JPWO2021225071A1 - - Google Patents

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Publication number
JPWO2021225071A1
JPWO2021225071A1 JP2022519924A JP2022519924A JPWO2021225071A1 JP WO2021225071 A1 JPWO2021225071 A1 JP WO2021225071A1 JP 2022519924 A JP2022519924 A JP 2022519924A JP 2022519924 A JP2022519924 A JP 2022519924A JP WO2021225071 A1 JPWO2021225071 A1 JP WO2021225071A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022519924A
Other languages
Japanese (ja)
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JP7449373B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
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Publication of JPWO2021225071A1 publication Critical patent/JPWO2021225071A1/ja
Application granted granted Critical
Publication of JP7449373B2 publication Critical patent/JP7449373B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/20Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
    • H10N30/202Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using longitudinal or thickness displacement combined with bending, shear or torsion displacement
    • H10N30/2023Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using longitudinal or thickness displacement combined with bending, shear or torsion displacement having polygonal or rectangular shape
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R17/00Piezoelectric transducers; Electrostrictive transducers
    • H04R17/005Piezoelectric transducers; Electrostrictive transducers using a piezoelectric polymer
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R17/00Piezoelectric transducers; Electrostrictive transducers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/01Manufacture or treatment
    • H10N30/07Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/074Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing
    • H10N30/076Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing by vapour phase deposition
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/101Piezoelectric or electrostrictive devices with electrical and mechanical input and output, e.g. having combined actuator and sensor parts
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/50Piezoelectric or electrostrictive devices having a stacked or multilayer structure
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/50Piezoelectric or electrostrictive devices having a stacked or multilayer structure
    • H10N30/501Piezoelectric or electrostrictive devices having a stacked or multilayer structure having a non-rectangular cross-section in a plane parallel to the stacking direction, e.g. polygonal or trapezoidal in side view
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/50Piezoelectric or electrostrictive devices having a stacked or multilayer structure
    • H10N30/503Piezoelectric or electrostrictive devices having a stacked or multilayer structure having a non-rectangular cross-section in a plane orthogonal to the stacking direction, e.g. polygonal or circular in top view
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/50Piezoelectric or electrostrictive devices having a stacked or multilayer structure
    • H10N30/508Piezoelectric or electrostrictive devices having a stacked or multilayer structure adapted for alleviating internal stress, e.g. cracking control layers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/80Constructional details
    • H10N30/85Piezoelectric or electrostrictive active materials
    • H10N30/852Composite materials, e.g. having 1-3 or 2-2 type connectivity
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/80Constructional details
    • H10N30/87Electrodes or interconnections, e.g. leads or terminals
    • H10N30/871Single-layered electrodes of multilayer piezoelectric or electrostrictive devices, e.g. internal electrodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/80Constructional details
    • H10N30/87Electrodes or interconnections, e.g. leads or terminals
    • H10N30/875Further connection or lead arrangements, e.g. flexible wiring boards, terminal pins
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R7/00Diaphragms for electromechanical transducers; Cones
    • H04R7/02Diaphragms for electromechanical transducers; Cones characterised by the construction
    • H04R7/04Plane diaphragms
    • H04R7/045Plane diaphragms using the distributed mode principle, i.e. whereby the acoustic radiation is emanated from uniformly distributed free bending wave vibration induced in a stiff panel and not from pistonic motion
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/01Manufacture or treatment
    • H10N30/05Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/80Constructional details
    • H10N30/88Mounts; Supports; Enclosures; Casings
    • H10N30/883Additional insulation means preventing electrical, physical or chemical damage, e.g. protective coatings

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Piezo-Electric Transducers For Audible Bands (AREA)
JP2022519924A 2020-05-07 2021-04-19 圧電素子および圧電スピーカー Active JP7449373B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2020082135 2020-05-07
JP2020082135 2020-05-07
JP2021067879 2021-04-13
JP2021067879 2021-04-13
PCT/JP2021/015843 WO2021225071A1 (ja) 2020-05-07 2021-04-19 圧電素子および圧電スピーカー

Publications (2)

Publication Number Publication Date
JPWO2021225071A1 true JPWO2021225071A1 (https=) 2021-11-11
JP7449373B2 JP7449373B2 (ja) 2024-03-13

Family

ID=78467954

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022519924A Active JP7449373B2 (ja) 2020-05-07 2021-04-19 圧電素子および圧電スピーカー

Country Status (7)

