WO2022191308A1 - 熱伝導性シート - Google Patents
熱伝導性シート Download PDFInfo
- Publication number
- WO2022191308A1 WO2022191308A1 PCT/JP2022/010800 JP2022010800W WO2022191308A1 WO 2022191308 A1 WO2022191308 A1 WO 2022191308A1 JP 2022010800 W JP2022010800 W JP 2022010800W WO 2022191308 A1 WO2022191308 A1 WO 2022191308A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- thermally conductive
- conductive sheet
- mass
- titanium oxide
- titanium nitride
- Prior art date
Links
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims abstract description 52
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims abstract description 52
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 claims abstract description 45
- 239000011231 conductive filler Substances 0.000 claims abstract description 38
- 239000011230 binding agent Substances 0.000 claims abstract description 23
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 26
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 13
- 229920002050 silicone resin Polymers 0.000 claims description 13
- 229920005989 resin Polymers 0.000 description 30
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- 239000000203 mixture Substances 0.000 description 18
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- 238000013461 design Methods 0.000 description 16
- 239000003086 colorant Substances 0.000 description 14
- 230000000052 comparative effect Effects 0.000 description 14
- 229910044991 metal oxide Inorganic materials 0.000 description 14
- 150000004706 metal oxides Chemical class 0.000 description 14
- 239000006087 Silane Coupling Agent Substances 0.000 description 13
- 150000004767 nitrides Chemical class 0.000 description 13
- 238000000034 method Methods 0.000 description 9
- 229920001187 thermosetting polymer Polymers 0.000 description 8
- 239000010410 layer Substances 0.000 description 6
- 238000011049 filling Methods 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 4
- 125000000524 functional group Chemical group 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 229910052582 BN Inorganic materials 0.000 description 3
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 3
- 125000003545 alkoxy group Chemical group 0.000 description 3
- 239000006229 carbon black Substances 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- KQAHMVLQCSALSX-UHFFFAOYSA-N decyl(trimethoxy)silane Chemical compound CCCCCCCCCC[Si](OC)(OC)OC KQAHMVLQCSALSX-UHFFFAOYSA-N 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 239000011256 inorganic filler Substances 0.000 description 3
- 229910003475 inorganic filler Inorganic materials 0.000 description 3
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000002041 carbon nanotube Substances 0.000 description 2
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- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
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- 239000004642 Polyimide Substances 0.000 description 1
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- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
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- OTARVPUIYXHRRB-UHFFFAOYSA-N diethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](C)(OCC)CCCOCC1CO1 OTARVPUIYXHRRB-UHFFFAOYSA-N 0.000 description 1
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- OYQYHJRSHHYEIG-UHFFFAOYSA-N ethyl carbamate;urea Chemical compound NC(N)=O.CCOC(N)=O OYQYHJRSHHYEIG-UHFFFAOYSA-N 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- -1 for example Inorganic materials 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
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- 150000003377 silicon compounds Chemical class 0.000 description 1
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- 229910052717 sulfur Inorganic materials 0.000 description 1
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- 239000002335 surface treatment layer Substances 0.000 description 1
- 230000005619 thermoelectricity Effects 0.000 description 1
- 239000013008 thixotropic agent Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Images
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- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
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- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
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- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
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- C04B2111/00439—Physico-chemical properties of the materials not provided for elsewhere in C04B2111/00
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Definitions
- the present invention relates to thermally conductive sheets.
- thermally conductive sheet (radiation sheet) is installed, for example, between a heat-generating component and a heat-radiating fin or metal plate, and is tightly attached to the heat-generating component by crimping without any gaps.
- the generated heat can be transferred to heat radiating fins or the like to dissipate heat from the entire system.
- the thermally conductive sheet is composed of, for example, a thermally conductive inorganic filler and a resin.
- a thermally conductive inorganic filler inexpensive aluminum hydroxide, aluminum oxide (alumina), silicon carbide, boron nitride, aluminum nitride, etc., which are expected to have higher thermal conductivity, are used.
- the resin for example, an acrylic resin or a urethane resin is used.
- thermally conductive sheet those disclosed in Patent Documents 1 to 3, for example, are known.
- thermally conductive sheets have been required to have even higher functionality, and those with better thermal conductivity than ever before are in demand.
- a thermally conductive filler such as alumina or aluminum hydroxide.
- carbon black which is widely used as a black colorant.
- the addition of carbon black imparts electrical conductivity to the thermally conductive sheet, increases the dielectric constant, and impairs the insulating properties. Therefore, there is a demand for a thermally conductive sheet that has excellent thermal conductivity, insulating properties, a low dielectric constant, and excellent design.
- the present disclosure has been made in view of the above, and an object of the present disclosure is to provide a thermally conductive sheet having excellent thermal conductivity, insulating properties, a low dielectric constant, and excellent design. be.
