JPWO2022224934A5 - - Google Patents

Download PDF

Info

Publication number
JPWO2022224934A5
JPWO2022224934A5 JP2023515463A JP2023515463A JPWO2022224934A5 JP WO2022224934 A5 JPWO2022224934 A5 JP WO2022224934A5 JP 2023515463 A JP2023515463 A JP 2023515463A JP 2023515463 A JP2023515463 A JP 2023515463A JP WO2022224934 A5 JPWO2022224934 A5 JP WO2022224934A5
Authority
JP
Japan
Prior art keywords
acid diester
adhesive composition
composition according
compound
polymerization initiator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023515463A
Other languages
Japanese (ja)
Other versions
JPWO2022224934A1 (en
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2022/018049 external-priority patent/WO2022224934A1/en
Publication of JPWO2022224934A1 publication Critical patent/JPWO2022224934A1/ja
Publication of JPWO2022224934A5 publication Critical patent/JPWO2022224934A5/ja
Pending legal-status Critical Current

Links

Claims (7)

重合性化合物と、重合開始剤と、ジカルボン酸ジエステル化合物と、を含有する、接着剤組成物。 An adhesive composition containing a polymerizable compound, a polymerization initiator, and a dicarboxylic acid diester compound. 前記重合開始剤が熱重合開始剤である、請求項１に記載の接着剤組成物。 The adhesive composition according to claim 1, wherein the polymerization initiator is a thermal polymerization initiator. 前記ジカルボン酸ジエステル化合物として、コハク酸ジエステル、グルタル酸ジエステル、アジピン酸ジエステル、ピメリン酸ジエステル、スベリン酸ジエステル、リンゴ酸ジエステル及びフタル酸ジエステルからなる群より選択される少なくとも一種の化合物を含有する、請求項１に記載の接着剤組成物。 The dicarboxylic acid diester compound contains at least one compound selected from the group consisting of succinic acid diester, glutaric acid diester, adipic acid diester, pimelic acid diester, suberic acid diester, malic acid diester, and phthalic acid diester. Item 1. Adhesive composition according to item 1 . 前記ジカルボン酸ジエステル化合物の含有量が、重合性化合物１００質量部に対して、０．０１～４０質量部である、請求項１に記載の接着剤組成物。 The adhesive composition according to claim 1 , wherein the content of the diester dicarboxylic acid compound is 0.01 to 40 parts by mass based on 100 parts by mass of the polymerizable compound. 導電粒子を更に含有する、請求項１に記載の接着剤組成物。 The adhesive composition according to claim 1 , further comprising conductive particles. 回路接続用である、請求項１に記載の接着剤組成物。 The adhesive composition according to claim 1 , which is used for circuit connection. 第一の接続部を有する第一の電子部材と、第二の接続部を有する第二の電子部材との間に、請求項１～６のいずれか一項に記載の接着剤組成物を介在させ、前記第一の電子部材及び前記第二の電子部材を熱圧着して、前記第一の接続部及び前記第二の接続部を互いに電気的に接続する工程を備える、接続構造体の製造方法。 The adhesive composition according to any one of claims 1 to 6 is interposed between a first electronic component having a first connection portion and a second electronic component having a second connection portion. manufacturing a connected structure, comprising the step of thermocompression bonding the first electronic member and the second electronic member to electrically connect the first connecting portion and the second connecting portion to each other. Method.
JP2023515463A 2021-04-19 2022-04-18 Pending JPWO2022224934A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021070337 2021-04-19
PCT/JP2022/018049 WO2022224934A1 (en) 2021-04-19 2022-04-18 Adhesive composition and method for producing connection structure

Publications (2)

Publication Number Publication Date
JPWO2022224934A1 JPWO2022224934A1 (en) 2022-10-27
JPWO2022224934A5 true JPWO2022224934A5 (en) 2024-01-25

Family

ID=83723361

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023515463A Pending JPWO2022224934A1 (en) 2021-04-19 2022-04-18

Country Status (3)

Country Link
JP (1) JPWO2022224934A1 (en)
TW (1) TW202309224A (en)
WO (1) WO2022224934A1 (en)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03237174A (en) * 1990-02-14 1991-10-23 Japan Carlit Co Ltd:The Adhesive composition
JP3080972B2 (en) * 1990-08-02 2000-08-28 住友ベークライト株式会社 Anisotropic conductive film
WO2002055625A1 (en) * 2001-01-15 2002-07-18 Sekisui Chemical Co., Ltd. Photoreactive hot-melt adhesive composition
JP2006199937A (en) * 2004-12-15 2006-08-03 Tamura Kaken Co Ltd Conductive adhesive and conductive part and electronic part module using the same
KR101579712B1 (en) * 2013-05-23 2015-12-22 세키스이가가쿠 고교가부시키가이샤 Conductive material and connected structure
WO2016190361A1 (en) * 2015-05-26 2016-12-01 デンカ株式会社 Composition
JP2017061599A (en) * 2015-09-24 2017-03-30 横浜ゴム株式会社 An adhesive composition for optical communication
JP2021024894A (en) * 2019-07-31 2021-02-22 株式会社ダイセル Adhesive for glass and laminate

Similar Documents

Publication Publication Date Title
JP2014146642A (en) Ceramic electronic component
JP2002246418A5 (en)
JPWO2022224934A5 (en)
US20040046005A1 (en) Stack package and manufacturing method thereof
JP3256367B2 (en) Resin-coated insulating bonding wire
JP5150242B2 (en) Semiconductor memory device
JP6264716B2 (en) Ceramic electronic components with metal terminals
TW200528000A (en) Electronic component mounting method and electronic component mounting structure
JPH04127564A (en) Manufacture of lead frame
JP2021165397A5 (en)
JP2018195647A (en) Semiconductor device
JP2002043170A (en) Laminated ceramic capacitor module
JP2010171407A5 (en)
KR100783638B1 (en) semiconductor chip package of stack type
WO2022259633A1 (en) Semiconductor device and semiconductor device manufacturing method
CN109887850B (en) Method, device, equipment and storage medium for 3D packaging multi-point welding
JP3399808B2 (en) How to assemble a multilayer chip
JP2000113728A (en) Conductive adhesive
JP2002271005A (en) Mounting structure and method of manufacturing the same
JPH01289151A (en) Integrated circuit device
KR100418380B1 (en) Method for heaping Semiconductor Package
JPH0778938A (en) Composite semiconductor device and its manufacture
JP2012151406A (en) Semiconductor device and manufacturing method of the same
CN116207065A (en) Packaging structure, packaging system and forming method thereof
JPS6037640B2 (en) Printed board