JPWO2022149467A1 - - Google Patents
Info
- Publication number
- JPWO2022149467A1 JPWO2022149467A1 JP2022573991A JP2022573991A JPWO2022149467A1 JP WO2022149467 A1 JPWO2022149467 A1 JP WO2022149467A1 JP 2022573991 A JP2022573991 A JP 2022573991A JP 2022573991 A JP2022573991 A JP 2022573991A JP WO2022149467 A1 JPWO2022149467 A1 JP WO2022149467A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/809—Constructional details of image sensors of hybrid image sensors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S17/00—Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
- G01S17/02—Systems using the reflection of electromagnetic waves other than radio waves
- G01S17/06—Systems determining position data of a target
- G01S17/08—Systems determining position data of a target for measuring distance only
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S17/00—Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
- G01S17/88—Lidar systems specially adapted for specific applications
- G01S17/89—Lidar systems specially adapted for specific applications for mapping or imaging
- G01S17/894—Three-dimensional [3D] imaging with simultaneous measurement of time-of-flight at a two-dimensional [2D] array of receiver pixels, e.g. time-of-flight cameras or flash lidar
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S17/00—Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
- G01S17/88—Lidar systems specially adapted for specific applications
- G01S17/93—Lidar systems specially adapted for specific applications for anti-collision purposes
- G01S17/931—Lidar systems specially adapted for specific applications for anti-collision purposes of land vehicles
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S17/00—Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
- G01S17/88—Lidar systems specially adapted for specific applications
- G01S17/93—Lidar systems specially adapted for specific applications for anti-collision purposes
- G01S17/933—Lidar systems specially adapted for specific applications for anti-collision purposes of aircraft or spacecraft
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
- G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
- G01S7/481—Constructional features, e.g. arrangements of optical elements
- G01S7/4816—Constructional features, e.g. arrangements of optical elements of receivers alone
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
- G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
- G01S7/491—Details of non-pulse systems
- G01S7/4912—Receivers
- G01S7/4913—Circuits for detection, sampling, integration or read-out
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/703—SSIS architectures incorporating pixels for producing signals other than image signals
- H04N25/706—Pixels for exposure or ambient light measuring
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
- H04N25/77—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
- H04N25/77—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components
- H04N25/772—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components comprising A/D, V/T, V/F, I/T or I/F converters
- H04N25/773—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components comprising A/D, V/T, V/F, I/T or I/F converters comprising photon counting circuits, e.g. single photon detection [SPD] or single photon avalanche diodes [SPAD]
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/79—Arrangements of circuitry being divided between different or multiple substrates, chips or circuit boards, e.g. stacked image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F30/00—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors
- H10F30/20—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors
- H10F30/21—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation
- H10F30/22—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation the devices having only one potential barrier, e.g. photodiodes