- the inventors of the present disclosure have made intensive studies to achieve the above object, and found that the binder component, titanium oxide, titanium nitride, and other thermally conductive fillers are included, and the ratio of titanium oxide to the total of titanium oxide and titanium nitride is It has been found that by setting the ratio within a specific range, it has excellent thermal conductivity, insulating properties, a low dielectric constant, and excellent design.
- the present disclosure relates to what was completed based on these findings.
- the present disclosure includes binder components, titanium oxide, titanium nitride, and other thermally conductive fillers, A thermally conductive sheet is provided in which the ratio of titanium oxide to the total of titanium oxide and titanium nitride is 20-90% by mass.
- the L * value of the surface of the thermally conductive sheet in the L * a * b * color system is preferably 41 or less.
- the total content of titanium oxide and titanium nitride is preferably 0.3 to 10.0 parts by mass with respect to 100 parts by mass of the thermally conductive filler.
- the total content of the thermally conductive filler, titanium oxide, and titanium nitride is preferably 70 to 100% by mass with respect to the total amount of the thermally conductive sheet.
- the binder component preferably contains a silicone resin.
- the dielectric constant of the thermally conductive sheet is preferably 15.0 or less.
- the thermal conductivity of the thermally conductive sheet in the plane direction is preferably 4.8 W/mK or more.
- the median diameter of titanium oxide and titanium nitride is preferably 15 nm or more.
- the thermally conductive filler preferably contains alumina, or alumina and aluminum nitride.
- the thermally conductive sheet of the present disclosure has excellent thermal conductivity, insulating properties, a low dielectric constant, and excellent design.
- thermally conductive sheet (heat dissipation sheet) according to an embodiment of the present disclosure includes at least a binder component, titanium oxide, titanium nitride, and other thermally conductive fillers.
- the thermally conductive sheet may be in a form without a substrate (substrate layer), a so-called “substrate-less”, or may be a thermally conductive sheet provided on at least one side of the substrate. good.
- base material base material layer
- the thermally conductive sheet may have a release sheet.
- the release sheet may be provided on only one side of the thermally conductive sheet, or may be provided on both sides.
- Examples of the release sheet include a film formed from a low-adhesive resin, a sheet including a substrate and a release treatment layer provided on at least one surface of the substrate, and the like. The release sheet is peeled off and removed when the thermally conductive sheet is used.
- FIG. 1 is a cross-sectional schematic diagram showing one embodiment of the thermally conductive sheet of the present disclosure.
- the thermally conductive sheet 1 includes a binder component 11 as a matrix component, thermally conductive fillers 12 dispersed in the binder component 11, and a black colorant 13 containing titanium oxide and titanium nitride. including.
- a release sheet 2 and a release sheet 3 are provided on both sides of the thermally conductive sheet 1 , and the thermally conductive sheet 1 is sandwiched between the two release sheets 2 and 3 .
- the binder component is a component that forms the matrix of the thermally conductive sheet.
- the binder component include resins (binder resins) such as thermoplastic resins, thermosetting resins, and active energy ray-curable resins. Only one type of the binder component may be used, or two or more types may be used.
- thermoplastic resin examples include polystyrene-based resin, vinyl acetate-based resin, polyester-based resin, polyolefin-based resin (e.g., polyethylene-based resin, polypropylene-based resin composition, etc.), polyimide-based resin, acrylic-based resin, and the like. be done. Only one type of the thermoplastic resin may be used, or two or more types may be used.
- thermosetting resin examples include both resins having thermosetting properties (thermosetting resins) and resins obtained by curing the above thermosetting resins.
- thermosetting resins examples include silicone resins, phenolic resins, epoxy resins, urethane resins, urethane urea resins, melamine resins, alkyd resins, polyimide resins, and acrylic resins. Only one kind of the thermosetting resin may be used, or two or more kinds thereof may be used.
- the active energy ray-curable resin includes both a resin that can be cured by irradiation with an active energy ray (active energy ray-curable resin) and a resin obtained by curing the active energy ray-curable resin.
- active energy ray-curable resin is not particularly limited, for example, a polymer of a polymerizable compound having at least two (meth)acryloyloxy groups in the molecule can be used. Only one type of the active energy ray-curable resin may be used, or two or more types may be used.
- the binder resin is preferably a thermosetting resin, and more preferably a silicone resin from the viewpoint of excellent thermal conductivity, heat resistance, and insulation.
- a silicone resin that is used for known or commonly used thermally conductive sheets can be used.
- the silicone resin is preferably a two-liquid curing silicone resin from the viewpoint that the thermally conductive filler can be well dispersed without using a solvent. Only one type of the silicone resin may be used, or two or more types may be used.
- the content of the binder component is preferably 1.0% by mass or more, more preferably 3.0% by mass or more, and still more preferably 5.0% by mass or more with respect to 100% by mass of the total amount of the thermally conductive sheet. is.
- the content is 1.0% by mass or more, the thermally conductive sheet is less likely to become brittle, and the thermally conductive sheet has excellent film formability.
- the above content is preferably 20.0% by mass or less, more preferably 15.0% by mass or less. In particular, it is preferable that the content of the silicone resin is within the above range.
