JPWO2022097481A1 - - Google Patents
Info
- Publication number
- JPWO2022097481A1 JPWO2022097481A1 JP2022527760A JP2022527760A JPWO2022097481A1 JP WO2022097481 A1 JPWO2022097481 A1 JP WO2022097481A1 JP 2022527760 A JP2022527760 A JP 2022527760A JP 2022527760 A JP2022527760 A JP 2022527760A JP WO2022097481 A1 JPWO2022097481 A1 JP WO2022097481A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing of the conductive pattern
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020184974 | 2020-11-05 | ||
| PCT/JP2021/038869 WO2022097481A1 (ja) | 2020-11-05 | 2021-10-21 | セミアディティブ工法用積層体及びそれを用いたプリント配線板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2022097481A1 true JPWO2022097481A1 (https=) | 2022-05-12 |
| JPWO2022097481A5 JPWO2022097481A5 (https=) | 2022-10-17 |
Family
ID=81457260
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022527760A Pending JPWO2022097481A1 (https=) | 2020-11-05 | 2021-10-21 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2022097481A1 (https=) |
| TW (1) | TW202233414A (https=) |
| WO (1) | WO2022097481A1 (https=) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007067341A (ja) * | 2005-09-02 | 2007-03-15 | Nippon Mektron Ltd | 回路基板の製造方法 |
| JP2009283528A (ja) * | 2008-05-20 | 2009-12-03 | Toyobo Co Ltd | ポリイミド基材プリント配線板及びその製造方法 |
| JP2012049165A (ja) * | 2010-08-24 | 2012-03-08 | Fujikura Ltd | プリント配線基板及びその製造方法 |
| WO2019217388A1 (en) * | 2018-05-08 | 2019-11-14 | Macdermid Enthone Inc. | Carbon-based direct plating process |
| WO2020003879A1 (ja) * | 2018-06-26 | 2020-01-02 | Dic株式会社 | 金属パターンを有する成形体の製造方法 |
-
2021
- 2021-10-21 JP JP2022527760A patent/JPWO2022097481A1/ja active Pending
- 2021-10-21 WO PCT/JP2021/038869 patent/WO2022097481A1/ja not_active Ceased
- 2021-11-03 TW TW110140952A patent/TW202233414A/zh unknown
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007067341A (ja) * | 2005-09-02 | 2007-03-15 | Nippon Mektron Ltd | 回路基板の製造方法 |
| JP2009283528A (ja) * | 2008-05-20 | 2009-12-03 | Toyobo Co Ltd | ポリイミド基材プリント配線板及びその製造方法 |
| JP2012049165A (ja) * | 2010-08-24 | 2012-03-08 | Fujikura Ltd | プリント配線基板及びその製造方法 |
| WO2019217388A1 (en) * | 2018-05-08 | 2019-11-14 | Macdermid Enthone Inc. | Carbon-based direct plating process |
| WO2020003879A1 (ja) * | 2018-06-26 | 2020-01-02 | Dic株式会社 | 金属パターンを有する成形体の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202233414A (zh) | 2022-09-01 |
| WO2022097481A1 (ja) | 2022-05-12 |
Similar Documents
Legal Events
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