JP2021165397A5 - - Google Patents

Download PDF

Info

Publication number
JP2021165397A5
JP2021165397A5 JP2021110078A JP2021110078A JP2021165397A5 JP 2021165397 A5 JP2021165397 A5 JP 2021165397A5 JP 2021110078 A JP2021110078 A JP 2021110078A JP 2021110078 A JP2021110078 A JP 2021110078A JP 2021165397 A5 JP2021165397 A5 JP 2021165397A5
Authority
JP
Japan
Prior art keywords
circuit
adhesive composition
silane compound
composition according
group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021110078A
Other languages
Japanese (ja)
Other versions
JP2021165397A (en
JP7124936B2 (en
Filing date
Publication date
Priority claimed from JP2017548820A external-priority patent/JP6915544B2/en
Application filed filed Critical
Publication of JP2021165397A publication Critical patent/JP2021165397A/en
Publication of JP2021165397A5 publication Critical patent/JP2021165397A5/ja
Application granted granted Critical
Publication of JP7124936B2 publication Critical patent/JP7124936B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Claims (6)

ラジカル重合可能な官能基を有する第１のシラン化合物と、
前記第１のシラン化合物と反応する第２のシラン化合物と、
ラジカル重合性化合物（前記第１のシラン化合物に該当する化合物を除く）と、
１分間半減期温度が１２０℃以下である過酸化物と、
充填剤と、を含有し、
前記充填剤の含有量が、接着剤組成物の接着剤成分１００質量部に対して０．１〜６０質量部である、回路接続用の接着剤組成物。 A first silane compound having a radically polymerizable functional group and
A second silane compound that reacts with the first silane compound,
Radical-polymerizable compounds (excluding compounds corresponding to the first silane compound) and
Peroxides with a 1-minute half-life temperature of 120 ° C or less,
Contains fillers ,
The content of the filler, Ru 0.1 to 60 parts by der against adhesive component 100 parts by weight of the adhesive composition, the adhesive composition for circuit connection. 前記第１のシラン化合物の前記官能基が、（メタ）アクリロイル基及びビニル基からなる群より選ばれる少なくとも１種を含む、請求項１に記載の接着剤組成物。 The adhesive composition according to claim 1, wherein the functional group of the first silane compound contains at least one selected from the group consisting of a (meth) acryloyl group and a vinyl group. 前記第２のシラン化合物がエポキシ基を有する、請求項１又は２に記載の接着剤組成物。 The adhesive composition according to claim 1 or 2, wherein the second silane compound has an epoxy group. 導電粒子を更に含有する、請求項１〜３のいずれか一項に記載の接着剤組成物。 The adhesive composition according to any one of claims 1 to 3, further comprising conductive particles. 請求項１〜４のいずれか一項に記載の接着剤組成物又はその硬化物を備える、構造体。 A structure comprising the adhesive composition according to any one of claims 1 to 4 or a cured product thereof. 第一の回路電極を有する第一の回路部材と、
第二の回路電極を有する第二の回路部材と、
前記第一の回路部材及び前記第二の回路部材の間に配置された回路接続部材と、を備え、
前記第一の回路電極及び前記第二の回路電極が電気的に接続されており、
前記回路接続部材が、請求項１〜４のいずれか一項に記載の接着剤組成物又はその硬化物を含む、構造体。 With the first circuit member having the first circuit electrode,
A second circuit member with a second circuit electrode, and
A circuit connecting member arranged between the first circuit member and the second circuit member is provided.
The first circuit electrode and the second circuit electrode are electrically connected to each other.
A structure in which the circuit connecting member comprises the adhesive composition according to any one of claims 1 to 4 or a cured product thereof.
JP2021110078A 2015-11-04 2021-07-01 Adhesive composition and structure Active JP7124936B2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015216516 2015-11-04
JP2015216516 2015-11-04
JP2017548820A JP6915544B2 (en) 2015-11-04 2016-11-02 Adhesive composition and structure

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2017548820A Division JP6915544B2 (en) 2015-11-04 2016-11-02 Adhesive composition and structure

Publications (3)

Publication Number Publication Date
JP2021165397A JP2021165397A (en) 2021-10-14
JP2021165397A5 true JP2021165397A5 (en) 2021-11-25
JP7124936B2 JP7124936B2 (en) 2022-08-24

Family

ID=58662435

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2017548820A Active JP6915544B2 (en) 2015-11-04 2016-11-02 Adhesive composition and structure
JP2021110078A Active JP7124936B2 (en) 2015-11-04 2021-07-01 Adhesive composition and structure

Family Applications Before (1)

Application Number Title Priority Date Filing Date
JP2017548820A Active JP6915544B2 (en) 2015-11-04 2016-11-02 Adhesive composition and structure

Country Status (5)

