JPWO2021235282A1 - - Google Patents

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Publication number
JPWO2021235282A1
JPWO2021235282A1 JP2021576148A JP2021576148A JPWO2021235282A1 JP WO2021235282 A1 JPWO2021235282 A1 JP WO2021235282A1 JP 2021576148 A JP2021576148 A JP 2021576148A JP 2021576148 A JP2021576148 A JP 2021576148A JP WO2021235282 A1 JPWO2021235282 A1 JP WO2021235282A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021576148A
Other versions
JPWO2021235282A5 (ja
JP7222437B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021235282A1 publication Critical patent/JPWO2021235282A1/ja
Publication of JPWO2021235282A5 publication Critical patent/JPWO2021235282A5/ja
Application granted granted Critical
Publication of JP7222437B2 publication Critical patent/JP7222437B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0283—Stretchable printed circuits
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A61B5/24—Detecting, measuring or recording bioelectric or biomagnetic signals of the body or parts thereof
    • A61B5/25—Bioelectric electrodes therefor
    • A61B5/263—Bioelectric electrodes therefor characterised by the electrode materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0256—Electrical insulation details, e.g. around high voltage areas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0753—Insulation
    • H05K2201/0769—Anti metal-migration, e.g. avoiding tin whisker growth
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1173—Differences in wettability, e.g. hydrophilic or hydrophobic areas

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Heart & Thoracic Surgery (AREA)
  • Surgery (AREA)
  • Pathology (AREA)
  • Biomedical Technology (AREA)
  • Physics & Mathematics (AREA)
  • Medical Informatics (AREA)
  • Molecular Biology (AREA)
  • Biophysics (AREA)
  • Animal Behavior & Ethology (AREA)
  • General Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Veterinary Medicine (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
JP2021576148A 2020-05-21 2021-05-12 伸縮性配線基板 Active JP7222437B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020088921 2020-05-21
JP2020088921 2020-05-21
PCT/JP2021/017998 WO2021235282A1 (ja) 2020-05-21 2021-05-12 伸縮性配線基板

Publications (3)

Publication Number Publication Date
JPWO2021235282A1 true JPWO2021235282A1 (ja) 2021-11-25
JPWO2021235282A5 JPWO2021235282A5 (ja) 2022-05-12
JP7222437B2 JP7222437B2 (ja) 2023-02-15

Family

ID=78707846

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021576148A Active JP7222437B2 (ja) 2020-05-21 2021-05-12 伸縮性配線基板

Country Status (4)

Country Link
US (1) US12052817B2 (ja)
JP (1) JP7222437B2 (ja)
CN (1) CN114271034B (ja)
WO (1) WO2021235282A1 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023106055A1 (ja) * 2021-12-08 2023-06-15 株式会社村田製作所 伸縮性デバイス
WO2023228798A1 (ja) * 2022-05-26 2023-11-30 株式会社村田製作所 伸縮デバイス
WO2023238754A1 (ja) * 2022-06-08 2023-12-14 株式会社村田製作所 伸縮性デバイス