- Titanium oxide and titanium nitride can act as a black coloring agent in the thermally conductive sheet to improve the design, and can also act as a thermally conductive filler. Furthermore, since titanium oxide and titanium nitride do not have electrical conductivity, the design can be improved without imparting electrical conductivity to the thermally conductive sheet. Only one kind of titanium oxide and titanium nitride may be used, or two or more kinds thereof may be used.
- the titanium oxide and titanium nitride contained in the thermally conductive sheet are particles. Titanium oxide and titanium nitride are blended as independent particles in the thermally conductive sheet. In addition, titanium oxide and titanium nitride may be surface-treated, but from the viewpoint of ensuring insulation and design, it is preferable not to have a shell layer (core-shell structure) or a surface treatment layer such as a surface treatment agent. preferable.
- the median diameter of titanium oxide and titanium nitride is preferably 15 nm or more, more preferably 25 nm or more, still more preferably 40 nm or more, and particularly preferably 50 nm or more. When the median diameter is 15 nm or more, the dielectric constant becomes lower.
- the median diameter is, for example, 100 nm or less, preferably 80 nm or less.
- the median diameter is the median diameter in the particle size distribution of the mixture of titanium oxide and titanium nitride.
- the median diameter is a median diameter (D50) measured by a dynamic light scattering method.
- the ratio of titanium oxide to the total (100% by mass) of titanium oxide and titanium nitride is 20 to 90% by mass, preferably 30 to 80% by mass, more preferably 35 to 55% by mass. When the ratio is within the above range, the thermally conductive sheet can be sufficiently blackened, and the design is excellent.
- the total content of titanium oxide and titanium nitride in the thermally conductive sheet is preferably 0.3 to 10.0 parts by mass, more preferably 0.3 to 10.0 parts by mass with respect to 100 parts by mass of the thermally conductive filler. is 0.5 to 9.0 parts by mass, more preferably 1.0 to 5.0 parts by mass, particularly preferably 1.2 to 2.0 parts by mass.
- the thermally conductive sheet can be sufficiently blackened, and the design is excellent.
- the content is 10.0 parts by mass or less, a sufficient amount of the thermally conductive filler can be blended, resulting in excellent thermal conductivity and excellent film formability of the thermally conductive sheet.
- the thermally conductive filler is particles having thermal conductivity other than titanium oxide and titanium nitride, and is a component that exhibits thermal conductivity in the thermally conductive sheet.
- the thermally conductive filler include metal particles; metal oxides such as alumina (aluminum oxide) and zinc oxide; nitrides such as aluminum nitride and boron nitride; metal hydroxides such as aluminum hydroxide; carbides; glass, silica, silicon carbide, silicon compounds such as silicon (silicon); ceramic fillers; inorganic fillers such as carbon materials such as carbon fibers, carbon nanotubes, and diamonds. Only one type of the thermally conductive filler may be used, or two or more types may be used.
- the thermally conductive filler metal oxides and nitrides are preferable. Among them, it is more preferable to contain metal oxides. From the viewpoint of better thermal conductivity, it is preferable to contain both metal oxides and nitrides. Especially preferred. In particular, alumina is preferable as the metal oxide, and aluminum nitride and boron nitride are preferable as the nitride.
- the thermally conductive filler contains a metal oxide and/or nitride, the content of the metal oxide and/or nitride in the thermally conductive filler is preferably 25% by mass or more, more preferably 30% by mass. % by mass or more.
- the upper limit is not particularly limited, it is preferably 100% by mass or less.
- the ratio of metal oxides to the total of metal oxides and nitrides is preferably 20 to 90% by mass, more preferably 30 to 70% by mass, and even more preferably is 35 to 55% by mass.
- the thermal conductivity of the thermally conductive sheet is much more excellent.
- the metal oxide in particular, alumina preferably has two or more peak tops in the particle size distribution, more preferably two peak tops. Also, one having five peak tops may be used.
- peak top A and peak top B peak tops
- peak top B peak top B
- peak top C to G peak top C
- peak top D is in the range of more than 1 ⁇ m and 10 ⁇ m.
- the peak top E is preferably in the range of more than 10 ⁇ m and 40 ⁇ m
- the peak top F is preferably in the range of more than 40 ⁇ m and 60 ⁇ m
- the peak top G is 60 ⁇ m and within the range of 100 ⁇ m. In this case, the filling property of the metal oxide in the thermally conductive sheet becomes higher, and the thermal conductivity is more excellent.
- the nitride in particular, aluminum nitride
- the nitride preferably has two or more peak tops in the particle size distribution, more preferably two peak tops.
- One of the two or more peak tops is preferably within the range of 0.5 to 20 ⁇ m, and the other is preferably within the range of 30 to 80 ⁇ m. In this case, the filling property of the nitride in the thermally conductive sheet becomes higher, and the thermal conductivity is more excellent.
