JP2020077870A5 - - Google Patents

Claims (20)

At least one selected from a thermoplastic resin, a solid radical polymerizable resin, and a solid epoxy resin, which are solid at room temperature and have a melt flow rate of 10 g / 10 min or more measured under the conditions of a temperature of 190 ° C. and a load of 2.16 kg. An anisotropic bonding material containing the solid resin, the solder particles, and the flux compound is placed between the electrodes of the first electronic component and the electrodes of the second electronic component, and the average particle size of the solder particles is 50. Intervening with a thickness of% or more and 300% or less,
A method for manufacturing a connector in which an electrode of the first electronic component and an electrode of the second electronic component are heat-bonded without a load. The method for producing a connector according to claim 1, wherein the anisotropic bonding material is an anisotropic bonding film having a thickness of 50% or more and 300% or less of the average particle size of the solder particles. The second electronic component is a substrate.
The method for manufacturing a connector according to claim 2, wherein the anisotropic bonding film is laminated on the substrate, and a plurality of the first electronic components are mounted on the anisotropic bonding film and heat-bonded. The method for producing a connector according to any one of claims 1 to 3, wherein the flux compound is a carboxylic acid. The method for producing a connector according to any one of claims 1 to 3, wherein the flux compound is a blocked carboxylic acid in which a carboxyl group is blocked with an alkyl vinyl ether. At least one selected from a thermoplastic resin, a solid radical polymerizable resin, and a solid epoxy resin, which are solid at room temperature and have a melt flow rate of 10 g / 10 min or more measured under the conditions of a temperature of 190 ° C. and a load of 2.16 kg. Containing solid resin, solder particles, and flux compound,
An anisotropic bonding material having a thickness of 50% or more and 300% or less of the average particle size of the solder particles. The anisotropic bonding material according to claim 6, wherein the flux compound is a carboxylic acid. The anisotropic bonding material according to claim 6, wherein the flux compound is a blocked carboxylic acid in which a carboxyl group is blocked with an alkyl vinyl ether. The anisotropic bonding material according to any one of claims 6 to 8, further containing a liquid radical polymerizable resin liquid at room temperature and a polymerization initiator. The anisotropic bonding material according to any one of claims 6 to 8, further containing a liquid epoxy resin at room temperature and a curing agent. The anisotropic bonding material according to claim 10, wherein the curing agent is a carboxylic acid or a blocked carboxylic acid in which the carboxyl group is blocked with an alkyl vinyl ether. An anisotropic bonded film in which the anisotropic bonded material according to any one of claims 6 to 11 is in the form of a film. The electrode of the first electronic component and the electrode of the second electronic component are used by using the anisotropic bonding material according to any one of claims 6 to 11 or the anisotropic bonding film according to claim 12. A connection body that is joined to and from. At least one selected from a thermoplastic resin, a solid radical polymerizable resin, and a solid epoxy resin, which are solid at room temperature and have a melt flow rate of 10 g / 10 min or more measured under the conditions of a temperature of 190 ° C. and a load of 2.16 kg. An anisotropic bonding material containing the solid resin, the solder particles, and the flux compound is placed between the electrodes of the first electronic component and the electrodes of the second electronic component, and the average particle size of the solder particles is 50. Intervening with a thickness of% or more and 300% or less,
The solid resin is melted by heating, the solder particles are sandwiched between the electrodes by the weight of the first electronic component or the second electronic component, and the solder particles are melted by the main heating above the melting temperature of the solder particles. A method for manufacturing a connector in which an electrode of the first electronic component and an electrode of the second electronic component are joined by cooling. The method for manufacturing a connector according to claim 14, wherein the blending amount of the solder particles in the anisotropic bonding material is 40 wt% or more and 60 wt% or less. The method for producing a connector according to claim 14 or 15, wherein the anisotropic bonding material is an anisotropic bonding film having a thickness of 90% or more and 150% or less of the average particle size of the solder particles. At least one selected from a thermoplastic resin, a solid radical polymerizable resin, and a solid epoxy resin, which are solid at room temperature and have a melt flow rate of 10 g / 10 min or more measured under the conditions of a temperature of 190 ° C. and a load of 2.16 kg. Containing solid resin, solder particles, and flux compound,
The thickness is 50% or more and 300% or less of the average particle size of the solder particles.
An anisotropic bonding material in which the blending amount of the solder particles is 40 wt% or more and 60 wt% or less. The anisotropic bonding material according to claim 17, which has a thickness of 90% or more and 150% or less of the average particle size of the solder particles. The anisotropic bonding material according to claim 6, wherein the thickness is 200% or less of the average particle size of the solder particles. The anisotropic bonding material according to claim 6, wherein the thickness is 150% or less of the average particle size of the solder particles.