JPWO2023090240A5 - - Google Patents

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Publication number
JPWO2023090240A5
JPWO2023090240A5 JP2023512336A JP2023512336A JPWO2023090240A5 JP WO2023090240 A5 JPWO2023090240 A5 JP WO2023090240A5 JP 2023512336 A JP2023512336 A JP 2023512336A JP 2023512336 A JP2023512336 A JP 2023512336A JP WO2023090240 A5 JPWO2023090240 A5 JP WO2023090240A5
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JP
Japan
Prior art keywords
boron nitride
nitride particles
particles
thermal grease
grease according
Prior art date
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Application number
JP2023512336A
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English (en)
Japanese (ja)
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JPWO2023090240A1 (https=
JP7262699B1 (ja
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Priority claimed from PCT/JP2022/041845 external-priority patent/WO2023090240A1/ja
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Publication of JP7262699B1 publication Critical patent/JP7262699B1/ja
Publication of JPWO2023090240A1 publication Critical patent/JPWO2023090240A1/ja
Publication of JPWO2023090240A5 publication Critical patent/JPWO2023090240A5/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2023512336A 2021-11-17 2022-11-10 放熱グリース Active JP7262699B1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021186954 2021-11-17
JP2021186954 2021-11-17
PCT/JP2022/041845 WO2023090240A1 (ja) 2021-11-17 2022-11-10 放熱グリース

Publications (3)

Publication Number Publication Date
JP7262699B1 JP7262699B1 (ja) 2023-04-21
JPWO2023090240A1 JPWO2023090240A1 (https=) 2023-05-25
JPWO2023090240A5 true JPWO2023090240A5 (https=) 2023-10-24

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ID=86052920

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023512336A Active JP7262699B1 (ja) 2021-11-17 2022-11-10 放熱グリース

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JP (1) JP7262699B1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024242157A1 (ja) * 2023-05-23 2024-11-28 デンカ株式会社 放熱グリース

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000114438A (ja) * 1998-09-30 2000-04-21 Shin Etsu Chem Co Ltd 半導体装置
US7445797B2 (en) * 2005-03-14 2008-11-04 Momentive Performance Materials Inc. Enhanced boron nitride composition and polymer-based compositions made therewith
JP2003027080A (ja) * 2001-07-11 2003-01-29 Hitachi Ltd 熱伝導性グリース、その実装方法、電子部品の冷却方法、電子装置及び情報処理装置
KR101261064B1 (ko) * 2004-08-23 2013-05-06 제너럴 일렉트릭 캄파니 열 전도성 조성물 및 그의 제조 방법
KR20140083001A (ko) * 2011-10-07 2014-07-03 쓰리엠 이노베이티브 프로퍼티즈 컴파니 열 저항이 낮은 열 그리스
JP2016162929A (ja) * 2015-03-03 2016-09-05 株式会社デンソー 放熱グリス、及びこれを用いた半導体冷却構造

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