- H10F30/225—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation the devices having only one potential barrier, e.g. photodiodes the potential barrier working in avalanche mode, e.g. avalanche photodiodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
- H10F39/18—Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/802—Geometry or disposition of elements in pixels, e.g. address-lines or gate electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/803—Pixels having integrated switching, control, storage or amplification elements
- H10F39/8037—Pixels having integrated switching, control, storage or amplification elements the integrated elements comprising a transistor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/805—Coatings
- H10F39/8057—Optical shielding
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/811—Interconnections
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/95—Circuit arrangements
- H10F77/953—Circuit arrangements for devices having potential barriers
- H10F77/959—Circuit arrangements for devices having potential barriers for devices working in avalanche mode
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
- H10F39/199—Back-illuminated image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/807—Pixel isolation structures
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Radar, Positioning & Navigation (AREA)
- Computer Networks & Wireless Communication (AREA)
- General Physics & Mathematics (AREA)
- Remote Sensing (AREA)
- Electromagnetism (AREA)
- Signal Processing (AREA)
- Multimedia (AREA)
- Aviation & Aerospace Engineering (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Light Receiving Elements (AREA)
- Measurement Of Optical Distance (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021000770 | 2021-01-06 | ||
| PCT/JP2021/047513 WO2022149467A1 (ja) | 2021-01-06 | 2021-12-22 | 受光素子および測距システム |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2022149467A1 true JPWO2022149467A1 (https=) | 2022-07-14 |
Family
ID=82357709
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022573991A Pending JPWO2022149467A1 (https=) | 2021-01-06 | 2021-12-22 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20240313022A1 (https=) |
| EP (1) | EP4276905A4 (https=) |
| JP (1) | JPWO2022149467A1 (https=) |
| KR (1) | KR20230124908A (https=) |
| CN (1) | CN116438805A (https=) |
| WO (1) | WO2022149467A1 (https=) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019075394A (ja) * | 2017-10-12 | 2019-05-16 | ソニーセミコンダクタソリューションズ株式会社 | 固体撮像素子、および、電子装置 |
| US20260075970A1 (en) * | 2022-09-02 | 2026-03-12 | Sony Semiconductor Solutions Corporation | Photodetector and distance measurement apparatus |
| JP2024078505A (ja) * | 2022-11-30 | 2024-06-11 | キヤノン株式会社 | 光電変換装置 |
| EP4651207A4 (en) * | 2023-01-13 | 2026-04-08 | Sony Semiconductor Solutions Corp | LIGHT DETECTION DEVICE |
| WO2024214356A1 (ja) * | 2023-04-12 | 2024-10-17 | ソニーセミコンダクタソリューションズ株式会社 | 光検出装置および電子機器 |
| WO2025069258A1 (ja) * | 2023-09-27 | 2025-04-03 | ソニーセミコンダクタソリューションズ株式会社 | 半導体装置および光検出装置 |
| WO2025158884A1 (ja) * | 2024-01-22 | 2025-07-31 | ソニーセミコンダクタソリューションズ株式会社 | 半導体装置および電子機器 |
| WO2025192019A1 (ja) * | 2024-03-11 | 2025-09-18 | ソニーセミコンダクタソリューションズ株式会社 | 光検出装置及び測距システム |
| WO2026053822A1 (ja) * | 2024-09-09 | 2026-03-12 | ソニーセミコンダクタソリューションズ株式会社 | 半導体素子および電子機器 |
Citations (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000275348A (ja) * | 1999-03-26 | 2000-10-06 | Toshiba Corp | 信号増倍x線撮像装置 |
| JP2013033896A (ja) * | 2011-06-30 | 2013-02-14 | Sony Corp | 撮像素子、撮像素子の駆動方法、撮像素子の製造方法、および電子機器 |
| JP2015188083A (ja) * | 2014-03-13 | 2015-10-29 | 株式会社半導体エネルギー研究所 | 撮像装置 |
| JP2015204498A (ja) * | 2014-04-11 | 2015-11-16 | 株式会社東芝 | 光検出器 |
| WO2017043068A1 (ja) * | 2015-09-09 | 2017-03-16 | パナソニックIpマネジメント株式会社 | 固体撮像素子 |
| JP2017153064A (ja) * | 2015-10-23 | 2017-08-31 | インフィネオン テクノロジーズ アーゲーInfineon Technologies Ag | 半導体スイッチングデバイスおよびクランプダイオードを含む電気組立体 |
