JPWO2022050156A1 - - Google Patents

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Publication number
JPWO2022050156A1
JPWO2022050156A1 JP2022546271A JP2022546271A JPWO2022050156A1 JP WO2022050156 A1 JPWO2022050156 A1 JP WO2022050156A1 JP 2022546271 A JP2022546271 A JP 2022546271A JP 2022546271 A JP2022546271 A JP 2022546271A JP WO2022050156 A1 JPWO2022050156 A1 JP WO2022050156A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022546271A
Other languages
Japanese (ja)
Other versions
JP7722380B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022050156A1 publication Critical patent/JPWO2022050156A1/ja
Application granted granted Critical
Publication of JP7722380B2 publication Critical patent/JP7722380B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/22Masks or mask blanks for imaging by radiation of 100nm or shorter wavelength, e.g. X-ray masks, extreme ultraviolet [EUV] masks; Preparation thereof
    • G03F1/24Reflection masks; Preparation thereof
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/26Phase shift masks [PSM]; PSM blanks; Preparation thereof
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/26Phase shift masks [PSM]; PSM blanks; Preparation thereof
    • G03F1/32Attenuating PSM [att-PSM], e.g. halftone PSM or PSM having semi-transparent phase shift portion; Preparation thereof
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/38Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
    • G03F1/42Alignment or registration features, e.g. alignment marks on the mask substrates
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/54Absorbers, e.g. of opaque materials
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/80Etching

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
JP2022546271A 2020-09-04 2021-08-25 反射型マスク、反射型マスクブランク、および反射型マスクの製造方法 Active JP7722380B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020148984 2020-09-04
JP2020148984 2020-09-04
PCT/JP2021/031257 WO2022050156A1 (ja) 2020-09-04 2021-08-25 反射型マスク、反射型マスクブランク、および反射型マスクの製造方法

Publications (2)

Publication Number Publication Date
JPWO2022050156A1 true JPWO2022050156A1 (https=) 2022-03-10
JP7722380B2 JP7722380B2 (ja) 2025-08-13

Family

ID=80490940

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022546271A Active JP7722380B2 (ja) 2020-09-04 2021-08-25 反射型マスク、反射型マスクブランク、および反射型マスクの製造方法

Country Status (5)

Country Link
US (1) US20230185181A1 (https=)
JP (1) JP7722380B2 (https=)
KR (1) KR20230058395A (https=)
TW (1) TW202225819A (https=)
WO (1) WO2022050156A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023210667A1 (ja) * 2022-04-28 2023-11-02 Agc株式会社 反射型マスクブランク、反射型マスクブランクの製造方法、反射型マスク、反射型マスクの製造方法
JP7367901B1 (ja) * 2022-04-28 2023-10-24 Agc株式会社 反射型マスクブランク、反射型マスクブランクの製造方法、反射型マスク、反射型マスクの製造方法
JPWO2024029410A1 (https=) * 2022-08-03 2024-02-08
WO2024247713A1 (ja) * 2023-05-31 2024-12-05 Agc株式会社 反射型マスクブランク、反射型マスク、反射型マスクブランクの製造方法、及び反射型マスクの製造方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009212220A (ja) * 2008-03-03 2009-09-17 Toshiba Corp 反射型マスク及びその作製方法
WO2010007955A1 (ja) * 2008-07-14 2010-01-21 旭硝子株式会社 Euvリソグラフィ用反射型マスクブランク、および、euvリソグラフィ用反射型マスク
JP2014168019A (ja) * 2013-02-28 2014-09-11 Toshiba Corp Euv露光用の光反射型フォトマスク及びマスクブランク、並びに半導体装置の製造方法
WO2019225737A1 (ja) * 2018-05-25 2019-11-28 Hoya株式会社 反射型マスクブランク、反射型マスク、並びに反射型マスク及び半導体装置の製造方法
WO2020137928A1 (ja) * 2018-12-27 2020-07-02 Hoya株式会社 反射型マスクブランク、反射型マスク、及び半導体装置の製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3411613B2 (ja) 1993-03-26 2003-06-03 Hoya株式会社 ハーフトーン型位相シフトマスク
KR100215850B1 (ko) 1996-04-12 1999-08-16 구본준 하프톤 위상 반전 마스크 및_그제조방법
JP5295553B2 (ja) 2007-12-07 2013-09-18 株式会社東芝 反射型マスク

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009212220A (ja) * 2008-03-03 2009-09-17 Toshiba Corp 反射型マスク及びその作製方法
WO2010007955A1 (ja) * 2008-07-14 2010-01-21 旭硝子株式会社 Euvリソグラフィ用反射型マスクブランク、および、euvリソグラフィ用反射型マスク
JP2014168019A (ja) * 2013-02-28 2014-09-11 Toshiba Corp Euv露光用の光反射型フォトマスク及びマスクブランク、並びに半導体装置の製造方法
WO2019225737A1 (ja) * 2018-05-25 2019-11-28 Hoya株式会社 反射型マスクブランク、反射型マスク、並びに反射型マスク及び半導体装置の製造方法
WO2020137928A1 (ja) * 2018-12-27 2020-07-02 Hoya株式会社 反射型マスクブランク、反射型マスク、及び半導体装置の製造方法

Also Published As

Publication number Publication date
TW202225819A (zh) 2022-07-01
KR20230058395A (ko) 2023-05-03
JP7722380B2 (ja) 2025-08-13
US20230185181A1 (en) 2023-06-15
WO2022050156A1 (ja) 2022-03-10

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