JPWO2022014410A1 - - Google Patents

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Publication number
JPWO2022014410A1
JPWO2022014410A1 JP2022536277A JP2022536277A JPWO2022014410A1 JP WO2022014410 A1 JPWO2022014410 A1 JP WO2022014410A1 JP 2022536277 A JP2022536277 A JP 2022536277A JP 2022536277 A JP2022536277 A JP 2022536277A JP WO2022014410 A1 JPWO2022014410 A1 JP WO2022014410A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022536277A
Other languages
Japanese (ja)
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JP7343707B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication of JPWO2022014410A1 publication Critical patent/JPWO2022014410A1/ja
Priority to JP2023140933A priority Critical patent/JP7675770B2/ja
Application granted granted Critical
Publication of JP7343707B2 publication Critical patent/JP7343707B2/ja
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7616—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating, a hardness or a material
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
    • C04B35/58—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides
    • C04B35/581—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides based on aluminium nitride
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
    • C23C16/4581—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber characterised by material of construction or surface finish of the means for supporting the substrate
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0432—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H10P72/722—Details of electrostatic chucks
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30—Constituents and secondary phases not being of a fibrous nature
    • C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/3217—Aluminum oxide or oxide forming salts thereof, e.g. bauxite, alpha-alumina
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30—Constituents and secondary phases not being of a fibrous nature
    • C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/3231—Refractory metal oxides, their mixed metal oxides, or oxide-forming salts thereof
    • C04B2235/3232—Titanium oxides or titanates, e.g. rutile or anatase
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
    • C04B2235/656—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes characterised by specific heating conditions during heat treatment
    • C04B2235/6565—Cooling rate
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
    • C04B2235/80—Phases present in the sintered or melt-cast ceramic products other than the main phase
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
    • C04B2235/80—Phases present in the sintered or melt-cast ceramic products other than the main phase
    • C04B2235/85—Intergranular or grain boundary phases

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • General Chemical & Material Sciences (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Ceramic Products (AREA)
JP2022536277A 2020-07-13 2021-07-06 試料保持具 Active JP7343707B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2023140933A JP7675770B2 (ja) 2020-07-13 2023-08-31 窒化アルミニウム基体および試料保持具

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2020120020 2020-07-13
JP2020120020 2020-07-13
JP2020174081 2020-10-15
JP2020174081 2020-10-15
PCT/JP2021/025470 WO2022014410A1 (ja) 2020-07-13 2021-07-06 試料保持具

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2023140933A Division JP7675770B2 (ja) 2020-07-13 2023-08-31 窒化アルミニウム基体および試料保持具

Publications (2)

Publication Number Publication Date
JPWO2022014410A1 true JPWO2022014410A1 (https=) 2022-01-20
JP7343707B2 JP7343707B2 (ja) 2023-09-12

Family

ID=79555375

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2022536277A Active JP7343707B2 (ja) 2020-07-13 2021-07-06 試料保持具
JP2023140933A Active JP7675770B2 (ja) 2020-07-13 2023-08-31 窒化アルミニウム基体および試料保持具

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2023140933A Active JP7675770B2 (ja) 2020-07-13 2023-08-31 窒化アルミニウム基体および試料保持具

Country Status (5)

Country Link
US (1) US12482696B2 (https=)
JP (2) JP7343707B2 (https=)
KR (1) KR102792302B1 (https=)
CN (2) CN115812069B (https=)
WO (1) WO2022014410A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7641442B1 (ja) * 2023-08-24 2025-03-06 日本碍子株式会社 セラミックプレート