- the shape of the thermally conductive filler is not particularly limited, and is spherical (including true spheres and elliptical spheres), flake-like (scale-like), dendritic, massive, flat, needle-like, amorphous (polyhedron), and the like. are mentioned. Among them, from the viewpoint of higher filling property in the thermally conductive sheet and more excellent thermal conductivity, when the thermally conductive filler is a metal oxide, it is spherical, and when it is a nitride, it is spherical and / or non-spherical. A fixed shape (polyhedron) is preferred.
- spherical metal oxide for example, alumina beads CB series manufactured by Showa Denko KK can be used.
- spherical nitride for example, the RFS series manufactured by Thrutek can be used.
- amorphous (polyhedral) nitride for example, the SFS series manufactured by Thrutek can be used.
- the thermally conductive filler may or may not be surface-treated.
- a silane coupling agent is mentioned as a surface treatment agent which performs the said surface treatment.
- the thermally conductive filler has good dispersibility in the binder component (especially silicone resin), which is the matrix of the thermally conductive sheet. Excellent. Only one kind of the silane coupling agent may be used, or two or more kinds thereof may be used.
- silane coupling agent examples include ⁇ -(3,4-epoxycyclohexyl)ethyltrimethoxysilane, ⁇ -glycidoxypropyltrimethoxysilane, ⁇ -glycidoxypropylmethyldiethoxysilane, etc., other than alkoxy groups.
- silane coupling agent having a functional group (functional group-containing silane coupling agent); silane coupling agent having no functional group other than an alkoxy group such as n-decyltrimethoxysilane (functional group-free silane coupling agent) etc.
- a silane coupling agent containing no functional group is preferable, more preferably an alkoxy, from the viewpoint of good wettability with the thermally conductive filler and expected improvement in bulk strength and flexibility of the thermally conductive sheet.
- the content ratio (total amount) of the thermally conductive filler in the thermally conductive sheet is preferably 70 to 98% by mass, more preferably 80 to 98% by mass, with respect to 100% by mass of the total amount of the thermally conductive sheet. 95% by mass.
- the content is 70% by mass or more, the filling rate of the thermally conductive filler in the thermally conductive sheet is high, and the thermal conductivity is excellent.
- the content is 98% by mass or less, the thermally conductive sheet is less likely to become brittle, and excellent film-forming properties are obtained when the thermally conductive sheet is produced.
- the total content of the thermally conductive filler, titanium oxide, and titanium nitride in the thermally conductive sheet is preferably 70 to 98% by mass with respect to 100% by mass as the total amount of the thermally conductive sheet. , more preferably 75 to 96% by mass, still more preferably 85 to 95% by mass, and particularly preferably 90 to 94% by mass.
- the content ratio is 70% by mass or more, the filling property of the filler in the thermally conductive sheet is higher, and the thermal conductivity and design are excellent.
- the content is 98% by mass or less, the thermally conductive sheet is less likely to become brittle, and excellent film-forming properties are obtained when the thermally conductive sheet is produced.
- the thermally conductive sheet may contain components other than the various components described above.
- the other components include thixotropic agents, dispersants, curing agents, curing accelerators, curing retarders, slight tackifiers, plasticizers, flame retardants, antioxidants, stabilizers, titanium oxide and nitriding agents.
- examples include coloring agents other than titanium.
- the thermally conductive sheet contains other coloring agents such as a black coloring agent other than titanium oxide and titanium nitride from the viewpoints of having insulating properties and excellent low dielectric constant and from the viewpoint of suppressing inhibition of hardening of the binder component. preferably not. It should be noted that other coloring agents may be included as long as they do not impair the effects of the present invention. Examples of the other coloring agents include conductive coloring agents such as carbon black and carbon materials such as carbon nanotubes. Further, it is preferable not to include a colorant containing sulfur because it inhibits curing of the binder component.
- the content of the other coloring agent is preferably 30 parts by mass or less, more preferably 10 parts by mass or less, still more preferably 5 parts by mass or less, and particularly preferably 100 parts by mass in total of titanium oxide and titanium nitride. It is 1 part by mass or less.
- the thickness of the thermally conductive sheet is, for example, 0.2 to 10 mm, preferably 0.3 to 5 mm.
- the thermally conductive sheet can be produced with good film-forming properties even if it is thin, and is suitable for use in small portable electronic devices. It is 1.2 mm or less, more preferably 1 mm or less, and particularly preferably 0.5 mm or less.
- the thermal conductivity of the thermally conductive sheet in the planar direction is preferably 4.8 W/mK or higher, more preferably 5.0 W/mK or higher.
- the thermal conductivity is 4.8 W/mK or more, the thermal conductivity and the heat dissipation are excellent.
- the thermal conductivity of the thermally conductive sheet in the thickness direction is preferably 2.5 W/mK or more, more preferably 2.6 W/mK or more. When the thermal conductivity is 2.5 W/mK or more, the thermal conductivity and heat dissipation in the thickness direction are excellent.
- the thermally conductive sheet preferably has a dielectric constant of 15.0 or less, more preferably 10.0 or less, and even more preferably 9.0 or less.
