JPWO2022219717A5 - - Google Patents
Download PDFInfo
- Publication number
- JPWO2022219717A5 JPWO2022219717A5 JP2023514223A JP2023514223A JPWO2022219717A5 JP WO2022219717 A5 JPWO2022219717 A5 JP WO2022219717A5 JP 2023514223 A JP2023514223 A JP 2023514223A JP 2023514223 A JP2023514223 A JP 2023514223A JP WO2022219717 A5 JPWO2022219717 A5 JP WO2022219717A5
- Authority
- JP
- Japan
- Prior art keywords
- diaphragm
- ultrasonic transducer
- transducer according
- housing
- opening
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 20
- 238000004519 manufacturing process Methods 0.000 claims description 14
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 7
- 229910052710 silicon Inorganic materials 0.000 claims description 7
- 239000010703 silicon Substances 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 5
- 230000002093 peripheral effect Effects 0.000 claims 6
- 239000012528 membrane Substances 0.000 claims 2
- 239000013078 crystal Substances 0.000 claims 1
- 239000010408 film Substances 0.000 description 5
- 239000010409 thin film Substances 0.000 description 2
- 230000003321 amplification Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
Images
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2021/015312 WO2022219717A1 (ja) | 2021-04-13 | 2021-04-13 | 超音波トランスデューサ、測距装置および超音波トランスデューサの製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2022219717A1 JPWO2022219717A1 (https=) | 2022-10-20 |
| JPWO2022219717A5 true JPWO2022219717A5 (https=) | 2023-11-27 |
| JP7660664B2 JP7660664B2 (ja) | 2025-04-11 |
Family
ID=83639910
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023514223A Active JP7660664B2 (ja) | 2021-04-13 | 2021-04-13 | 超音波トランスデューサ、測距装置および超音波トランスデューサの製造方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US12477269B2 (https=) |
| JP (1) | JP7660664B2 (https=) |
| CN (1) | CN117157992A (https=) |
| WO (1) | WO2022219717A1 (https=) |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2546488B2 (ja) | 1993-04-22 | 1996-10-23 | 日本電気株式会社 | 低周波水中送波器 |
| NO328582B1 (no) | 2006-12-29 | 2010-03-22 | Tandberg Telecom As | Mikrofon for lydkildesporing |
| US8733176B2 (en) | 2009-09-02 | 2014-05-27 | Kontel Data System Limited | MEMS stress concentrating structure for MEMS sensors |
| WO2013042316A1 (ja) | 2011-09-22 | 2013-03-28 | パナソニック株式会社 | 指向性スピーカ |
| CN103297904B (zh) * | 2013-05-18 | 2015-09-02 | 歌尔声学股份有限公司 | 一种双振膜扬声器模组 |
| WO2020220719A1 (zh) * | 2019-04-30 | 2020-11-05 | 深圳市韶音科技有限公司 | 一种声学输出装置 |
| WO2020136983A1 (ja) | 2018-12-27 | 2020-07-02 | 株式会社村田製作所 | 圧電トランスデューサ |
| KR20220099980A (ko) * | 2019-11-26 | 2022-07-14 | 그래프오디오 인코포레이션 | 그래핀 트랜스듀서 |
| CN111001553B (zh) | 2019-12-18 | 2021-01-26 | 武汉大学 | 一种可调谐的超声传感器阵列 |
-
2021
- 2021-04-13 CN CN202180096822.2A patent/CN117157992A/zh active Pending
- 2021-04-13 JP JP2023514223A patent/JP7660664B2/ja active Active
- 2021-04-13 US US18/283,467 patent/US12477269B2/en active Active
- 2021-04-13 WO PCT/JP2021/015312 patent/WO2022219717A1/ja not_active Ceased
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4946796B2 (ja) | 振動トランスデューサおよび振動トランスデューサの製造方法 | |
| US9853201B2 (en) | Piezoelectric MEMS microphone | |
| US12275040B2 (en) | Piezoelectric device and ultrasonic transducer | |
| KR102193843B1 (ko) | 간극 제어 구조를 구비한 음향 변환기 및 음향 변환기를 제조하는 방법 | |
| US20150350792A1 (en) | Piezoelectric mems microphone | |
| JP2009060600A (ja) | コンデンサマイクロホン | |
| US20090190782A1 (en) | Vibration transducer | |
| JP2019517750A (ja) | Memsマイクロホンおよびその準備方法 | |
| WO2018094963A1 (zh) | 一种微硅麦克风及其制造方法 | |
| JP2010172181A (ja) | 電気機械変換装置及びその作製方法 | |
| TW202114257A (zh) | 壓電元件 | |
| CN116507896A (zh) | 压电元件、压电装置及压电元件的制造方法 | |
| US20090136064A1 (en) | Vibration transducer and manufacturing method therefor | |
| JP2009089097A (ja) | 振動トランスデューサ | |
| WO2020136994A1 (ja) | 圧電トランスデューサ | |
| JP2022119126A5 (https=) | ||
| JP2009089100A (ja) | 振動トランスデューサ | |
| JPWO2022219717A5 (https=) | ||
| JP2010109416A (ja) | 圧力トランスデューサおよび圧力トランスデューサの製造方法 | |
| JP2009065606A (ja) | 振動トランスデューサ | |
| JP2011182299A (ja) | Memsトランスデューサとその製造方法 | |
| KR101893486B1 (ko) | 강성 백플레이트 구조의 마이크로폰 및 그 마이크로폰 제조 방법 | |
| KR101760628B1 (ko) | 수평 인장 구조의 마이크로폰 및 그 마이크로폰 제조 방법 | |
| CN215682631U (zh) | Mems麦克风及其封装结构 | |
| JP2009130297A (ja) | トランスデューサ用基板の製造方法およびトランスデューサ用基板、並びにトランスデューサ |