Country Link
US (1) US20230096425A1 (https=)
EP (1) EP4149118A4 (https=)
JP (1) JP7449373B2 (https=)
KR (1) KR20220164538A (https=)
CN (1) CN115486095A (https=)
TW (1) TW202143515A (https=)
WO (1) WO2021225071A1 (https=)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7073646B2 (ja) * 2017-07-26 2022-05-24 ヤマハ株式会社 トランスデューサ
KR102799989B1 (ko) * 2020-11-27 2025-04-23 엘지디스플레이 주식회사 진동 장치와, 이를 포함하는 장치 및 차량
JPWO2023042542A1 (https=) * 2021-09-16 2023-03-23
WO2023053750A1 (ja) * 2021-09-28 2023-04-06 富士フイルム株式会社 圧電素子および電気音響変換器
WO2023188929A1 (ja) * 2022-03-30 2023-10-05 富士フイルム株式会社 圧電フィルム、圧電素子、および、電気音響変換器
WO2023188966A1 (ja) * 2022-03-30 2023-10-05 富士フイルム株式会社 圧電フィルム、圧電素子、および、電気音響変換器
WO2024009774A1 (ja) * 2022-07-08 2024-01-11 富士フイルム株式会社 画像表示装置
CN116201835B (zh) * 2022-12-15 2026-02-10 中国航空工业集团公司西安航空计算技术研究所 一种航空电子设备减振结构
CN120604526A (zh) * 2023-02-28 2025-09-05 富士胶片株式会社 层叠压电元件及电声换能器
KR20250160194A (ko) * 2023-03-28 2025-11-11 엔지케이 인슐레이터 엘티디 접합체의 제조 방법
CN116477849B (zh) * 2023-04-10 2024-04-26 之江实验室 一种铁酸铋纳米柱阵列及其制备方法
CN116636873A (zh) * 2023-04-21 2023-08-25 清华大学 一种全纤维的柔性心音传感器及其制备方法
CN117606651B (zh) * 2023-11-23 2024-05-24 哈尔滨工业大学 一种触觉传感器及接触位点的识别方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6181000A (ja) * 1984-09-28 1986-04-24 Toshiba Corp 積層高分子圧電型超音波探触子
JP2004343453A (ja) * 2003-05-15 2004-12-02 Sony Corp 車両用オーディオ装置
JP2014209724A (ja) * 2013-03-29 2014-11-06 富士フイルム株式会社 電気音響変換フィルム
WO2018020887A1 (ja) * 2016-07-27 2018-02-01 富士フイルム株式会社 ピックアップセンサおよび生体センサ

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6054486A (ja) * 1983-09-05 1985-03-28 Toshiba Corp 高分子素子のリ−ド線接続部
JPH07199813A (ja) 1993-12-28 1995-08-04 Dainippon Printing Co Ltd 改ざん防止シール及び改ざん防止通帳
JP4583092B2 (ja) 2004-07-06 2010-11-17 参天製薬株式会社 改ざん防止シール
CN102044625B (zh) * 2009-10-10 2013-07-10 精量电子(深圳)有限公司 一种压电薄膜超声波传感器的电极
KR101628584B1 (ko) 2011-09-30 2016-06-08 후지필름 가부시키가이샤 전기 음향 변환 필름, 플렉시블 디스플레이, 성대 마이크로폰 및 악기용 센서
JP6201583B2 (ja) * 2013-09-30 2017-09-27 株式会社村田製作所 圧電デバイスおよび圧電デバイスの製造方法
JP6199245B2 (ja) 2014-06-30 2017-09-20 富士フイルム株式会社 電気音響変換フィルムおよび電気音響変換フィルムの導通方法
EP3879590A4 (en) * 2018-11-08 2021-12-29 FUJIFILM Corporation Laminated piezoelectric element and electro-acoustic transducer
JPWO2021199800A1 (https=) * 2020-03-30 2021-10-07

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6181000A (ja) * 1984-09-28 1986-04-24 Toshiba Corp 積層高分子圧電型超音波探触子
JP2004343453A (ja) * 2003-05-15 2004-12-02 Sony Corp 車両用オーディオ装置
JP2014209724A (ja) * 2013-03-29 2014-11-06 富士フイルム株式会社 電気音響変換フィルム
WO2018020887A1 (ja) * 2016-07-27 2018-02-01 富士フイルム株式会社 ピックアップセンサおよび生体センサ

Also Published As

Publication number Publication date
JP7449373B2 (ja) 2024-03-13
EP4149118A4 (en) 2023-10-18
EP4149118A1 (en) 2023-03-15
US20230096425A1 (en) 2023-03-30
CN115486095A (zh) 2022-12-16
WO2021225071A1 (ja) 2021-11-11
KR20220164538A (ko) 2022-12-13
TW202143515A (zh) 2021-11-16

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