| JP2018125845A (ja) * | 2017-02-01 | 2018-08-09 | ルネサスエレクトロニクス株式会社 | 撮像素子 |
| JP2019186598A (ja) * | 2018-04-02 | 2019-10-24 | キヤノン株式会社 | 光電変換装置及び撮像システム |
| JP2020034523A (ja) * | 2018-08-31 | 2020-03-05 | ソニーセミコンダクタソリューションズ株式会社 | 受光素子および測距システム |
| WO2020158401A1 (ja) * | 2019-01-30 | 2020-08-06 | ソニーセミコンダクタソリューションズ株式会社 | 受光装置および測距システム |
| WO2020170936A1 (ja) * | 2019-02-20 | 2020-08-27 | ソニーセミコンダクタソリューションズ株式会社 | 撮像装置 |
| JP2020141012A (ja) * | 2019-02-27 | 2020-09-03 | キヤノン株式会社 | 光電変換装置、光電変換システム、及び移動体 |
| JP2020153929A (ja) * | 2019-03-22 | 2020-09-24 | 株式会社東芝 | センサ及び距離計測装置 |
| WO2020196034A1 (ja) * | 2019-03-26 | 2020-10-01 | パナソニックIpマネジメント株式会社 | 撮像処理回路、撮像システム、撮像処理方法及びプログラム |
| WO2020203222A1 (ja) * | 2019-03-29 | 2020-10-08 | ソニーセミコンダクタソリューションズ株式会社 | 固体撮像装置及び電子機器 |
| WO2020255722A1 (ja) * | 2019-06-19 | 2020-12-24 | ソニーセミコンダクタソリューションズ株式会社 | アバランシェフォトダイオードセンサ及び測距装置 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9331116B2 (en) | 2014-01-15 | 2016-05-03 | Omnivision Technologies, Inc. | Back side illuminated single photon avalanche diode imaging sensor with high short wavelength detection efficiency |
| US20180220093A1 (en) * | 2017-02-01 | 2018-08-02 | Renesas Electronics Corporation | Image sensor |
| KR20210099841A (ko) * | 2020-02-05 | 2021-08-13 | 삼성전자주식회사 | 돌출한 채널 전극을 가진 트랜지스터를 포함하는 이미지 센서 |
| KR102789682B1 (ko) * | 2020-05-25 | 2025-04-01 | 에스케이하이닉스 주식회사 | 이미지 센싱 장치 |
| CN116547820A (zh) * | 2020-10-27 | 2023-08-04 | 索尼半导体解决方案公司 | 光接收装置和距离测量设备 |
-
2021
- 2021-12-22 US US18/258,357 patent/US20240313022A1/en active Pending
- 2021-12-22 CN CN202180075865.2A patent/CN116438805A/zh active Pending
- 2021-12-22 EP EP21917687.2A patent/EP4276905A4/en active Pending
- 2021-12-22 WO PCT/JP2021/047513 patent/WO2022149467A1/ja not_active Ceased
- 2021-12-22 KR KR1020237020344A patent/KR20230124908A/ko active Pending
- 2021-12-22 JP JP2022573991A patent/JPWO2022149467A1/ja active Pending
Patent Citations (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000275348A (ja) * | 1999-03-26 | 2000-10-06 | Toshiba Corp | 信号増倍x線撮像装置 |
| JP2013033896A (ja) * | 2011-06-30 | 2013-02-14 | Sony Corp | 撮像素子、撮像素子の駆動方法、撮像素子の製造方法、および電子機器 |
| JP2015188083A (ja) * | 2014-03-13 | 2015-10-29 | 株式会社半導体エネルギー研究所 | 撮像装置 |
| JP2015204498A (ja) * | 2014-04-11 | 2015-11-16 | 株式会社東芝 | 光検出器 |
| WO2017043068A1 (ja) * | 2015-09-09 | 2017-03-16 | パナソニックIpマネジメント株式会社 | 固体撮像素子 |
| JP2017153064A (ja) * | 2015-10-23 | 2017-08-31 | インフィネオン テクノロジーズ アーゲーInfineon Technologies Ag | 半導体スイッチングデバイスおよびクランプダイオードを含む電気組立体 |
| JP2018125845A (ja) * | 2017-02-01 | 2018-08-09 | ルネサスエレクトロニクス株式会社 | 撮像素子 |
| JP2019186598A (ja) * | 2018-04-02 | 2019-10-24 | キヤノン株式会社 | 光電変換装置及び撮像システム |
| JP2020034523A (ja) * | 2018-08-31 | 2020-03-05 | ソニーセミコンダクタソリューションズ株式会社 | 受光素子および測距システム |
| WO2020158401A1 (ja) * | 2019-01-30 | 2020-08-06 | ソニーセミコンダクタソリューションズ株式会社 | 受光装置および測距システム |
| WO2020170936A1 (ja) * | 2019-02-20 | 2020-08-27 | ソニーセミコンダクタソリューションズ株式会社 | 撮像装置 |
| JP2020141012A (ja) * | 2019-02-27 | 2020-09-03 | キヤノン株式会社 | 光電変換装置、光電変換システム、及び移動体 |
| JP2020153929A (ja) * | 2019-03-22 | 2020-09-24 | 株式会社東芝 | センサ及び距離計測装置 |
| WO2020196034A1 (ja) * | 2019-03-26 | 2020-10-01 | パナソニックIpマネジメント株式会社 | 撮像処理回路、撮像システム、撮像処理方法及びプログラム |
| WO2020203222A1 (ja) * | 2019-03-29 | 2020-10-08 | ソニーセミコンダクタソリューションズ株式会社 | 固体撮像装置及び電子機器 |
| WO2020255722A1 (ja) * | 2019-06-19 | 2020-12-24 | ソニーセミコンダクタソリューションズ株式会社 | アバランシェフォトダイオードセンサ及び測距装置 |
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| Publication number | Publication date |
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| EP4276905A1 (en) | 2023-11-15 |
| US20240313022A1 (en) | 2024-09-19 |
| CN116438805A (zh) | 2023-07-14 |
| TW202228301A (zh) | 2022-07-16 |
| WO2022149467A1 (ja) | 2022-07-14 |
| KR20230124908A (ko) | 2023-08-28 |
| EP4276905A4 (en) | 2024-05-29 |
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