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06128041A (ja) * 1992-09-04 1994-05-10 Sumitomo Electric Ind Ltd 窒化アルミニウム焼結体およびその製造方法
JPH0733531A (ja) * 1993-06-28 1995-02-03 Sumitomo Electric Ind Ltd 窒化アルミニウム基板およびその製造方法
JPH07297265A (ja) * 1994-04-26 1995-11-10 Shin Etsu Chem Co Ltd 静電チャック
JPH0855899A (ja) * 1994-08-11 1996-02-27 Kyocera Corp 静電チャック
WO2018221504A1 (ja) * 2017-05-30 2018-12-06 京セラ株式会社 窒化アルミニウム質焼結体、および半導体保持装置
KR102270157B1 (ko) * 2020-12-24 2021-06-29 한국씰마스타주식회사 산질화알루미늄 세라믹 히터 및 그 제조 방법

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3509137B2 (ja) * 1992-09-21 2004-03-22 住友電気工業株式会社 窒化アルミニウム粉末及びその製造方法、並びにその粉末から製造した窒化アルミニウム焼結体
JP3559123B2 (ja) * 1995-08-04 2004-08-25 日本碍子株式会社 窒化アルミニウムおよび半導体製造用装置
JP3794823B2 (ja) * 1998-05-06 2006-07-12 電気化学工業株式会社 静電チャック及びその評価方法
JPH11335173A (ja) 1998-05-25 1999-12-07 Sumitomo Osaka Cement Co Ltd 窒化アルミニウム基焼結体及びその製造方法
JP2001278665A (ja) * 2000-03-29 2001-10-10 Kyocera Corp セラミック抵抗体及び基板支持体
US20050239629A1 (en) * 2004-04-23 2005-10-27 Yeckley Russell L Whisker-reinforced ceramic containing aluminum oxynitride and method of making the same
CN100568563C (zh) * 2006-03-06 2009-12-09 夏普株式会社 氮化物半导体器件及其制备方法
JP2008044846A (ja) * 2007-10-19 2008-02-28 Taiheiyo Cement Corp 窒化アルミニウム焼結体およびそれを用いた静電チャック
JP5972630B2 (ja) * 2011-03-30 2016-08-17 日本碍子株式会社 静電チャックの製法
JP6166205B2 (ja) * 2014-03-27 2017-07-19 京セラ株式会社 試料保持具
CN105838920B (zh) * 2016-03-25 2017-08-08 济南大学 一种Ti/AlN金属陶瓷复合材料及其制备方法
KR101797232B1 (ko) * 2017-07-10 2017-11-13 주식회사 케이에스엠컴포넌트 정전척
JP7209515B2 (ja) 2018-11-27 2023-01-20 東京エレクトロン株式会社 基板保持機構および成膜装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06128041A (ja) * 1992-09-04 1994-05-10 Sumitomo Electric Ind Ltd 窒化アルミニウム焼結体およびその製造方法
JPH0733531A (ja) * 1993-06-28 1995-02-03 Sumitomo Electric Ind Ltd 窒化アルミニウム基板およびその製造方法
JPH07297265A (ja) * 1994-04-26 1995-11-10 Shin Etsu Chem Co Ltd 静電チャック
JPH0855899A (ja) * 1994-08-11 1996-02-27 Kyocera Corp 静電チャック
WO2018221504A1 (ja) * 2017-05-30 2018-12-06 京セラ株式会社 窒化アルミニウム質焼結体、および半導体保持装置
KR102270157B1 (ko) * 2020-12-24 2021-06-29 한국씰마스타주식회사 산질화알루미늄 세라믹 히터 및 그 제조 방법

Also Published As

Publication number Publication date
JP7675770B2 (ja) 2025-05-13
KR102792302B1 (ko) 2025-04-08
WO2022014410A1 (ja) 2022-01-20
US12482696B2 (en) 2025-11-25
JP2023165726A (ja) 2023-11-17
KR20230020514A (ko) 2023-02-10
JP7343707B2 (ja) 2023-09-12
CN117735995A (zh) 2024-03-22
CN115812069A (zh) 2023-03-17
US20230245918A1 (en) 2023-08-03
CN115812069B (zh) 2023-12-19
CN117735995B (zh) 2026-01-23

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