Country Link
JP (2) JP6915544B2 (en)
KR (1) KR102608218B1 (en)
CN (1) CN108350320B (en)
TW (1) TWI786036B (en)
WO (1) WO2017078087A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI671921B (en) 2018-09-14 2019-09-11 頎邦科技股份有限公司 Chip package and chip

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002285103A (en) * 2001-03-26 2002-10-03 Sumitomo Bakelite Co Ltd Anisotropic electroconductive adhesive
JP4004333B2 (en) * 2001-06-05 2007-11-07 松下電器産業株式会社 Semiconductor module
JP2004067908A (en) * 2002-08-07 2004-03-04 Sumitomo Bakelite Co Ltd Anisotropically electroconductive adhesive
JP4146747B2 (en) * 2003-03-26 2008-09-10 積水化学工業株式会社 Curable composition
JP2006022231A (en) * 2004-07-08 2006-01-26 Sumitomo Bakelite Co Ltd Anisotropically conductive adhesive and anisotropically conductive adhesive film
KR101081263B1 (en) * 2006-05-09 2011-11-08 히다치 가세고교 가부시끼가이샤 Adhesive sheet, and connecting structure for circuit member and semiconductor device which use the adhesive sheet
JP4941554B2 (en) * 2007-05-09 2012-05-30 日立化成工業株式会社 Film-like circuit connection material and circuit member connection structure
JPWO2009063827A1 (en) 2007-11-12 2011-03-31 日立化成工業株式会社 Circuit connection material and circuit member connection structure
WO2010110107A1 (en) * 2009-03-23 2010-09-30 セメダイン株式会社 Curable composition
JP2011199097A (en) * 2010-03-23 2011-10-06 Sumitomo Bakelite Co Ltd Method of manufacturing semiconductor device
JP2012072305A (en) * 2010-09-29 2012-04-12 Hitachi Chemical Co Ltd Resin paste composition
JP5909911B2 (en) * 2011-07-29 2016-04-27 住友ベークライト株式会社 Liquid resin composition and semiconductor device
CN108676520A (en) * 2011-09-06 2018-10-19 日立化成株式会社 Anisotropically conducting adhesive, the application of adhesive composite and connector
JP5934528B2 (en) 2012-03-12 2016-06-15 デクセリアルズ株式会社 CIRCUIT CONNECTION MATERIAL, AND METHOD FOR MANUFACTURING MOUNTING BODY USING THE SAME
JP6250265B2 (en) * 2012-03-16 2017-12-20 リンテック株式会社 Adhesive composition, adhesive sheet, and method for manufacturing semiconductor device
JP6090311B2 (en) * 2012-04-25 2017-03-08 日立化成株式会社 Circuit connection material, circuit connection structure and adhesive film
JP2013253151A (en) * 2012-06-06 2013-12-19 Hitachi Chemical Co Ltd Adhesive film for circuit connection, and connection structure of circuit member and manufacturing method thereof
CN103131336B (en) * 2013-03-22 2015-06-10 苏州度辰新材料有限公司 Preparation method of silane crosslinked ethylene-vinyl acetate copolymer adhesive film
CN103360956B (en) * 2013-06-18 2015-06-03 明基材料有限公司 Sticking agent for electrical property conduction between electronic components
JP6398570B2 (en) * 2013-10-09 2018-10-03 日立化成株式会社 Circuit connection material, circuit member connection structure, and method of manufacturing circuit member connection structure
JP6437323B2 (en) * 2014-02-14 2018-12-12 デクセリアルズ株式会社 Manufacturing method of connection structure and circuit connection material

Similar Documents

Publication Publication Date Title
JP2021165397A5 (en)
JP2007224228A5 (en)
JP2009544768A5 (en)
JP2009019081A5 (en)
JP2013512527A (en) Compact media player
JP2020124747A5 (en)
JP2007241999A5 (en)
JP2007277525A5 (en) Adhesive composition for electronic equipment, adhesive sheet for electronic equipment using the same, and electronic component
TWI468487B (en) An anisotropic conductive material, a method for manufacturing the same, and a structure thereof and a method for manufacturing the same
JP2009088465A5 (en)
JP2016127011A5 (en)
JP2020077870A5 (en)
JP2001323224A5 (en)
TWI539470B (en) An anisotropic conductive connecting material, a film laminate, a connecting method, and a connecting structure
JP2017066367A (en) Conductive adhesive, electronic component and method for manufacturing electronic component
JP2020200427A5 (en)
JP2017145382A (en) Conductive adhesive and method for producing the same, cured product and electronic component
CN116208894A (en) Vibrating diaphragm, sound generating device and electronic equipment
JPH0969531A (en) Die attach adhesive composition for semiconductor package
JP2009275079A5 (en) Circuit connection material
CN110964469A (en) Anisotropic conductive adhesive and preparation method thereof
JP2012162721A (en) Adhesive and electric device
JPH03166284A (en) Electrically conductive adhesive
JP2017522421A5 (en)
CN108587488B (en) Low-silver-content acrylate conductive adhesive and preparation method thereof