JPWO2022196258A1 - - Google Patents
Info
- Publication number
- JPWO2022196258A1 JPWO2022196258A1 JP2023506900A JP2023506900A JPWO2022196258A1 JP WO2022196258 A1 JPWO2022196258 A1 JP WO2022196258A1 JP 2023506900 A JP2023506900 A JP 2023506900A JP 2023506900 A JP2023506900 A JP 2023506900A JP WO2022196258 A1 JPWO2022196258 A1 JP WO2022196258A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D333/00—Heterocyclic compounds containing five-membered rings having one sulfur atom as the only ring hetero atom
- C07D333/50—Heterocyclic compounds containing five-membered rings having one sulfur atom as the only ring hetero atom condensed with carbocyclic rings or ring systems
- C07D333/76—Dibenzothiophenes
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D409/00—Heterocyclic compounds containing two or more hetero rings, at least one ring having sulfur atoms as the only ring hetero atoms
- C07D409/02—Heterocyclic compounds containing two or more hetero rings, at least one ring having sulfur atoms as the only ring hetero atoms containing two hetero rings
- C07D409/04—Heterocyclic compounds containing two or more hetero rings, at least one ring having sulfur atoms as the only ring hetero atoms containing two hetero rings directly linked by a ring-member-to-ring-member bond
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Materials For Photolithography (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021041748 | 2021-03-15 | ||
| PCT/JP2022/006978 WO2022196258A1 (ja) | 2021-03-15 | 2022-02-21 | オニウム塩、光酸発生剤、組成物及びそれを用いたデバイスの製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2022196258A1 true JPWO2022196258A1 (https=) | 2022-09-22 |
| JPWO2022196258A5 JPWO2022196258A5 (https=) | 2023-12-08 |
Family
ID=83321246
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023506900A Pending JPWO2022196258A1 (https=) | 2021-03-15 | 2022-02-21 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2022196258A1 (https=) |
| WO (1) | WO2022196258A1 (https=) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2022164586A (ja) * | 2021-04-15 | 2022-10-27 | 住友化学株式会社 | カルボン酸塩、カルボン酸発生剤、レジスト組成物及びレジストパターンの製造方法 |
| JP2022173111A (ja) * | 2021-05-06 | 2022-11-17 | 住友化学株式会社 | カルボン酸塩、カルボン酸発生剤、レジスト組成物及びレジストパターンの製造方法 |
| US12566375B2 (en) * | 2021-05-06 | 2026-03-03 | Sumitomo Chemical Company, Limited | Salt, acid generator, resist composition and method for producing resist pattern |
| JP2022191200A (ja) * | 2021-06-15 | 2022-12-27 | 住友化学株式会社 | カルボン酸塩、カルボン酸発生剤、レジスト組成物及びレジストパターンの製造方法 |
| JP2022191199A (ja) * | 2021-06-15 | 2022-12-27 | 住友化学株式会社 | 塩、酸発生剤、レジスト組成物及びレジストパターンの製造方法 |
| WO2024070091A1 (ja) * | 2022-09-29 | 2024-04-04 | 東洋合成工業株式会社 | オニウム塩、光酸発生剤、ポリマー、レジスト組成物及び、該レジスト組成物を用いたデバイスの製造方法 |
| WO2026048564A1 (ja) * | 2024-08-28 | 2026-03-05 | 富士フイルム株式会社 | 感光性組成物、レジスト膜、パターン形成方法、電子デバイスの製造方法 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015172741A (ja) * | 2014-02-21 | 2015-10-01 | 東京エレクトロン株式会社 | 光増感化学増幅型レジスト材料及びこれを用いたパターン形成方法、半導体デバイス、リソグラフィ用マスク、並びにナノインプリント用テンプレート |
| WO2018074382A1 (ja) * | 2016-10-17 | 2018-04-26 | 東洋合成工業株式会社 | 組成物及びそれを用いたデバイスの製造方法 |
| JP2019182813A (ja) * | 2018-04-17 | 2019-10-24 | 東洋合成工業株式会社 | 組成物及びそれを用いたデバイスの製造方法 |
| JP2020176096A (ja) * | 2019-04-19 | 2020-10-29 | 東洋合成工業株式会社 | オニウム塩、組成物及びそれを用いたデバイスの製造方法 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI898021B (zh) * | 2020-08-20 | 2025-09-21 | 日商東洋合成工業股份有限公司 | 聚合物、含有該聚合物的抗蝕劑組成物、利用該抗蝕劑組成物的部件的製造方法、圖案形成方法以及反轉圖案的形成方法 |
-
2022
- 2022-02-21 JP JP2023506900A patent/JPWO2022196258A1/ja active Pending
- 2022-02-21 WO PCT/JP2022/006978 patent/WO2022196258A1/ja not_active Ceased
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015172741A (ja) * | 2014-02-21 | 2015-10-01 | 東京エレクトロン株式会社 | 光増感化学増幅型レジスト材料及びこれを用いたパターン形成方法、半導体デバイス、リソグラフィ用マスク、並びにナノインプリント用テンプレート |
| WO2018074382A1 (ja) * | 2016-10-17 | 2018-04-26 | 東洋合成工業株式会社 | 組成物及びそれを用いたデバイスの製造方法 |
| JP2019182813A (ja) * | 2018-04-17 | 2019-10-24 | 東洋合成工業株式会社 | 組成物及びそれを用いたデバイスの製造方法 |
| JP2020176096A (ja) * | 2019-04-19 | 2020-10-29 | 東洋合成工業株式会社 | オニウム塩、組成物及びそれを用いたデバイスの製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2022196258A1 (ja) | 2022-09-22 |
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