- the dielectric constant is, for example, 3.0 or higher.
- the heat conductive sheet preferably has a dielectric loss tangent of 0.02 or less, more preferably 0.01 or less.
- the dielectric loss tangent is 0.02 or less, transmission loss of high-frequency signals flowing through circuits of electronic devices such as arithmetic processing units can be suppressed.
- the L * value of the surface of the thermally conductive sheet in the L * a * b * color system is preferably 41 or less, more preferably 40 or less, still more preferably 39 or less, and particularly preferably 38 or less.
- the design of the thermally conductive sheet is more excellent.
- the total emissivity of the thermally conductive sheet measured in accordance with JIS R 1693-2 in a wavelength range of 1700 nm to 5600 nm at a temperature of 80°C is preferably 40% or more, more preferably 45%. or more, more preferably 48% or more.
- the total emissivity is 40% or more, the heat-dissipating property of the thermally-conductive sheet is excellent.
- the method for forming the thermally conductive sheet is not particularly limited, and a known or commonly used method for forming a film or forming a molded body can be employed. Among them, roll-to-roll film formation is preferable from the viewpoint of continuous film formation and excellent productivity.
- the thermally conductive sheet is formed by, for example, coating a composition containing the various components described above on the release-treated surface of a base material or a release sheet to form a coating layer, and then drying or curing by heating. It can be manufactured as a film. Heating may be performed in a state where a release-treated surface of a release sheet is further laminated on the coating layer.
- the composition contains the binder component, titanium oxide, titanium nitride, and the thermally conductive filler. Titanium oxide, titanium nitride, and the thermally conductive filler may be mixed in advance and then mixed with the binder component, and titanium oxide, titanium nitride, the thermally conductive filler, and the binder component are mixed at the same time. You may The composition is preferably in the form of a paste containing no organic solvent.
- the method for producing a sheet of the above composition is not particularly limited, and a known coating method such as a sandwich method in which a material is placed between release sheets coated with a release agent and laminated with a roll laminator, a hot press molding machine, an extruder, etc. Construction method can be adopted.
- Example 1 Alumina (mixture of 23.9 parts by mass of spherical alumina with a median diameter of 45 ⁇ m and 17.5 parts by mass of spherical alumina with a median diameter of 10 ⁇ m) and aluminum nitride (34.6 parts by mass of spherical aluminum nitride with a median diameter of 55 ⁇ m and a polyhedron with a median diameter of 2 ⁇ m)
- aluminum nitride 34.6 parts by mass of spherical aluminum nitride with a median diameter of 55 ⁇ m and a polyhedron with a median diameter of 2 ⁇ m
- a mixture of 23.0 parts by mass of aluminum nitride) (mass ratio 58:42) and a mixture of titanium oxide and titanium nitride (mass ratio 40:60, median diameter: 20 nm) are mixed to form a particle composition 1 was produced.
- the alumina and aluminum nitride are prepared in advance by adding 1 part by weight of a silane coupling agent (trade name "Z-6210", manufactured by Dow Toray Industries, Inc., n-decyltrimethoxysilane) to 100 parts by weight of the particles, and adding 1 part by weight of the solvent. By stirring and mixing inside, surface treatment is performed with a silane coupling agent.
- the above particle composition 1 was mixed with a mixture of 1st part and 2nd part of a silicone resin (trade name “TSE-3062”, manufactured by Momentive) to prepare a resin paste.
- the resin paste was placed between the release-treated surfaces of two release sheets and laminated using a roll laminator to produce a laminate of [release sheet/resin paste layer/release sheet]. Then, the laminate is heated at 70° C. for 30 minutes to thermally cure the resin paste layer, and the thermally conductive sheet (thickness thickness: 800 ⁇ m).
- Examples 2-5 The heats of Examples 2 to 5 were prepared in the same manner as in Example 1 except that the mixture of titanium oxide and titanium nitride having the mass ratio of titanium oxide and titanium nitride and the median diameter of the mixture shown in Table 1 were used. A conductive sheet was produced.
- Example 6 As alumina, 7.4 parts by mass of spherical alumina particles with a median diameter of 0.3 ⁇ m, 20.7 parts by mass of spherical alumina particles with a median diameter of 1.9 ⁇ m, 20.7 parts by mass of spherical alumina particles with a median diameter of 21 ⁇ m, and a median Using 93.2 parts by mass of a mixture of 17.8 parts by mass of spherical alumina particles with a diameter of 44 ⁇ m and 26.6 parts by mass of spherical alumina particles with a median diameter of 73 ⁇ m, titanium oxide, titanium nitride, and the amount of silicone resin blended A thermally conductive sheet of Example 6 was produced in the same manner as in Example 1, except that Table 1 was used and aluminum nitride was not used.
- Comparative example 1 A thermally conductive sheet of Comparative Example 1 was produced in the same manner as in Example 1 except that titanium oxide alone (median diameter: 300 nm) was used instead of the mixture of titanium oxide and titanium nitride.
