TW202233414A - 印刷配線板之製造方法 - Google Patents

印刷配線板之製造方法 Download PDF

Info

Publication number
TW202233414A
TW202233414A TW110140952A TW110140952A TW202233414A TW 202233414 A TW202233414 A TW 202233414A TW 110140952 A TW110140952 A TW 110140952A TW 110140952 A TW110140952 A TW 110140952A TW 202233414 A TW202233414 A TW 202233414A
Authority
TW
Taiwan
Prior art keywords
group
layer
mentioned
resin
silver particle
Prior art date
Application number
TW110140952A
Other languages
English (en)
Chinese (zh)
Inventor
深澤憲正
村川昭
白髪潤
Original Assignee
日商Ｄｉｃ股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商Ｄｉｃ股份有限公司 filed Critical 日商Ｄｉｃ股份有限公司
Publication of TW202233414A publication Critical patent/TW202233414A/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Laminated Bodies (AREA)
TW110140952A 2020-11-05 2021-11-03 印刷配線板之製造方法 TW202233414A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020184974 2020-11-05
JPJP2020-184974 2020-11-05

Publications (1)

Publication Number Publication Date
TW202233414A true TW202233414A (zh) 2022-09-01

Family

ID=81457260

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110140952A TW202233414A (zh) 2020-11-05 2021-11-03 印刷配線板之製造方法

Country Status (3)

Country Link
JP (1) JPWO2022097481A1 (https=)
TW (1) TW202233414A (https=)
WO (1) WO2022097481A1 (https=)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4624217B2 (ja) * 2005-09-02 2011-02-02 日本メクトロン株式会社 回路基板の製造方法
JP2009283528A (ja) * 2008-05-20 2009-12-03 Toyobo Co Ltd ポリイミド基材プリント配線板及びその製造方法
JP2012049165A (ja) * 2010-08-24 2012-03-08 Fujikura Ltd プリント配線基板及びその製造方法
US10986738B2 (en) * 2018-05-08 2021-04-20 Macdermid Enthone Inc. Carbon-based direct plating process
CN112219459B (zh) * 2018-06-26 2024-06-28 Dic株式会社 具有金属图案的成型体的制造方法

Also Published As

Publication number Publication date
JPWO2022097481A1 (https=) 2022-05-12
WO2022097481A1 (ja) 2022-05-12

Similar Documents

Publication Publication Date Title
TWI808198B (zh) 印刷配線板之製造方法
TWI871283B (zh) 印刷配線板用積層體及使用其之印刷配線板
KR20210022548A (ko) 프린트 배선판의 제조 방법
KR102815711B1 (ko) 세미 애디티브 공법용 적층체 및 그것을 이용한 프린트 배선판
JP7201130B2 (ja) セミアディティブ工法用積層体及びそれを用いたプリント配線板
TW202234959A (zh) 半加成工法用積層體及使用其之印刷配線板
TW202233414A (zh) 印刷配線板之製造方法
JP7371778B2 (ja) セミアディティブ工法用積層体及びそれを用いたプリント配線板
TWI914435B (zh) 半加成工法用積層體及其製造方法、以及印刷配線板及其製造方法
JP7332049B2 (ja) セミアディティブ工法用積層体及びそれを用いたプリント配線板
TWI914436B (zh) 半加成工法用積層體及其製造方法、以及使用該半加成工法用積層體之印刷配線板及其製造方法
TWI915445B (zh) 半加成工法用積層體及使用其之印刷配線板、以及印刷配線板之製造方法
JP7288230B2 (ja) セミアディティブ工法用積層体及びそれを用いたプリント配線板
KR102955115B1 (ko) 세미 애디티브 공법용 적층체 및 그것을 이용한 프린트 배선판
TW202234954A (zh) 半加成工法用積層體及使用其之印刷配線板
TW202547227A (zh) 半加成工法用積層體、印刷配線板、半加成工法用積層體之製造方法及製造印刷配線板之方法