JPWO2022049695A5 - - Google Patents
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- Publication number
- JPWO2022049695A5 JPWO2022049695A5 JP2022546796A JP2022546796A JPWO2022049695A5 JP WO2022049695 A5 JPWO2022049695 A5 JP WO2022049695A5 JP 2022546796 A JP2022546796 A JP 2022546796A JP 2022546796 A JP2022546796 A JP 2022546796A JP WO2022049695 A5 JPWO2022049695 A5 JP WO2022049695A5
- Authority
- JP
- Japan
- Prior art keywords
- housing
- fastening body
- circuit board
- structure according
- connection structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2020/033436 WO2022049695A1 (ja) | 2020-09-03 | 2020-09-03 | 接続構造 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2022049695A1 JPWO2022049695A1 (https=) | 2022-03-10 |
| JPWO2022049695A5 true JPWO2022049695A5 (https=) | 2023-05-22 |
| JP7462770B2 JP7462770B2 (ja) | 2024-04-05 |
Family
ID=80491907
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022546796A Active JP7462770B2 (ja) | 2020-09-03 | 2020-09-03 | 接続構造 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US12225675B2 (https=) |
| JP (1) | JP7462770B2 (https=) |
| KR (1) | KR102797647B1 (https=) |
| CN (1) | CN116171509B (https=) |
| DE (1) | DE112020007569T5 (https=) |
| WO (1) | WO2022049695A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118020394A (zh) * | 2021-09-21 | 2024-05-10 | 苹果公司 | 安装点的选择性绝缘 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5061705U (https=) * | 1973-10-05 | 1975-06-06 | ||
| JPH01135657U (https=) * | 1988-03-09 | 1989-09-18 | ||
| JP2003133779A (ja) * | 2001-10-24 | 2003-05-09 | Canon Inc | 回路基板と筐体との接続構造 |
| DE102005047106B4 (de) * | 2005-09-30 | 2009-07-23 | Infineon Technologies Ag | Leistungshalbleitermodul und Verfahren zur Herstellung |
| CN101005730A (zh) * | 2006-01-20 | 2007-07-25 | 佛山市顺德区顺达电脑厂有限公司 | 减少电子产品电磁干扰之电路板 |
| US8854829B1 (en) * | 2009-09-01 | 2014-10-07 | Raytheon Company | Standoff mounting system |
| KR101472639B1 (ko) | 2012-12-31 | 2014-12-15 | 삼성전기주식회사 | 전자부품 내장기판 및 그 제조방법 |
| TWM465753U (zh) * | 2013-01-31 | 2013-11-11 | Polytron Technologies Inc | 電氣裝置 |
| CN109565927A (zh) * | 2017-03-24 | 2019-04-02 | 三菱电机株式会社 | 电路基板 |
-
2020
- 2020-09-03 WO PCT/JP2020/033436 patent/WO2022049695A1/ja not_active Ceased
- 2020-09-03 CN CN202080103899.3A patent/CN116171509B/zh active Active
- 2020-09-03 DE DE112020007569.9T patent/DE112020007569T5/de not_active Withdrawn
- 2020-09-03 JP JP2022546796A patent/JP7462770B2/ja active Active
- 2020-09-03 KR KR1020237005635A patent/KR102797647B1/ko active Active
- 2020-09-03 US US18/022,752 patent/US12225675B2/en active Active
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