JPWO2022147204A5 - - Google Patents
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- Publication number
- JPWO2022147204A5 JPWO2022147204A5 JP2023540533A JP2023540533A JPWO2022147204A5 JP WO2022147204 A5 JPWO2022147204 A5 JP WO2022147204A5 JP 2023540533 A JP2023540533 A JP 2023540533A JP 2023540533 A JP2023540533 A JP 2023540533A JP WO2022147204 A5 JPWO2022147204 A5 JP WO2022147204A5
- Authority
- JP
- Japan
- Prior art keywords
- insulating structure
- conductive
- bond pad
- forming
- conductive trace
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 claims 92
- 239000004065 semiconductor Substances 0.000 claims 33
- 238000004519 manufacturing process Methods 0.000 claims 10
- 239000000463 material Substances 0.000 claims 9
- 239000004593 Epoxy Substances 0.000 claims 7
- 239000002184 metal Substances 0.000 claims 7
- 229920000642 polymer Polymers 0.000 claims 5
- 239000000843 powder Substances 0.000 claims 4
- 229910000679 solder Inorganic materials 0.000 claims 4
- 230000007704 transition Effects 0.000 claims 4
- 239000000919 ceramic Substances 0.000 claims 3
- 150000001875 compounds Chemical class 0.000 claims 3
- 239000011810 insulating material Substances 0.000 claims 3
- 238000010146 3D printing Methods 0.000 claims 2
- 238000005266 casting Methods 0.000 claims 2
- 229920001940 conductive polymer Polymers 0.000 claims 2
- 238000005538 encapsulation Methods 0.000 claims 2
- 238000001746 injection moulding Methods 0.000 claims 2
- 238000010030 laminating Methods 0.000 claims 2
- 239000007788 liquid Substances 0.000 claims 2
- 239000002245 particle Substances 0.000 claims 2
- 229920001296 polysiloxane Polymers 0.000 claims 2
- 238000004382 potting Methods 0.000 claims 2
- 238000007650 screen-printing Methods 0.000 claims 2
- 238000004528 spin coating Methods 0.000 claims 2
- 238000005507 spraying Methods 0.000 claims 2
- 238000001721 transfer moulding Methods 0.000 claims 2
- 239000007789 gas Substances 0.000 claims 1
- 238000000465 moulding Methods 0.000 claims 1
- 239000011345 viscous material Substances 0.000 claims 1
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US202063132989P | 2020-12-31 | 2020-12-31 | |
| US63/132,989 | 2020-12-31 | ||
| US17/557,372 | 2021-12-21 | ||
| US17/557,372 US12230594B2 (en) | 2020-12-31 | 2021-12-21 | Printed package and method of making the same |
| PCT/US2021/065620 WO2022147204A1 (en) | 2020-12-31 | 2021-12-30 | Printed package and method of making the same |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2024501880A JP2024501880A (ja) | 2024-01-16 |
| JP2024501880A5 JP2024501880A5 (https=) | 2025-01-07 |
| JPWO2022147204A5 true JPWO2022147204A5 (https=) | 2025-01-07 |
Family
ID=82119631
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023540533A Pending JP2024501880A (ja) | 2020-12-31 | 2021-12-30 | 印刷パッケージ及びその製造方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US12230594B2 (https=) |
| EP (1) | EP4272252A4 (https=) |
| JP (1) | JP2024501880A (https=) |
| KR (1) | KR20230128003A (https=) |
| CN (1) | CN117178355A (https=) |
| TW (1) | TWI908968B (https=) |
| WO (1) | WO2022147204A1 (https=) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5122172B2 (ja) * | 2007-03-30 | 2013-01-16 | ローム株式会社 | 半導体発光装置 |
| US10084503B2 (en) * | 2014-10-15 | 2018-09-25 | Skyworks Solutions, Inc. | Surface-mount technology devices and related methods |
| KR20230136621A (ko) | 2021-02-11 | 2023-09-26 | 아이오 테크 그룹 엘티디. | 레이저 시스템에 의한 pcb 생산 |
| US11877398B2 (en) * | 2021-02-11 | 2024-01-16 | Io Tech Group Ltd. | PCB production by laser systems |
| TWI861842B (zh) * | 2023-04-27 | 2024-11-11 | 蔡瑞景 | 用於晶圓背面保護之紫外光印刷方法 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4385202A (en) | 1980-09-25 | 1983-05-24 | Texas Instruments Incorporated | Electronic circuit interconnection system |
| US4974057A (en) | 1986-10-31 | 1990-11-27 | Texas Instruments Incorporated | Semiconductor device package with circuit board and resin |
| JPH0653277A (ja) | 1992-06-04 | 1994-02-25 | Lsi Logic Corp | 半導体装置アセンブリおよびその組立方法 |
| JP5018024B2 (ja) * | 2006-11-08 | 2012-09-05 | セイコーエプソン株式会社 | 電子部品の実装方法、電子基板、及び電子機器 |
| JP2010114221A (ja) * | 2008-11-05 | 2010-05-20 | Seiko Epson Corp | 電子装置、及び電子装置の製造方法 |
| JP2010245223A (ja) * | 2009-04-03 | 2010-10-28 | Seiko Epson Corp | 電子装置の製造方法 |
| JP2013183003A (ja) * | 2012-03-01 | 2013-09-12 | Hitachi Cable Ltd | リードフレーム及びその製造方法、並びに半導体装置 |
| KR20140126598A (ko) * | 2013-04-23 | 2014-10-31 | 삼성전자주식회사 | 반도체 패키지 및 그 제조 방법 |
| JP6569375B2 (ja) * | 2015-08-11 | 2019-09-04 | 株式会社ソシオネクスト | 半導体装置、半導体装置の製造方法及び電子装置 |
| US10541153B2 (en) * | 2017-08-03 | 2020-01-21 | General Electric Company | Electronics package with integrated interconnect structure and method of manufacturing thereof |
| US12080633B2 (en) | 2018-09-06 | 2024-09-03 | Texas Instruments Incorporated | Custom leadframe from standard plus printed leadframe portion |
| JP6927179B2 (ja) * | 2018-10-12 | 2021-08-25 | Tdk株式会社 | 電気部品の積層体とその製造方法 |
-
2021
- 2021-12-21 US US17/557,372 patent/US12230594B2/en active Active
- 2021-12-30 CN CN202180088013.7A patent/CN117178355A/zh active Pending
- 2021-12-30 JP JP2023540533A patent/JP2024501880A/ja active Pending
- 2021-12-30 EP EP21916464.7A patent/EP4272252A4/en active Pending
- 2021-12-30 WO PCT/US2021/065620 patent/WO2022147204A1/en not_active Ceased
- 2021-12-30 TW TW110149616A patent/TWI908968B/zh active
- 2021-12-30 KR KR1020237021658A patent/KR20230128003A/ko active Pending
-
2025
- 2025-02-18 US US19/055,705 patent/US20250192084A1/en active Pending
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