- Comparative example 2 A thermally conductive sheet of Comparative Example 2 was produced in the same manner as in Example 1 except that titanium oxide alone (median diameter: 35 nm) was used instead of the mixture of titanium oxide and titanium nitride.
- Comparative example 3 Example 1 except that the blending amounts of aluminum nitride and alumina were changed as shown in Table 1, and 1.0 parts by mass of thermal black was used instead of 1.4 parts by mass of the mixture of titanium oxide and titanium nitride.
- a thermally conductive sheet of Comparative Example 3 was produced in the same manner.
- Comparative example 4 Aluminum nitride, titanium oxide, and titanium nitride are not used, and 50.9 parts by mass of spherical alumina particles with a median diameter of 45 ⁇ m, 37 parts by mass of spherical alumina particles with a median diameter of 5 ⁇ m, and spherical alumina particles with a median diameter of 0.2 ⁇ m
- a thermally conductive sheet of Comparative Example 4 was produced in the same manner as in Example 1 except that 92.5 parts by mass of the mixture with 4.6 parts by mass was used and the blending amounts were as shown in Table 1.
- Reference example 1 As the thermally conductive sheet of Reference Example 1, the product name "Thermo-TransUTW" (manufactured by Widework Co., Ltd.) was used.
- Reference example 2 As the thermally conductive sheet of Reference Example 2, the trade name "Conductive Thermal Pad for CPU Cooling” (manufactured by Fosa) was used.
- Thermal conductivity A bulk body having a thickness of 1 mm or more is prepared by laminating thermally conductive sheets, and heat is measured by a laser flash method using a thermophysical property measuring device (trade name “TA35”, manufactured by Bethel Co., Ltd.). Diffusivity measurements were performed. Further, the specific heat of the thermally conductive sheet was measured at 25° C. by the DSC method using a differential scanning calorimeter (trade name “X-DSC7000”, manufactured by Hitachi High-Tech Science Co., Ltd.). Further, the specific gravity of the thermally conductive sheet was measured by an underwater replacement method using an electronic hydrometer (trade name “EW-300SG”, manufactured by Alpha Mirage Co., Ltd.). Then, the thermal conductivity was calculated by calculation using the thermal diffusivity, specific heat, and specific gravity obtained above. Note that the thermal conductivity was calculated both in the planar direction and the thickness direction.
- the thermally conductive sheets of Examples have high thermal conductivity, excellent thermal conductivity, low dielectric constant, insulating properties, and sufficiently low L * value, which is excellent in design.
- the dielectric loss tangent was low.
- the total emissivity of the thermally conductive sheets of Examples was estimated to be 40% or more.
- titanium nitride was not used as the black colorant (Comparative Examples 1 and 2)
- the L * value was high and the design was poor.
- thermal black was used as the black colorant (Comparative Example 3)