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02172733A (ja) * 1988-12-27 1990-07-04 Toray Ind Inc プラスチックフィルムと紙との積層品の製造方法
JP2015158840A (ja) * 2014-02-25 2015-09-03 富士フイルム株式会社 タッチパネルおよび導電性フィルムシート
JP2017152687A (ja) * 2016-02-22 2017-08-31 日本メクトロン株式会社 伸縮性配線基板及びその製造方法
JP2018114302A (ja) * 2014-01-28 2018-07-26 日本電信電話株式会社 生体信号検出衣料
US20180303418A1 (en) * 2012-03-30 2018-10-25 The Board Of Trustees Of The University Of Illinois Appendage mountable electronic devices conformable to surfaces
JP2019165048A (ja) * 2018-03-19 2019-09-26 株式会社フジクラ 伸縮性配線板及び伸縮性配線板の製造方法
JP2019220247A (ja) * 2018-06-15 2019-12-26 グンゼ株式会社 端子接続構造及び端子接続方法
JP2020055300A (ja) * 2018-09-27 2020-04-09 信越化学工業株式会社 伸縮性膜及び伸縮性膜の形成方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW430999B (en) * 1998-05-15 2001-04-21 Mirae Corp Contact light emitting device and input device using it
US6316734B1 (en) * 2000-03-07 2001-11-13 3M Innovative Properties Company Flexible circuits with static discharge protection and process for manufacture
JP2003224349A (ja) * 2002-01-29 2003-08-08 Ricoh Microelectronics Co Ltd 基板製造方法
JP2009246250A (ja) * 2008-03-31 2009-10-22 Mitsubishi Electric Corp 薄膜形成方法
KR100999921B1 (ko) * 2008-09-26 2010-12-13 삼성전기주식회사 기판의 이중 표면 처리 방법 및 상기 방법에 의해 표면 처리된 기판
JP2010086814A (ja) * 2008-09-30 2010-04-15 Toshiba Mobile Display Co Ltd 表示装置
CN201398971Y (zh) * 2009-04-20 2010-02-10 湖州艾木奇生物科技咨询服务有限公司 皮下植入式葡萄糖传感器
JP5646433B2 (ja) * 2011-10-31 2014-12-24 日本写真印刷株式会社 導電シート及びその製造方法
JP3177243U (ja) * 2012-05-14 2012-07-26 金鼎聯合科技纖維股▲分▼有限公司 生体信号検知器
US9390858B2 (en) * 2014-04-03 2016-07-12 Murata Manufacturing Co., Ltd. Electronic component, method of manufacturing the same, and mount structure of electronic component
JP6892376B2 (ja) * 2017-02-14 2021-06-23 信越化学工業株式会社 生体電極組成物、生体電極、生体電極の製造方法、及び高分子化合物
CN109384194A (zh) * 2017-08-07 2019-02-26 张家港祥成医用材料科技有限公司 一种电子皮肤非固相生物压力传感器的制备方法
CN107734831B (zh) * 2017-10-13 2019-07-19 百强电子（深圳）有限公司 可穿戴式的伸缩导电布及其制作方法
CN109955785A (zh) * 2017-12-26 2019-07-02 清华大学 疏水镜子以及使用该疏水镜子的汽车
WO2019181931A1 (ja) 2018-03-19 2019-09-26 株式会社フジクラ 伸縮性配線板及び伸縮性配線板の製造方法
JP7006421B2 (ja) 2018-03-20 2022-01-24 ブラザー工業株式会社 画像読取装置
CN209766442U (zh) * 2018-12-13 2019-12-10 北京铂阳顶荣光伏科技有限公司 一种封装结构及太阳能组件

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02172733A (ja) * 1988-12-27 1990-07-04 Toray Ind Inc プラスチックフィルムと紙との積層品の製造方法
US20180303418A1 (en) * 2012-03-30 2018-10-25 The Board Of Trustees Of The University Of Illinois Appendage mountable electronic devices conformable to surfaces
JP2018114302A (ja) * 2014-01-28 2018-07-26 日本電信電話株式会社 生体信号検出衣料
JP2015158840A (ja) * 2014-02-25 2015-09-03 富士フイルム株式会社 タッチパネルおよび導電性フィルムシート
JP2017152687A (ja) * 2016-02-22 2017-08-31 日本メクトロン株式会社 伸縮性配線基板及びその製造方法
JP2019165048A (ja) * 2018-03-19 2019-09-26 株式会社フジクラ 伸縮性配線板及び伸縮性配線板の製造方法
JP2019220247A (ja) * 2018-06-15 2019-12-26 グンゼ株式会社 端子接続構造及び端子接続方法
JP2020055300A (ja) * 2018-09-27 2020-04-09 信越化学工業株式会社 伸縮性膜及び伸縮性膜の形成方法

Also Published As

Publication number Publication date
WO2021235282A1 (ja) 2021-11-25
CN114271034A (zh) 2022-04-01
CN114271034B (zh) 2024-08-30
US12052817B2 (en) 2024-07-30
JP7222437B2 (ja) 2023-02-15
US20220183151A1 (en) 2022-06-09

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