JPWO2022138343A1 - - Google Patents

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Publication number
JPWO2022138343A1
JPWO2022138343A1 JP2022572204A JP2022572204A JPWO2022138343A1 JP WO2022138343 A1 JPWO2022138343 A1 JP WO2022138343A1 JP 2022572204 A JP2022572204 A JP 2022572204A JP 2022572204 A JP2022572204 A JP 2022572204A JP WO2022138343 A1 JPWO2022138343 A1 JP WO2022138343A1
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JP
Japan
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JP2022572204A
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Japanese (ja)
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JP7672432B2 (ja
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Priority to JP2025024091A priority Critical patent/JP2025071162A/ja
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/10—Encapsulated ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5046—Amines heterocyclic
    • C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
    • C08G59/5073—Amines heterocyclic containing only nitrogen as a heteroatom having two nitrogen atoms in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/05—Alcohols; Metal alcoholates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/473—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins containing a filler
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/003—Additives being defined by their diameter
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/006—Additives being defined by their surface area
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1461—Applying or finishing the circuit pattern after another process, e.g. after filling of vias with conductive paste, after making printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4661—Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesive Tapes (AREA)
JP2022572204A 2020-12-22 2021-12-14 エポキシ樹脂組成物、接着フィルム、プリント配線板、半導体チップパッケージ、半導体装置、及び接着フィルムの使用方法 Active JP7672432B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2025024091A JP2025071162A (ja) 2020-12-22 2025-02-18 エポキシ樹脂組成物、接着フィルム、プリント配線板、半導体チップパッケージ、半導体装置、及び接着フィルムの使用方法

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2020212769 2020-12-22
JP2020212769 2020-12-22
JP2021005649 2021-01-18
JP2021005649 2021-01-18
PCT/JP2021/046127 WO2022138343A1 (ja) 2020-12-22 2021-12-14 エポキシ樹脂組成物、接着フィルム、プリント配線板、半導体チップパッケージ、半導体装置、及び接着フィルムの使用方法

Related Child Applications (1)

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JP2025024091A Division JP2025071162A (ja) 2020-12-22 2025-02-18 エポキシ樹脂組成物、接着フィルム、プリント配線板、半導体チップパッケージ、半導体装置、及び接着フィルムの使用方法

Publications (2)

Publication Number Publication Date
JPWO2022138343A1 true JPWO2022138343A1 (https=) 2022-06-30
JP7672432B2 JP7672432B2 (ja) 2025-05-07

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ID=82159085

Family Applications (2)

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JP2022572204A Active JP7672432B2 (ja) 2020-12-22 2021-12-14 エポキシ樹脂組成物、接着フィルム、プリント配線板、半導体チップパッケージ、半導体装置、及び接着フィルムの使用方法
JP2025024091A Pending JP2025071162A (ja) 2020-12-22 2025-02-18 エポキシ樹脂組成物、接着フィルム、プリント配線板、半導体チップパッケージ、半導体装置、及び接着フィルムの使用方法

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Country Status (6)

Country Link
US (1) US20240301176A1 (https=)
JP (2) JP7672432B2 (https=)
KR (2) KR20230052965A (https=)
CN (1) CN121914371A (https=)
TW (1) TWI820542B (https=)
WO (1) WO2022138343A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023245621A1 (zh) * 2022-06-24 2023-12-28 深圳先进电子材料国际创新研究院 一种绝缘胶膜、制备方法及其应用
US20240279523A1 (en) * 2023-02-10 2024-08-22 Westlake Epoxy Inc. Epoxy resin compositions and methods of making
CN118834642B (zh) * 2024-09-23 2024-12-17 武汉市三选科技有限公司 低膨胀系数环氧膜及其制备方法、封装晶圆的制备方法

Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6079031A (ja) * 1983-10-04 1985-05-04 Sumitomo Chem Co Ltd 貯蔵安定性に優れたエポキシ樹脂組成物
JPS6079030A (ja) * 1983-10-04 1985-05-04 Sumitomo Chem Co Ltd 硬化促進効果を有するエポキシ樹脂組成物
JP2005179580A (ja) * 2003-12-22 2005-07-07 Nippon Kayaku Co Ltd エポキシ樹脂用の硬化剤、エポキシ樹脂組成物、及びその硬化物
JP2005220205A (ja) * 2004-02-05 2005-08-18 Nippon Kayaku Co Ltd エポキシ樹脂用硬化剤及びエポキシ樹脂組成物
JP2007091899A (ja) * 2005-09-29 2007-04-12 Asahi Kasei Chemicals Corp 高安定性エポキシ樹脂用硬化剤およびエポキシ樹脂組成物
WO2010098431A1 (ja) * 2009-02-27 2010-09-02 旭化成イーマテリアルズ株式会社 マイクロカプセル型エポキシ樹脂用硬化剤、マスターバッチ型エポキシ樹脂用硬化剤組成物、一液性エポキシ樹脂組成物、および加工品
WO2011039879A1 (ja) * 2009-10-01 2011-04-07 株式会社Ｉｈｉエアロスペース 繊維強化プラスチック用のマトリックス樹脂組成物及び繊維強化プラスチック構造体
JP2014156515A (ja) * 2013-02-14 2014-08-28 Ajinomoto Co Inc 硬化性樹脂組成物
JP2015221859A (ja) * 2014-05-22 2015-12-10 旭化成イーマテリアルズ株式会社 エポキシ樹脂用硬化剤、マイクロカプセル型エポキシ樹脂用硬化剤、マスターバッチ型エポキシ樹脂用硬化剤組成物、一液性エポキシ樹脂組成物及び加工品
WO2016080202A1 (ja) * 2014-11-17 2016-05-26 東レ株式会社 エポキシ樹脂組成物、プリプレグ、樹脂硬化物および繊維強化複合材料
JP2017095571A (ja) * 2015-11-20 2017-06-01 旭化成株式会社 封止材用エポキシ樹脂組成物、及び封止材。
JP2017095570A (ja) * 2015-11-20 2017-06-01 旭化成株式会社 接着フィルム用エポキシ樹脂組成物。
JP2019127507A (ja) * 2018-01-23 2019-08-01 ナトコ株式会社 金属用粉体塗料組成物、金属用粉体塗料組成物により形成された塗膜、金属用粉体塗料組成物により形成された塗膜を備える金属材、および、塗膜を備える金属材を製造する方法
JP2021155508A (ja) * 2020-03-25 2021-10-07 旭化成株式会社 エポキシ樹脂組成物