- the thermal conductivity was low and the thermal conductivity was poor.
- thermoelectricity and total emissivity were low, and the design and thermal conductivity were low. Poor conductivity.
- the thermally conductive sheet of Reference Example 1 had a dielectric constant exceeding the measurement limit and had electrical conductivity, while the thermally conductive sheet of Reference Example 2 had a low thermal conductivity and was inferior in thermal conductivity.
- the thermally conductive sheet of the present invention can be used for electronic components that require heat dissipation effect.
- thermally conductive sheets 2 1 thermally conductive sheets 2, 3 release sheet 11 binder component 12 thermally conductive filler 13 black colorant
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Abstract
Description
酸化チタンおよび窒化チタンの合計に対する酸化チタンの割合は20~90質量%である、熱伝導性シートを提供する。
本開示の一実施形態に係る熱伝導性シート(放熱シート)は、バインダー成分、酸化チタン、窒化チタン、およびこれら以外の熱伝導性フィラーを少なくとも含む。
上記バインダー成分は、熱伝導性シートのマトリックスを形成する成分である。上記バインダー成分としては、熱可塑性樹脂、熱硬化型樹脂、活性エネルギー線硬化型樹脂等の樹脂(バインダー樹脂)などが挙げられる。上記バインダー成分は、一種のみを使用してもよいし、二種以上を使用してもよい。
酸化チタンおよび窒化チタンは、上記熱伝導性シートにおいて黒系着色剤として作用し、意匠性を優れたものとすることができ、また熱伝導性フィラーとしても作用し得る。さらに、酸化チタンおよび窒化チタンは導電性を有しないため、熱伝導性シートに導電性を付与することなく意匠性を向上させることができる。酸化チタンおよび窒化チタンは、それぞれ、一種のみを使用してもよいし、二種以上を使用してもよい。
上記熱伝導性フィラーは、酸化チタンおよび窒化チタン以外の熱伝導性を有する粒子であり、上記熱伝導性シートにおいて熱伝導性を発揮する成分である。上記熱伝導性フィラーとしては、例えば、金属粒子;アルミナ(酸化アルミニウム)、酸化亜鉛等の金属酸化物;窒化アルミニウム、窒化ホウ素等の窒化物;水酸化アルミニウム等の金属水酸化物;炭化ケイ素等の炭化物;ガラス、シリカ、炭化ケイ素、ケイ素(シリコン)等のケイ素化合物;セラミックフィラー;炭素繊維、カーボンナノチューブ、ダイヤモンド等の炭素材料などの無機フィラーが挙げられる。上記熱伝導性フィラーは、一種のみを使用してもよいし、二種以上を使用してもよい。
上記熱伝導性シートの厚さは、例えば0.2~10mmであり、好ましくは0.3~5mmである。なお、上記熱伝導性シートは、薄くても成膜性よく作製することができ、小型の携帯電子機器への使用に適するため、好ましくは2.3mm以下、より好ましくは2mm以下、さらに好ましくは1.2mm以下、さらに好ましくは1mm以下、特に好ましくは0.5mm以下である。
アルミナ(メディアン径45μmの球状アルミナ23.9質量部とメディアン径10μmの球状アルミナ17.5質量部の混合物)および窒化アルミニウム(メディアン径55μmの球状窒化アルミニウム34.6質量部とメディアン径2μmの多面体状窒化アルミニウム23.0質量部の混合物)の混合物(質量比58:42)と、酸化チタンおよび窒化チタンの混合物(質量比40:60、メディアン径:20nm)とを混合して、粒子組成物1を作製した。上記アルミナおよび窒化アルミニウムは、事前に、粒子100質量部に対してシランカップリング剤(商品名「Z-6210」、ダウ・東レ株式会社製、n-デシルトリメトキシシラン)1質量部を、溶媒中で撹拌混合することで、シランカップリング剤により表面処理を行ったものである。上記粒子組成物1を、シリコーン樹脂(商品名「TSE-3062」、Momentive社製)の1剤および2剤の混合物に混合して樹脂ペーストを作製した。続いて、2枚の剥離シートの離型処理面の間に上記樹脂ペーストを配置し、ロールラミネーターを用いてラミネートし[剥離シート/樹脂ペースト層/剥離シート]の積層体を作製した。そして、上記積層体を70℃で30分間加熱することで樹脂ペースト層を熱硬化させ、[剥離シート/熱伝導性シート/剥離シート]の積層体として、実施例1の熱伝導性シート(厚さ:800μm)を作製した。
酸化チタンおよび窒化チタンの混合物として、酸化チタンおよび窒化チタンの質量比と混合物のメディアン径とがそれぞれ表1に示すものを用いたこと以外は実施例1と同様にして実施例2~5の熱伝導性シートを作製した。
アルミナとして、メディアン径0.3μmの球状アルミナ粒子7.4質量部と、メディアン径1.9μmの球状アルミナ粒子20.7質量部と、メディアン径21μmの球状アルミナ粒子20.7質量部と、メディアン径44μmの球状アルミナ粒子17.8質量部と、メディアン径73μmの球状アルミナ粒子26.6質量部との混合物93.2質量部を使用し、酸化チタン、窒化チタン、およびシリコーン樹脂の配合量を表1の通りとしたこと、および窒化アルミニウムを使用しなかったこと以外は、実施例1と同様にして実施例6の熱伝導性シートを作製した。
酸化チタンおよび窒化チタンの混合物に代えて、酸化チタンのみ(メディアン径:300nm)を用いたこと以外は実施例1と同様にして比較例1の熱伝導性シートを作製した。
酸化チタンおよび窒化チタンの混合物に代えて、酸化チタンのみ(メディアン径:35nm)を用いたこと以外は実施例1と同様にして比較例2の熱伝導性シートを作製した。
窒化アルミニウムとアルミナの配合量を表1に示すように変更し、酸化チタンおよび窒化チタンの混合物1.4質量部に代えて、サーマルブラック1.0質量部を用いたこと以外は実施例1と同様にして比較例3の熱伝導性シートを作製した。
