JPWO2022224934A1 - - Google Patents
Info
- Publication number
- JPWO2022224934A1 JPWO2022224934A1 JP2023515463A JP2023515463A JPWO2022224934A1 JP WO2022224934 A1 JPWO2022224934 A1 JP WO2022224934A1 JP 2023515463 A JP2023515463 A JP 2023515463A JP 2023515463 A JP2023515463 A JP 2023515463A JP WO2022224934 A1 JPWO2022224934 A1 JP WO2022224934A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021070337 | 2021-04-19 | ||
PCT/JP2022/018049 WO2022224934A1 (ja) | 2021-04-19 | 2022-04-18 | 接着剤組成物及び接続構造体の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2022224934A1 true JPWO2022224934A1 (ja) | 2022-10-27 |
JPWO2022224934A5 JPWO2022224934A5 (ja) | 2024-01-25 |
Family
ID=83723361
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023515463A Pending JPWO2022224934A1 (ja) | 2021-04-19 | 2022-04-18 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JPWO2022224934A1 (ja) |
TW (1) | TW202309224A (ja) |
WO (1) | WO2022224934A1 (ja) |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03237174A (ja) * | 1990-02-14 | 1991-10-23 | Japan Carlit Co Ltd:The | 接着性組成物 |
JP3080972B2 (ja) * | 1990-08-02 | 2000-08-28 | 住友ベークライト株式会社 | 異方導電フィルム |
WO2002055625A1 (fr) * | 2001-01-15 | 2002-07-18 | Sekisui Chemical Co., Ltd. | Composition d'adhesif thermofusible photoreactif |
JP2006199937A (ja) * | 2004-12-15 | 2006-08-03 | Tamura Kaken Co Ltd | 導電性接着剤、これを用いた導電部及び電子部品モジュール |
US9490046B2 (en) * | 2013-05-23 | 2016-11-08 | Sekisui Chemical Co., Ltd. | Conductive material and connected structure |
WO2016190361A1 (ja) * | 2015-05-26 | 2016-12-01 | デンカ株式会社 | 組成物 |
JP2017061599A (ja) * | 2015-09-24 | 2017-03-30 | 横浜ゴム株式会社 | 光通信用接着剤組成物 |
JP2021024894A (ja) * | 2019-07-31 | 2021-02-22 | 株式会社ダイセル | ガラス用接着剤及び積層体 |
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2022
- 2022-04-18 JP JP2023515463A patent/JPWO2022224934A1/ja active Pending
- 2022-04-18 TW TW111114669A patent/TW202309224A/zh unknown
- 2022-04-18 WO PCT/JP2022/018049 patent/WO2022224934A1/ja active Application Filing
Also Published As
Publication number | Publication date |
---|---|
WO2022224934A1 (ja) | 2022-10-27 |
TW202309224A (zh) | 2023-03-01 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20230920 |