JPWO2022097481A5 - - Google Patents

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Publication number
JPWO2022097481A5
JPWO2022097481A5 JP2022527760A JP2022527760A JPWO2022097481A5 JP WO2022097481 A5 JPWO2022097481 A5 JP WO2022097481A5 JP 2022527760 A JP2022527760 A JP 2022527760A JP 2022527760 A JP2022527760 A JP 2022527760A JP WO2022097481 A5 JPWO2022097481 A5 JP WO2022097481A5
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JP
Japan
Prior art keywords
group
silver particle
particle layer
reactive functional
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022527760A
Other languages
English (en)
Japanese (ja)
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JPWO2022097481A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2021/038869 external-priority patent/WO2022097481A1/ja
Publication of JPWO2022097481A1 publication Critical patent/JPWO2022097481A1/ja
Publication of JPWO2022097481A5 publication Critical patent/JPWO2022097481A5/ja
Pending legal-status Critical Current

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JP2022527760A 2020-11-05 2021-10-21 Pending JPWO2022097481A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020184974 2020-11-05
PCT/JP2021/038869 WO2022097481A1 (ja) 2020-11-05 2021-10-21 セミアディティブ工法用積層体及びそれを用いたプリント配線板

Publications (2)

Publication Number Publication Date
JPWO2022097481A1 JPWO2022097481A1 (https=) 2022-05-12
JPWO2022097481A5 true JPWO2022097481A5 (https=) 2022-10-17

Family

ID=81457260

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022527760A Pending JPWO2022097481A1 (https=) 2020-11-05 2021-10-21

Country Status (3)

Country Link
JP (1) JPWO2022097481A1 (https=)
TW (1) TW202233414A (https=)
WO (1) WO2022097481A1 (https=)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4624217B2 (ja) * 2005-09-02 2011-02-02 日本メクトロン株式会社 回路基板の製造方法
JP2009283528A (ja) * 2008-05-20 2009-12-03 Toyobo Co Ltd ポリイミド基材プリント配線板及びその製造方法
JP2012049165A (ja) * 2010-08-24 2012-03-08 Fujikura Ltd プリント配線基板及びその製造方法
US10986738B2 (en) * 2018-05-08 2021-04-20 Macdermid Enthone Inc. Carbon-based direct plating process
CN112219459B (zh) * 2018-06-26 2024-06-28 Dic株式会社 具有金属图案的成型体的制造方法

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