • H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2023517213A 2021-04-27 2022-03-31 Pending JPWO2022230598A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021074911 2021-04-27
PCT/JP2022/016446 WO2022230598A1 (ja) 2021-04-27 2022-03-31 半導体装置

Publications (1)

Publication Number Publication Date
JPWO2022230598A1 true JPWO2022230598A1 (ja) 2022-11-03

Family

ID=83848063

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023517213A Pending JPWO2022230598A1 (ja) 2021-04-27 2022-03-31

Country Status (5)

Country Link
US (1) US20230420321A1 (ja)
JP (1) JPWO2022230598A1 (ja)
CN (1) CN117280458A (ja)
DE (1) DE112022001675T5 (ja)
WO (1) WO2022230598A1 (ja)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6139553A (ja) * 1984-07-31 1986-02-25 Nec Corp 半導体装置
JPS62296540A (ja) * 1986-06-17 1987-12-23 Matsushita Electronics Corp 樹脂封止型半導体装置
JPS6340353A (ja) * 1986-08-04 1988-02-20 Mitsubishi Electric Corp 樹脂封止半導体装置
JPH11150213A (ja) * 1997-11-17 1999-06-02 Sony Corp 半導体装置
JP6076675B2 (ja) * 2011-10-31 2017-02-08 ローム株式会社 半導体装置
JP6973730B2 (ja) 2016-07-08 2021-12-01 ローム株式会社 半導体装置の製造方法および半導体装置

Also Published As

Publication number Publication date
US20230420321A1 (en) 2023-12-28
DE112022001675T5 (de) 2024-01-11
CN117280458A (zh) 2023-12-22
WO2022230598A1 (ja) 2022-11-03

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