JPWO2022191308A5 - - Google Patents
Download PDFInfo
- Publication number
- JPWO2022191308A5 JPWO2022191308A5 JP2022543175A JP2022543175A JPWO2022191308A5 JP WO2022191308 A5 JPWO2022191308 A5 JP WO2022191308A5 JP 2022543175 A JP2022543175 A JP 2022543175A JP 2022543175 A JP2022543175 A JP 2022543175A JP WO2022191308 A5 JPWO2022191308 A5 JP WO2022191308A5
- Authority
- JP
- Japan
- Prior art keywords
- thermally conductive
- conductive sheet
- sheet according
- titanium oxide
- mass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims 6
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims 6
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 claims 5
- 239000011231 conductive filler Substances 0.000 claims 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims 2
- 239000011230 binding agent Substances 0.000 claims 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims 1
- 229920002050 silicone resin Polymers 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021040096 | 2021-03-12 | ||
| JP2021040096 | 2021-03-12 | ||
| PCT/JP2022/010800 WO2022191308A1 (ja) | 2021-03-12 | 2022-03-11 | 熱伝導性シート |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2022191308A1 JPWO2022191308A1 (https=) | 2022-09-15 |
| JP7153828B1 JP7153828B1 (ja) | 2022-10-14 |
| JPWO2022191308A5 true JPWO2022191308A5 (https=) | 2023-02-07 |
Family
ID=83228152
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022543175A Active JP7153828B1 (ja) | 2021-03-12 | 2022-03-11 | 熱伝導性シート |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20240150638A1 (https=) |
| JP (1) | JP7153828B1 (https=) |
| KR (1) | KR102843818B1 (https=) |
| CN (1) | CN115397945A (https=) |
| TW (1) | TWI868430B (https=) |
| WO (1) | WO2022191308A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP4625487A1 (en) * | 2022-11-22 | 2025-10-01 | Shin-Etsu Chemical Co., Ltd. | Sheet-like heat dissipation member and thermally conductive composite |
| WO2025221825A1 (en) * | 2024-04-17 | 2025-10-23 | Henkel Ag & Co. Kgaa | Thermal interface materials |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003509578A (ja) * | 1999-09-21 | 2003-03-11 | サンーゴバン セラミックス アンド プラスティクス，インコーポレイティド | 熱管理のための疎水性化合物における熱伝導性材料 |
| JP5085050B2 (ja) | 2006-04-06 | 2012-11-28 | 株式会社マイクロン | 高熱伝導性樹脂コンパウンド・高熱伝導性樹脂成形体・放熱シート用配合粒子、高熱伝導性樹脂コンパウンド・高熱伝導性樹脂成形体・放熱シート、および、その製造方法 |
| JP5089908B2 (ja) | 2006-04-06 | 2012-12-05 | 株式会社マイクロン | 高熱伝導性樹脂コンパウンド・高熱伝導性樹脂成形体・放熱シート用配合粒子、高熱伝導性樹脂コンパウンド・高熱伝導性樹脂成形体・放熱シート、および、その製造方法 |
| US20090143522A1 (en) * | 2007-12-04 | 2009-06-04 | Sea-Fue Wang | Thermally Conductive Silicone Composition |
| JP5345340B2 (ja) | 2008-05-16 | 2013-11-20 | 新日鉄住金マテリアルズ株式会社 | アルミナ配合粒子および樹脂成形体 |
| WO2012018242A2 (ko) * | 2010-08-05 | 2012-02-09 | 한화케미칼 주식회사 | 탄소소재를 이용한 고효율 방열도료 조성물 |
| JP5736711B2 (ja) * | 2010-10-05 | 2015-06-17 | 住友ベークライト株式会社 | 接着体 |
| CN102134474B (zh) * | 2010-12-29 | 2013-10-02 | 深圳市优宝惠新材料科技有限公司 | 导热硅脂组合物 |
| CN104364900A (zh) * | 2012-04-17 | 2015-02-18 | 莫门蒂夫性能材料股份有限公司 | 用于减少成型周期时间的导热聚合物组合物 |
| JP6378533B2 (ja) * | 2013-06-01 | 2018-08-22 | 日東電工株式会社 | 熱伝導性粘着シート |
| JP2013225697A (ja) * | 2013-07-12 | 2013-10-31 | Micro Coatec Kk | 熱伝導性電子回路基板およびそれを用いた電子機器ならびにその製造方法 |
| KR102509813B1 (ko) * | 2018-12-25 | 2023-03-14 | 후지고분시고오교오가부시끼가이샤 | 열전도성 조성물 및 이것을 사용한 열전도성 시트 |
-
2022
- 2022-03-11 JP JP2022543175A patent/JP7153828B1/ja active Active
- 2022-03-11 KR KR1020227029127A patent/KR102843818B1/ko active Active
- 2022-03-11 WO PCT/JP2022/010800 patent/WO2022191308A1/ja not_active Ceased
- 2022-03-11 TW TW111108979A patent/TWI868430B/zh active
- 2022-03-11 CN CN202280003650.4A patent/CN115397945A/zh active Pending
- 2022-03-11 US US18/549,960 patent/US20240150638A1/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPWO2022191308A5 (https=) | ||
| JP2022103256A5 (https=) | ||
| JP2013131563A5 (https=) | ||
| JP3654743B2 (ja) | 放熱スペーサー | |
| JPWO2023119903A5 (https=) | ||
| WO2017201847A1 (zh) | 一种用于电热发热薄膜基材的绝热聚酰亚胺复合薄膜 | |
| JP2017218598A5 (https=) | ||
| JP2022033201A5 (https=) | ||
| CN207435368U (zh) | 内设有折叠状石墨片的导热垫片 | |
| JP2017028019A5 (https=) | ||
| CN203968561U (zh) | 一种散热装置及电子设备 | |
| CN209749023U (zh) | 一种石墨烯散热器 | |
| JP7449053B2 (ja) | 熱伝導性樹脂及び熱伝導性樹脂の製造方法 | |
| TWM376804U (en) | External thermal device and related electronic device | |
| JP2022502552A5 (https=) | ||
| CN205179620U (zh) | 一种导热铝箔 | |
| CN209056307U (zh) | 一种使用铝合金框架的高效散热电缆 | |
| TWM542324U (zh) | 可攜帶電子裝置之散熱塗層結構 | |
| Yuchen et al. | Study on Insulation Properties of Thermal Conductive Silicone Gel. | |
| CN208917126U (zh) | 一种导热硅脂 | |
| CN104244666A (zh) | 一种新型绝缘石墨 | |
| CN218277585U (zh) | 一种散热复合片 | |
| CN214013146U (zh) | 一种用于5g天线的柔性绝缘散热片 | |
| CN211702422U (zh) | 降低表面温度的htcc陶瓷加热器 | |
| JPWO2023162323A5 (https=) |