JPWO2021245893A5 - - Google Patents

Download PDF

Info

Publication number
JPWO2021245893A5
JPWO2021245893A5 JP2022528359A JP2022528359A JPWO2021245893A5 JP WO2021245893 A5 JPWO2021245893 A5 JP WO2021245893A5 JP 2022528359 A JP2022528359 A JP 2022528359A JP 2022528359 A JP2022528359 A JP 2022528359A JP WO2021245893 A5 JPWO2021245893 A5 JP WO2021245893A5
Authority
JP
Japan
Prior art keywords
mass
contain
conductive wiring
amount
another embodiment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022528359A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2021245893A1 (https=
JP7525186B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2020/022202 external-priority patent/WO2021245893A1/ja
Publication of JPWO2021245893A1 publication Critical patent/JPWO2021245893A1/ja
Publication of JPWO2021245893A5 publication Critical patent/JPWO2021245893A5/ja
Application granted granted Critical
Publication of JP7525186B2 publication Critical patent/JP7525186B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2022528359A 2020-06-04 2020-06-04 半導体デバイス Active JP7525186B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/022202 WO2021245893A1 (ja) 2020-06-04 2020-06-04 半導体デバイス

Publications (3)

Publication Number Publication Date
JPWO2021245893A1 JPWO2021245893A1 (https=) 2021-12-09
JPWO2021245893A5 true JPWO2021245893A5 (https=) 2023-02-17
JP7525186B2 JP7525186B2 (ja) 2024-07-30

Family

ID=78830718

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022528359A Active JP7525186B2 (ja) 2020-06-04 2020-06-04 半導体デバイス

Country Status (6)

Country Link
US (1) US12444686B2 (https=)
JP (1) JP7525186B2 (https=)
KR (1) KR102865111B1 (https=)
CN (1) CN115699268A (https=)
TW (1) TWI795789B (https=)
WO (1) WO2021245893A1 (https=)

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3062464B2 (ja) * 1997-11-14 2000-07-10 松下電子工業株式会社 半導体装置
JP3562628B2 (ja) 1999-06-24 2004-09-08 日本電気株式会社 拡散バリア膜、多層配線構造、およびそれらの製造方法
US8696875B2 (en) 1999-10-08 2014-04-15 Applied Materials, Inc. Self-ionized and inductively-coupled plasma for sputtering and resputtering
US6833058B1 (en) * 2000-10-24 2004-12-21 Honeywell International Inc. Titanium-based and zirconium-based mixed materials and sputtering targets
CN101847598B (zh) 2001-11-14 2012-06-20 应用材料有限公司 用于溅射和再溅射的自离子化及电感耦合等离子体
AU2003266560A1 (en) * 2002-12-09 2004-06-30 Yoshihiro Hayashi Copper alloy for wiring, semiconductor device, method for forming wiring and method for manufacturing semiconductor device
CN1957487A (zh) * 2004-01-06 2007-05-02 Cymbet公司 具有一个或者更多个可限定层的层式阻挡物结构和方法
KR100761467B1 (ko) 2006-06-28 2007-09-27 삼성전자주식회사 금속배선 및 그 형성 방법
JP5016286B2 (ja) 2006-10-12 2012-09-05 ローム株式会社 半導体装置および半導体装置の製造方法
JP2008053753A (ja) 2007-11-08 2008-03-06 Toshiba Corp 半導体装置の製造方法
JP2012169480A (ja) 2011-02-15 2012-09-06 Panasonic Corp 半導体装置及びその製造方法
US9735123B2 (en) * 2014-03-13 2017-08-15 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor device structure and manufacturing method
WO2018063815A1 (en) 2016-10-02 2018-04-05 Applied Materials, Inc. Doped selective metal caps to improve copper electromigration with ruthenium liner
US10510657B2 (en) * 2017-09-26 2019-12-17 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor device with interconnecting structure and method for manufacturing the same
US10796995B2 (en) 2017-11-29 2020-10-06 Tohoku University Semiconductor devices including a first cobalt alloy in a first barrier layer and a second cobalt alloy in a second barrier layer
US11043373B2 (en) * 2018-07-31 2021-06-22 Taiwan Semiconductor Manufacturing Company, Ltd. Interconnect system with improved low-k dielectrics
US11158538B2 (en) * 2020-02-04 2021-10-26 International Business Machines Corporation Interconnect structures with cobalt-infused ruthenium liner and a cobalt cap

Similar Documents

Publication Publication Date Title
JPWO2020261723A5 (https=)
JP2022105989A5 (https=)
JPWO2021245893A5 (https=)
JPWO2021132315A5 (https=)
JPWO2023105747A5 (https=)
JPWO2022259968A5 (https=)
JPWO2021065243A5 (https=)
JPWO2022264643A5 (https=)
Sävborg Scandinavian folk legends and Icelandic sagas
JP2023066089A5 (https=)
JPWO2021187602A5 (https=)
JP2021055065A5 (https=)
Moghimi et al. A critical study of the views of Sunni commentators on the interpretation of verse 96 of Taha
JP2024044626A5 (https=)
ERWIN HELLO!
Schulze The Wild Bunch: Cowboy Clubs, Gangs, and Societies in Nigeria
Samu Redifining Broadway
JP3200840U (ja) コンポジションカードデッキ
CN204977884U (zh) 书签
TH86598S (th) กล่องแฟ้ม
Mattsson " Metal is the Best Way for Blasphemy": Islamisk Representation i Turkisk Black Metal
TH60749B (th) ส่วนของการนำเสนอที่มีคุณสมบัตินิยามผู้ใช้ได้
TH72881S1 (th) อุปกรณ์ประมวลผลข้อมูล
TH73273S1 (th) อุปกรณ์ประมวลผลข้อมูล
TH185330S (th) อุปกรณ์ประมวลผลข้อมูล