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI506082B (zh) 2009-11-26 2015-11-01 Ajinomoto Kk Epoxy resin composition
JP6950732B2 (ja) 2015-08-07 2021-10-13 味の素株式会社 樹脂組成物
KR101900544B1 (ko) * 2015-12-07 2018-09-19 삼성에스디아이 주식회사 이방 도전성 필름용 조성물, 이방 도전성 필름 및 이를 이용한 접속 구조체
JP6909281B2 (ja) * 2017-03-17 2021-07-28 旭化成株式会社 熱硬化性樹脂組成物
JP6800129B2 (ja) * 2017-11-07 2020-12-16 古河電気工業株式会社 フィルム状接着剤、フィルム状接着剤を用いた半導体パッケージの製造方法
JP7649379B2 (ja) * 2021-07-12 2025-03-19 旭化成株式会社 エポキシ樹脂組成物、フィルム、フィルムの製造方法、及び硬化物

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6079031A (ja) * 1983-10-04 1985-05-04 Sumitomo Chem Co Ltd 貯蔵安定性に優れたエポキシ樹脂組成物
JPS6079030A (ja) * 1983-10-04 1985-05-04 Sumitomo Chem Co Ltd 硬化促進効果を有するエポキシ樹脂組成物
JP2005179580A (ja) * 2003-12-22 2005-07-07 Nippon Kayaku Co Ltd エポキシ樹脂用の硬化剤、エポキシ樹脂組成物、及びその硬化物
JP2005220205A (ja) * 2004-02-05 2005-08-18 Nippon Kayaku Co Ltd エポキシ樹脂用硬化剤及びエポキシ樹脂組成物
JP2007091899A (ja) * 2005-09-29 2007-04-12 Asahi Kasei Chemicals Corp 高安定性エポキシ樹脂用硬化剤およびエポキシ樹脂組成物
WO2010098431A1 (ja) * 2009-02-27 2010-09-02 旭化成イーマテリアルズ株式会社 マイクロカプセル型エポキシ樹脂用硬化剤、マスターバッチ型エポキシ樹脂用硬化剤組成物、一液性エポキシ樹脂組成物、および加工品
WO2011039879A1 (ja) * 2009-10-01 2011-04-07 株式会社Ｉｈｉエアロスペース 繊維強化プラスチック用のマトリックス樹脂組成物及び繊維強化プラスチック構造体
JP2014156515A (ja) * 2013-02-14 2014-08-28 Ajinomoto Co Inc 硬化性樹脂組成物
JP2015221859A (ja) * 2014-05-22 2015-12-10 旭化成イーマテリアルズ株式会社 エポキシ樹脂用硬化剤、マイクロカプセル型エポキシ樹脂用硬化剤、マスターバッチ型エポキシ樹脂用硬化剤組成物、一液性エポキシ樹脂組成物及び加工品
WO2016080202A1 (ja) * 2014-11-17 2016-05-26 東レ株式会社 エポキシ樹脂組成物、プリプレグ、樹脂硬化物および繊維強化複合材料
JP2017095571A (ja) * 2015-11-20 2017-06-01 旭化成株式会社 封止材用エポキシ樹脂組成物、及び封止材。
JP2017095570A (ja) * 2015-11-20 2017-06-01 旭化成株式会社 接着フィルム用エポキシ樹脂組成物。
JP2019127507A (ja) * 2018-01-23 2019-08-01 ナトコ株式会社 金属用粉体塗料組成物、金属用粉体塗料組成物により形成された塗膜、金属用粉体塗料組成物により形成された塗膜を備える金属材、および、塗膜を備える金属材を製造する方法
JP2021155508A (ja) * 2020-03-25 2021-10-07 旭化成株式会社 エポキシ樹脂組成物

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
総説 エポキシ樹脂 基礎編Ｉ, vol. 初版, JPN6022005424, 19 November 2003 (2003-11-19), pages 186 - 191, ISSN: 0005364319 *

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