JPWO2022196258A1 - - Google Patents
Info
- Publication number
- JPWO2022196258A1 JPWO2022196258A1 JP2023506900A JP2023506900A JPWO2022196258A1 JP WO2022196258 A1 JPWO2022196258 A1 JP WO2022196258A1 JP 2023506900 A JP2023506900 A JP 2023506900A JP 2023506900 A JP2023506900 A JP 2023506900A JP WO2022196258 A1 JPWO2022196258 A1 JP WO2022196258A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D333/00—Heterocyclic compounds containing five-membered rings having one sulfur atom as the only ring hetero atom
- C07D333/50—Heterocyclic compounds containing five-membered rings having one sulfur atom as the only ring hetero atom condensed with carbocyclic rings or ring systems
- C07D333/76—Dibenzothiophenes
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- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D409/00—Heterocyclic compounds containing two or more hetero rings, at least one ring having sulfur atoms as the only ring hetero atoms
- C07D409/02—Heterocyclic compounds containing two or more hetero rings, at least one ring having sulfur atoms as the only ring hetero atoms containing two hetero rings
- C07D409/04—Heterocyclic compounds containing two or more hetero rings, at least one ring having sulfur atoms as the only ring hetero atoms containing two hetero rings directly linked by a ring-member-to-ring-member bond
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Materials For Photolithography (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021041748 | 2021-03-15 | ||
PCT/JP2022/006978 WO2022196258A1 (ja) | 2021-03-15 | 2022-02-21 | オニウム塩、光酸発生剤、組成物及びそれを用いたデバイスの製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2022196258A1 true JPWO2022196258A1 (ja) | 2022-09-22 |
JPWO2022196258A5 JPWO2022196258A5 (ja) | 2023-12-08 |
Family
ID=83321246
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023506900A Pending JPWO2022196258A1 (ja) | 2021-03-15 | 2022-02-21 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPWO2022196258A1 (ja) |
WO (1) | WO2022196258A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20230004084A1 (en) * | 2021-05-06 | 2023-01-05 | Sumitomo Chemical Company, Limited | Salt, acid generator, resist composition and method for producing resist pattern |
WO2024070091A1 (ja) * | 2022-09-29 | 2024-04-04 | 東洋合成工業株式会社 | オニウム塩、光酸発生剤、ポリマー、レジスト組成物及び、該レジスト組成物を用いたデバイスの製造方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015125788A1 (ja) * | 2014-02-21 | 2015-08-27 | 東京エレクトロン株式会社 | 光増感化学増幅型レジスト材料及びこれを用いたパターン形成方法、半導体デバイス、リソグラフィ用マスク、並びにナノインプリント用テンプレート |
KR102278416B1 (ko) * | 2016-10-17 | 2021-07-15 | 도요 고세이 고교 가부시키가이샤 | 조성물 및 이를 이용한 디바이스의 제조 방법 |
JP7079647B2 (ja) * | 2018-04-17 | 2022-06-02 | 東洋合成工業株式会社 | 組成物及びそれを用いたデバイスの製造方法 |
JP7249198B2 (ja) * | 2019-04-19 | 2023-03-30 | 東洋合成工業株式会社 | オニウム塩、組成物及びそれを用いたデバイスの製造方法 |
JPWO2022039212A1 (ja) * | 2020-08-20 | 2022-02-24 |
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2022
- 2022-02-21 WO PCT/JP2022/006978 patent/WO2022196258A1/ja active Application Filing
- 2022-02-21 JP JP2023506900A patent/JPWO2022196258A1/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
WO2022196258A1 (ja) | 2022-09-22 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20230905 |