JP2002246418A5 - - Google Patents

Claims (13)

Between a semiconductor element and a circuit forming body, a thermoplastic or thermosetting sheet having a through hole at a position corresponding to the external electrode terminal formed on the electrode of the semiconductor element is interposed,
The external electrode terminal formed on the electrode of the semiconductor element and the electrode of the circuit forming body are electrically connected through the through hole of the sheet to join the semiconductor element and the circuit forming body. A method for mounting a semiconductor element, comprising: When the external electrode terminal and the electrode of the circuit forming body are electrically connected, the plating bump formed as the external electrode terminal formed on the electrode of the semiconductor element and the electrode of the circuit forming body are The method for mounting a semiconductor element according to claim 1, wherein the semiconductor element and the circuit forming body are joined by being electrically connected through the through hole of the sheet. When the external electrode terminal and the electrode of the circuit forming body are electrically connected, the bump bump as the external electrode terminal formed on the electrode of the semiconductor element by the wire bonding method and the above of the circuit forming body The method for mounting a semiconductor element according to claim 1, wherein the semiconductor element and the circuit formed body are joined by electrically connecting an electrode to the sheet through the through hole of the sheet. When the external electrode terminal and the electrode of the circuit forming body are electrically connected, the external electrode terminal formed on the electrode of the semiconductor element and the electrode of the circuit forming body are The semiconductor element and the circuit forming body are joined by being electrically connected to the external electrode terminal portion formed on the electrode of the semiconductor element through a through hole arranged at a one-to-one correspondence. The method for mounting a semiconductor element according to claim 2. When the external electrode terminals and the electrodes of the circuit forming body are electrically connected, the plurality of external electrode terminals formed on the plurality of electrodes of the semiconductor element and the plurality of circuit forming bodies 4. The semiconductor element mounting according to claim 2, wherein the semiconductor element and the circuit forming body are joined by electrically connecting the electrodes to each other through a through hole formed in a long hole shape of the sheet. Method. The method for mounting a semiconductor element according to claim 1, wherein the thermoplastic or thermosetting sheet is a conductive sheet having a thermoplastic or thermosetting resin and metal particles .   The circuit formation component by which the said semiconductor element was mounted in the said circuit formation body by the mounting method of the semiconductor element as described in any one of Claims 1-6. A semiconductor arithmetic circuit chip on which a light receiving element is formed, a light emitting element array in which a light emitting element is embedded in a substrate having a through hole for a light receiving element optical path, and a substrate with a diffractive optical element having a diffractive optical element are integrated. Optical information processing apparatus
Between the semiconductor arithmetic circuit chip and the light emitting element array, a thermoplastic or thermosetting first conductive sheet provided with an optical path through hole of the light receiving element is interposed, and the semiconductor arithmetic circuit chip and the above A thermoplastic or thermosetting second conductive sheet having a light-emitting element array bonded thereto and an optical path through hole for the light- receiving element provided between the light-emitting element array and the diffractive optical element. the by interposing an optical information processing apparatus characterized by bonding the light emitting element array and said diffractive optical element. The optical information processing apparatus according to claim 8, wherein the first conductive sheet and the second conductive sheet have a through hole that secures an optical path of the light emitting element.   10. At least one of the first conductive sheet and the second conductive sheet is an anisotropic conductive sheet having a thermoplastic or thermosetting resin and metal particles. Optical information processing equipment. A semiconductor arithmetic circuit chip on which a light receiving element is formed, a light emitting element array in which a light emitting element is embedded in a substrate having a through hole for a light receiving element optical path, and a substrate with a diffractive optical element having a diffractive optical element are integrated. In an optical information processing apparatus manufacturing method for manufacturing an optical information processing apparatus,
A thermoplastic or thermosetting first conductive sheet provided with an optical path through hole for the light receiving element is interposed between the semiconductor arithmetic circuit chip and the light emitting element array, and the first conductive sheet. While joining the semiconductor arithmetic circuit chip and the light emitting element array by,
Between the light emitting element array and the diffractive optical element, there is interposed a thermoplastic or thermosetting second conductive sheet provided with an optical path through hole for the light receiving element, and the second conductive sheet. A method of manufacturing an optical information processing apparatus, comprising: bonding the light emitting element array and the diffractive optical element by: The method of manufacturing an optical information processing apparatus according to claim 10, wherein a conductive sheet provided with a through hole that secures an optical path of the light emitting element is used as the first conductive sheet and the second conductive sheet . The external electrode terminal formed on the electrode of the semiconductor element and the circuit formed body at a location corresponding to the external electrode terminal formed on the electrode of the semiconductor element between the semiconductor element and the circuit formed body. A thermoplastic or thermosetting sheet having a through hole for electrically connecting the electrode.