JPWO2021193092A5 - - Google Patents
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- Publication number
- JPWO2021193092A5 JPWO2021193092A5 JP2022509905A JP2022509905A JPWO2021193092A5 JP WO2021193092 A5 JPWO2021193092 A5 JP WO2021193092A5 JP 2022509905 A JP2022509905 A JP 2022509905A JP 2022509905 A JP2022509905 A JP 2022509905A JP WO2021193092 A5 JPWO2021193092 A5 JP WO2021193092A5
- Authority
- JP
- Japan
- Prior art keywords
- pairs
- opening
- wiring board
- present
- board according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Claims (1)
- 前記信号用パッドは、前記第１開口内にペアで存在する請求項１～４のいずれかに記載の配線基板。
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020053937 | 2020-03-25 | ||
| JP2020053937 | 2020-03-25 | ||
| PCT/JP2021/009763 WO2021193092A1 (ja) | 2020-03-25 | 2021-03-11 | 配線基板 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2021193092A1 JPWO2021193092A1 (ja) | 2021-09-30 |
| JPWO2021193092A5 true JPWO2021193092A5 (ja) | 2022-11-15 |
| JP7391184B2 JP7391184B2 (ja) | 2023-12-04 |
Family
ID=77891978
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022509905A Active JP7391184B2 (ja) | 2020-03-25 | 2021-03-11 | 配線基板 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20230217581A1 (ja) |
| EP (1) | EP4132231A4 (ja) |
| JP (1) | JP7391184B2 (ja) |
| KR (1) | KR20220143068A (ja) |
| CN (1) | CN115299185A (ja) |
| WO (1) | WO2021193092A1 (ja) |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3539331B2 (ja) * | 2000-02-28 | 2004-07-07 | 日本電気株式会社 | 多層プリント配線板 |
| JP4700332B2 (ja) * | 2003-12-05 | 2011-06-15 | イビデン株式会社 | 多層プリント配線板 |
| US20060151869A1 (en) * | 2005-01-10 | 2006-07-13 | Franz Gisin | Printed circuit boards and the like with improved signal integrity for differential signal pairs |
| JP2008218444A (ja) * | 2007-02-28 | 2008-09-18 | Sony Corp | プリント配線基板 |
| TWI443789B (zh) * | 2008-07-04 | 2014-07-01 | Unimicron Technology Corp | 嵌埋有半導體晶片之電路板及其製法 |
| JP5436963B2 (ja) * | 2009-07-21 | 2014-03-05 | 新光電気工業株式会社 | 配線基板及び半導体装置 |
| US9544992B2 (en) * | 2013-01-29 | 2017-01-10 | Fci Americas Technology Llc | PCB having offset differential signal routing |
| WO2016067908A1 (ja) | 2014-10-29 | 2016-05-06 | 株式会社村田製作所 | 無線通信モジュール |
| US10231325B1 (en) * | 2016-12-20 | 2019-03-12 | Juniper Networks, Inc. | Placement of vias in printed circuit board circuits |
| US10396432B2 (en) * | 2017-01-23 | 2019-08-27 | Samsung Electro-Mechanics Co., Ltd. | Antenna-integrated radio frequency module |
| CN108575044B (zh) * | 2017-03-13 | 2023-01-24 | 富士康(昆山)电脑接插件有限公司 | 印刷电路板及其组件 |
| JP2019033586A (ja) * | 2017-08-08 | 2019-02-28 | ルネサスエレクトロニクス株式会社 | 電子装置 |
| US10410683B2 (en) * | 2017-12-14 | 2019-09-10 | Seagate Technology Llc | Tightly coupled differential vias |
| JP7001530B2 (ja) * | 2018-04-16 | 2022-01-19 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
-
2021
- 2021-03-11 JP JP2022509905A patent/JP7391184B2/ja active Active
- 2021-03-11 US US17/913,050 patent/US20230217581A1/en active Pending
- 2021-03-11 CN CN202180022103.6A patent/CN115299185A/zh active Pending
- 2021-03-11 WO PCT/JP2021/009763 patent/WO2021193092A1/ja unknown
- 2021-03-11 EP EP21776416.6A patent/EP4132231A4/en active Pending
- 2021-03-11 KR KR1020227031731A patent/KR20220143068A/ko not_active Application Discontinuation
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