窒化アルミニウムと酸化チタンと窒化チタンとを使用せず、メディアン径45μmの球状アルミナ粒子を50.9質量部と、メディアン径5μmの球状アルミナ粒子37質量部と、メディアン径0.2μmの球状アルミナ粒子4.6質量部との混合物92.5質量部を使用し、配合量を表1の通りとしたこと以外は、実施例1と同様にして比較例4の熱伝導性シートを作製した。
参考例1の熱伝導性シートとして、商品名「Thermo-TranzUTW」(株式会社ワイドワーク製)を用いた。
参考例2の熱伝導性シートとして、商品名「CPU冷却用導電性サーマルパッド」(Fosa社製)を用いた。
実施例、比較例、および参考例で得られた各熱伝導性シートについて以下の通り評価した。評価結果は表に記載した。
熱伝導性シートを積層して厚さ1mm以上のバルク体を作製し、熱物性測定装置(商品名「TA35」、株式会社ベテル製)を用いてレーザーフラッシュ法にて熱拡散率測定を実施した。また、熱伝導性シートについて、示差走査熱量計(商品名「X-DSC7000」型、株式会社日立ハイテクサイエンス製)を用いて、DSC法によって25℃における比熱測定を実施した。また、熱伝導性シートについて、電子比重計(商品名「EW-300SG」、アルファーミラージュ株式会社製)を用いて、水中置換法にて比重測定を実施した。そして、上記で得られた熱拡散率、比熱、および比重を用いた計算により、熱伝導率を算出した。なお、熱伝導率については、平面方向および厚さ方向の両方について算出した。
分光光度計(商品名「Ci64」、X-Rite製)を用いて熱伝導性シート表面を測定した。測定方式はSPIN、F2/10とした。そして、JIS Z 8781-4に規定されているL*a*b*表色系の色表示方法を用いて、L*値を測定した。
実施例、参考例、および比較例において作製した熱伝導性シートについて、インピーダンス・アナライザ「E4991B」(KEYSIGHT社製)を用いて、平行平板法(条件:23℃、1GHz)により比誘電率(ε)および誘電正接(tanδ)を測定した。
比較例4の熱伝導性シートについて、JIS R 1693-2に準拠し、波長1700nm~5600nmの範囲について温度80℃の条件下で全放射率を測定した。
2,3 剥離シート
11 バインダー成分
12 熱伝導性フィラー
13 黒系着色剤
Claims (9)
- バインダー成分、酸化チタン、窒化チタン、およびこれら以外の熱伝導性フィラーを含み、
酸化チタンおよび窒化チタンの合計に対する酸化チタンの割合は20~90質量%である、熱伝導性シート。 - 前記熱伝導性シート表面のL*a*b*表色系におけるL*値は41以下である請求項1に記載の熱伝導性シート。
- 酸化チタンおよび窒化チタンの合計の含有量は、前記熱伝導性フィラー100質量部に対して0.3~10.0質量部である、請求項1または2に記載の熱伝導性シート。
- 前記熱伝導性フィラー、酸化チタン、および窒化チタンの合計の含有割合は、前記熱伝導性シートの総量に対して70~98質量%である、請求項1~3のいずれか1項に記載の熱伝導性シート。
- 前記バインダー成分はシリコーン樹脂を含む請求項1~4のいずれか1項に記載の熱伝導性シート。
- 比誘電率は15.0以下である請求項1~5のいずれか1項に記載の熱伝導性シート。
- 平面方向の熱伝導率は4.8W/mK以上である請求項1~6のいずれか1項に記載の熱伝導性シート。
- 酸化チタンおよび窒化チタンのメディアン径は15nm以上である請求項1~7のいずれか1項に記載の熱伝導性シート。
- 前記熱伝導性フィラーはアルミナ、または、アルミナおよび窒化アルミニウムを含む請求項1~8のいずれか1項に記載の熱伝導性シート。
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JP2003509578A (ja) * | 1999-09-21 | 2003-03-11 | サンーゴバン セラミックス アンド プラスティクス,インコーポレイティド | 熱管理のための疎水性化合物における熱伝導性材料 |
US20090143522A1 (en) * | 2007-12-04 | 2009-06-04 | Sea-Fue Wang | Thermally Conductive Silicone Composition |
JP2012076421A (ja) * | 2010-10-05 | 2012-04-19 | Sumitomo Bakelite Co Ltd | 接着体 |
JP2013225697A (ja) * | 2013-07-12 | 2013-10-31 | Micro Coatec Kk | 熱伝導性電子回路基板およびそれを用いた電子機器ならびにその製造方法 |
US20150034858A1 (en) * | 2012-04-17 | 2015-02-05 | Chandrashekar Raman | Thermally conductive polymer compositions to reduce molding cycle time |
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JP5089908B2 (ja) | 2006-04-06 | 2012-12-05 | 株式会社マイクロン | 高熱伝導性樹脂コンパウンド・高熱伝導性樹脂成形体・放熱シート用配合粒子、高熱伝導性樹脂コンパウンド・高熱伝導性樹脂成形体・放熱シート、および、その製造方法 |
JP5345340B2 (ja) | 2008-05-16 | 2013-11-20 | 新日鉄住金マテリアルズ株式会社 | アルミナ配合粒子および樹脂成形体 |
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JP2003509578A (ja) * | 1999-09-21 | 2003-03-11 | サンーゴバン セラミックス アンド プラスティクス,インコーポレイティド | 熱管理のための疎水性化合物における熱伝導性材料 |
US20090143522A1 (en) * | 2007-12-04 | 2009-06-04 | Sea-Fue Wang | Thermally Conductive Silicone Composition |
JP2012076421A (ja) * | 2010-10-05 | 2012-04-19 | Sumitomo Bakelite Co Ltd | 接着体 |
US20150034858A1 (en) * | 2012-04-17 | 2015-02-05 | Chandrashekar Raman | Thermally conductive polymer compositions to reduce molding cycle time |
JP2013225697A (ja) * | 2013-07-12 | 2013-10-31 | Micro Coatec Kk | 熱伝導性電子回路基板およびそれを用いた電子機器ならびにその製造方法 |
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