JP2022502552A5 - - Google Patents

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Publication number
JP2022502552A5
JP2022502552A5 JP2021519690A JP2021519690A JP2022502552A5 JP 2022502552 A5 JP2022502552 A5 JP 2022502552A5 JP 2021519690 A JP2021519690 A JP 2021519690A JP 2021519690 A JP2021519690 A JP 2021519690A JP 2022502552 A5 JP2022502552 A5 JP 2022502552A5
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JP
Japan
Prior art keywords
composition
particle size
thermally conductive
micrometers
aggregate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021519690A
Other languages
English (en)
Japanese (ja)
Other versions
JP2022502552A (ja
JP7320603B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2019/055514 external-priority patent/WO2020077031A1/en
Publication of JP2022502552A publication Critical patent/JP2022502552A/ja
Publication of JP2022502552A5 publication Critical patent/JP2022502552A5/ja
Application granted granted Critical
Publication of JP7320603B2 publication Critical patent/JP7320603B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2021519690A 2018-10-10 2019-10-10 沈降を低減するための高伝導性添加剤 Active JP7320603B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201862743895P 2018-10-10 2018-10-10
US62/743,895 2018-10-10
PCT/US2019/055514 WO2020077031A1 (en) 2018-10-10 2019-10-10 Highly conductive additives to reduce settling

Publications (3)

Publication Number Publication Date
JP2022502552A JP2022502552A (ja) 2022-01-11
JP2022502552A5 true JP2022502552A5 (https=) 2023-03-15
JP7320603B2 JP7320603B2 (ja) 2023-08-03

Family

ID=68426816

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021519690A Active JP7320603B2 (ja) 2018-10-10 2019-10-10 沈降を低減するための高伝導性添加剤

Country Status (4)

Country Link
US (1) US20210395594A1 (https=)
EP (1) EP3864076A1 (https=)
JP (1) JP7320603B2 (https=)
WO (1) WO2020077031A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7315107B2 (ja) 2021-04-08 2023-07-26 株式会社レゾナック 熱伝導性ウレタン樹脂組成物及び硬化物

Family Cites Families (23)

* Cited by examiner, † Cited by third party
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JP2704732B2 (ja) * 1988-08-01 1998-01-26 東レ・ダウコーニング・シリコーン株式会社 硬化性液状オルガノポリシロキサン組成物
JPH04174910A (ja) * 1990-11-08 1992-06-23 Kawasaki Steel Corp 絶縁放熱シート
JP3468996B2 (ja) * 1995-08-01 2003-11-25 株式会社東芝 エポキシ樹脂組成物及び樹脂封止型半導体装置
US6096414A (en) * 1997-11-25 2000-08-01 Parker-Hannifin Corporation High dielectric strength thermal interface material
JP4330739B2 (ja) * 1999-11-29 2009-09-16 電気化学工業株式会社 樹脂充填用窒化アルミニウム粉末及びその用途
JP4330738B2 (ja) * 1999-11-29 2009-09-16 電気化学工業株式会社 樹脂充填用窒化アルミニウム粉末及びその用途
JP2001355047A (ja) * 2000-06-14 2001-12-25 Kawasaki Steel Corp 冷間加工性と高周波焼入れ性に優れた高炭素鋼管およびその製造方法
JP2003342021A (ja) 2002-05-28 2003-12-03 Polymatech Co Ltd 酸化アルミニウム粉末組成物及びそれを含有する熱伝導性成形体
US7550097B2 (en) * 2003-09-03 2009-06-23 Momentive Performance Materials, Inc. Thermal conductive material utilizing electrically conductive nanoparticles
EP1751796A1 (en) 2004-05-20 2007-02-14 General Electric Company, (a New York Corporation) Organic matrices containing nanomaterials to enhance bulk thermal conductivity
JP5615475B2 (ja) 2006-03-23 2014-10-29 一般財団法人電力中央研究所 全固体変圧器用絶縁材の製造方法
TW200833752A (en) 2006-10-23 2008-08-16 Lord Corp Highly filled polymer materials
DE102007036301A1 (de) * 2007-07-31 2009-02-05 Behr Gmbh & Co. Kg Wärmetauschergehäuse, Wärmetauscher oder Baueinheit mit einem oder mehreren Wärmetauschern, Abgasrückführsystem, Ladeluftzuführsystem und Verwendung des Wärmetauschers
JP2009040945A (ja) * 2007-08-10 2009-02-26 Kyushu Refract Co Ltd 熱伝導性エラストマおよび橋かけ剤
JP5372388B2 (ja) * 2008-01-30 2013-12-18 東レ・ダウコーニング株式会社 熱伝導性シリコーングリース組成物
JP4930729B2 (ja) 2008-04-22 2012-05-16 信越化学工業株式会社 高熱伝導性シリコーンゴム組成物並びに熱定着ロール及び定着ベルト
US20120114310A1 (en) * 2010-11-05 2012-05-10 Research In Motion Limited Mixed Video Compilation
US8741998B2 (en) * 2011-02-25 2014-06-03 Sabic Innovative Plastics Ip B.V. Thermally conductive and electrically insulative polymer compositions containing a thermally insulative filler and uses thereof
US20130279119A1 (en) * 2012-04-20 2013-10-24 GM Global Technology Operations LLC Electronic assemblies and methods of fabricating electronic assemblies
EP2952476B1 (en) * 2013-02-04 2021-07-28 Tokuyama Corporation Method for producing sintered aluminum nitride granules and use in heat - radiating materials
JP2015046253A (ja) * 2013-08-27 2015-03-12 昭和電工株式会社 導電性組成物およびそれを用いた複合部材
TWI622613B (zh) 2014-07-31 2018-05-01 積水化成品工業股份有限公司 苯乙烯系樹脂發泡性粒子及其製造方法、發泡粒子、發泡成形體及其用途
JP6668712B2 (ja) * 2015-12-01 2020-03-18 味の素株式会社 樹脂組成物

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