JPWO2022043809A1 - - Google Patents

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Publication number
JPWO2022043809A1
JPWO2022043809A1 JP2022544874A JP2022544874A JPWO2022043809A1 JP WO2022043809 A1 JPWO2022043809 A1 JP WO2022043809A1 JP 2022544874 A JP2022544874 A JP 2022544874A JP 2022544874 A JP2022544874 A JP 2022544874A JP WO2022043809 A1 JPWO2022043809 A1 JP WO2022043809A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022544874A
Other languages
Japanese (ja)
Other versions
JP7796027B2 (ja
JPWO2022043809A5 (https=
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Publication date
Application filed filed Critical
Publication of JPWO2022043809A1 publication Critical patent/JPWO2022043809A1/ja
Publication of JPWO2022043809A5 publication Critical patent/JPWO2022043809A5/ja
Priority to JP2025272639A priority Critical patent/JP2026040561A/ja
Application granted granted Critical
Publication of JP7796027B2 publication Critical patent/JP7796027B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D99/00Subject matter not provided for in other groups of this subclass
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/90Thermal treatments, e.g. annealing or sintering
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/6704Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/6729Thin-film transistors [TFT] characterised by the electrodes
    • H10D30/673Thin-film transistors [TFT] characterised by the electrodes characterised by the shapes, relative sizes or dispositions of the gate electrodes
    • H10D30/6733Multi-gate TFTs
    • H10D30/6734Multi-gate TFTs having gate electrodes arranged on both top and bottom sides of the channel, e.g. dual-gate TFTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/674Thin-film transistors [TFT] characterised by the active materials
    • H10D30/6755Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/6757Thin-film transistors [TFT] characterised by the structure of the channel, e.g. transverse or longitudinal shape or doping profile
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04Apparatus for manufacture or treatment
    • H10P72/0431Apparatus for thermal treatment
JP2022544874A 2020-08-27 2021-08-12 半導体装置の作製方法 Active JP7796027B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2025272639A JP2026040561A (ja) 2020-08-27 2025-12-22 半導体装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020143083 2020-08-27
JP2020143083 2020-08-27
PCT/IB2021/057426 WO2022043809A1 (ja) 2020-08-27 2021-08-12 半導体装置の作製方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2025272639A Division JP2026040561A (ja) 2020-08-27 2025-12-22 半導体装置

Publications (3)

Publication Number Publication Date
JPWO2022043809A1 true JPWO2022043809A1 (https=) 2022-03-03
JPWO2022043809A5 JPWO2022043809A5 (https=) 2024-08-02
JP7796027B2 JP7796027B2 (ja) 2026-01-08

Family

ID=80354720

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2022544874A Active JP7796027B2 (ja) 2020-08-27 2021-08-12 半導体装置の作製方法
JP2025272639A Pending JP2026040561A (ja) 2020-08-27 2025-12-22 半導体装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2025272639A Pending JP2026040561A (ja) 2020-08-27 2025-12-22 半導体装置

Country Status (5)

Country Link
US (1) US20230298906A1 (https=)
JP (2) JP7796027B2 (https=)
KR (1) KR20230054836A (https=)
CN (1) CN116157903A (https=)
WO (1) WO2022043809A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7805298B2 (ja) 2020-08-21 2026-01-23 株式会社半導体エネルギー研究所 半導体装置の作製方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012169397A1 (ja) * 2011-06-07 2012-12-13 シャープ株式会社 薄膜トランジスタ、その製造方法、および表示素子
WO2017144994A1 (ja) * 2016-02-22 2017-08-31 株式会社半導体エネルギー研究所 トランジスタおよびその作製方法、半導体ウエハならびに電子機器
JP2017204637A (ja) * 2016-05-04 2017-11-16 株式会社半導体エネルギー研究所 トランジスタおよびその作製方法
WO2020128713A1 (ja) * 2018-12-20 2020-06-25 株式会社半導体エネルギー研究所 単極性トランジスタを用いて構成された論理回路、および、半導体装置
WO2020136467A1 (ja) * 2018-12-28 2020-07-02 株式会社半導体エネルギー研究所 半導体装置、および半導体装置の作製方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101511076B1 (ko) * 2009-12-08 2015-04-10 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 그 제작 방법
KR101473684B1 (ko) 2009-12-25 2014-12-18 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
KR101809105B1 (ko) 2010-08-06 2017-12-14 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 집적 회로
TWI642193B (zh) * 2012-01-26 2018-11-21 半導體能源研究所股份有限公司 半導體裝置及半導體裝置的製造方法
US10056497B2 (en) * 2015-04-15 2018-08-21 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
JP6968567B2 (ja) * 2016-04-22 2021-11-17 株式会社半導体エネルギー研究所 半導体装置の作製方法
KR20180134919A (ko) * 2016-04-22 2018-12-19 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 반도체 장치의 제작 방법

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012169397A1 (ja) * 2011-06-07 2012-12-13 シャープ株式会社 薄膜トランジスタ、その製造方法、および表示素子
WO2017144994A1 (ja) * 2016-02-22 2017-08-31 株式会社半導体エネルギー研究所 トランジスタおよびその作製方法、半導体ウエハならびに電子機器
JP2017204637A (ja) * 2016-05-04 2017-11-16 株式会社半導体エネルギー研究所 トランジスタおよびその作製方法
WO2020128713A1 (ja) * 2018-12-20 2020-06-25 株式会社半導体エネルギー研究所 単極性トランジスタを用いて構成された論理回路、および、半導体装置
WO2020136467A1 (ja) * 2018-12-28 2020-07-02 株式会社半導体エネルギー研究所 半導体装置、および半導体装置の作製方法

Also Published As

Publication number Publication date
JP2026040561A (ja) 2026-03-09
US20230298906A1 (en) 2023-09-21
WO2022043809A1 (ja) 2022-03-03
JP7796027B2 (ja) 2026-01-08
CN116157903A (zh) 2023-05-23
KR20230054836A (ko) 2023-04-25

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